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公开(公告)号：US20170290154A1
公开(公告)日：2017-10-05
申请号：US15089303
申请日：2016-04-01
CPC分类号： H05K1/147 , G06K9/0002 , H01L25/18 , H05K1/0218 , H05K1/181 , H05K3/363 , H05K9/0024 , H05K2201/047 , H05K2201/056 , H05K2201/10159
摘要： Three-dimensional (3-D) volumetric board architectural design provides technical solutions to technical problems facing miniaturization of circuit boards. The 3-D volumetric architecture includes using more of the unused volume in the vertical dimension (e.g., Z-dimension) to increase the utilization of the total circuit board volume. The 3-D volumetric architecture is realized by mounting components on a first PCB and on a second PCB, and inverting and suspending the second PCB above the first PCB. The use of 3-D volumetric board architectural design further enables formation of a shielded FEMIE, providing shielding and improved volumetric use with little or no reduction in system performance or increase in system Z-height.
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公开(公告)号：US20170188461A1
公开(公告)日：2017-06-29
申请号：US14757984
申请日：2015-12-26
申请人： Chee Ling Wong , Wil Choon Song , Khang Choong Yong , Eng Huat Goh , Mohd Muhaiyiddin Bin Abdullah , Tin Poay Chuah
发明人： Chee Ling Wong , Wil Choon Song , Khang Choong Yong , Eng Huat Goh , Mohd Muhaiyiddin Bin Abdullah , Tin Poay Chuah
CPC分类号： H05K1/117 , H05K1/0298 , H05K1/142 , H05K2201/09845
摘要： A system for board-to-board interconnect is described herein. The system includes a first printed circuit board (PCB) having a first recess along a first edge of the first PCB that exposes a first solder pad on a layer of the first PCB. The system also includes a second PCB having a second recess along a second edge of the second PCB that exposes a second solder pad on a layer of the second PCB. The second recess is complementary to the first recess to allow the first PCB to mate with the second PCB. The first solder pad is aligned with the second solder pad when the first PCB is mated with the second PCB. The system additionally includes an assembly configured to electronically couple the first solder pad with the second solder pad.
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3.发明申请公开(公告)号：US20170086298A1
公开(公告)日：2017-03-23
申请号：US14863380
申请日：2015-09-23
申请人： Tin Poay Chuah , Min Suet Lim , Ping Ping Ooi , Eng Huat Goh , See Chin Chow
发明人： Tin Poay Chuah , Min Suet Lim , Ping Ping Ooi , Eng Huat Goh , See Chin Chow
CPC分类号： H05K1/183 , H01L2224/14 , H05K1/0231 , H05K1/113 , H05K1/141 , H05K1/181 , H05K3/4697 , H05K2201/10015 , H05K2201/10159 , H05K2201/10734
摘要： Techniques and mechanisms to provide interconnect structures of a substrate such as a printed circuit board. In an embodiment, a first side of a substrate has disposed thereon a hardware interface contacts to couple the substrate to a packaged IC device. The contacts define a footprint area, where an overlap region of the substrate is defined by a projection of the footprint area from the first side to a second side of the substrate. The substrate forms a recess extending from one of the first side and the second side. In another embodiment, at least part of the recess is within the overlap region, and interconnect structures of the substrate facilitate connection between the packaged IC device and a capacitor disposed at least partially in the recess. Positioning of the capacitor within the overlap region enables improvements in substrate space efficiency, power delivery and/or signal noise.
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公开(公告)号：US09202782B2
公开(公告)日：2015-12-01
申请号：US13735776
申请日：2013-01-07
申请人： Tin Poay Chuah
发明人： Tin Poay Chuah
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/498 , H01L23/538
CPC分类号： H01L21/50 , H01L23/49827 , H01L23/49833 , H01L23/5389 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/73267 , H01L2924/0002 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H05K1/185 , H05K3/30 , H05K3/4644 , H01L2924/00
摘要： An apparatus including a printed circuit board including a body of a plurality of alternating layers of conductive material and insulating material; and a package including a die disposed within the body of the printed circuit board. A method including forming a printed circuit board including a core and a build-up section including alternating layers of conductive material and insulating material coupled to the core; and coupling a package including a die to the core of the printed circuit board such that at least a portion of a sidewall of the package is embedded in at least a portion of the build-up section. An apparatus including a printed circuit board including a body; a computing device including a package including a microprocessor disposed within the body of the printed circuit board; and a peripheral device that provides input or output to the computing device.
摘要翻译： 一种包括印刷电路板的装置，包括导电材料和绝缘材料的多个交替层的主体; 以及包括设置在印刷电路板的主体内的管芯的封装。 一种包括形成印刷电路板的方法，所述印刷电路板包括芯和积层部分，所述堆积部分包括交替的导电材料层和耦合到所述芯的绝缘材料; 以及将包括管芯的封装耦合到所述印刷电路板的芯部，使得所述封装的侧壁的至少一部分嵌入所述堆积部分的至少一部分中。 一种包括本体的印刷电路板的设备; 包括包括布置在印刷电路板的主体内的微处理器的封装的计算设备; 以及向计算设备提供输入或输出的外围设备。
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公开(公告)号：US20140191420A1
公开(公告)日：2014-07-10
申请号：US13735776
申请日：2013-01-07
申请人： Tin Poay Chuah
发明人： Tin Poay Chuah
IPC分类号： H01L23/498 , H01L21/50
CPC分类号： H01L21/50 , H01L23/49827 , H01L23/49833 , H01L23/5389 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/73267 , H01L2924/0002 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H05K1/185 , H05K3/30 , H05K3/4644 , H01L2924/00
摘要： An apparatus including a printed circuit board including a body of a plurality of alternating layers of conductive material and insulating material; and a package including a die disposed within the body of the printed circuit board. A method including forming a printed circuit board including a core and a build-up section including alternating layers of conductive material and insulating material coupled to the core; and coupling a package including a die to the core of the printed circuit board such that at least a portion of a sidewall of the package is embedded in at least a portion of the build-up section. An apparatus including a printed circuit board including a body; a computing device including a package including a microprocessor disposed within the body of the printed circuit board; and a peripheral device that provides input or output to the computing device.
摘要翻译： 一种包括印刷电路板的装置，包括导电材料和绝缘材料的多个交替层的主体; 以及包括设置在印刷电路板的主体内的管芯的封装。 一种包括形成印刷电路板的方法，所述印刷电路板包括芯和积层部分，所述堆积部分包括交替的导电材料层和耦合到所述芯的绝缘材料; 以及将包括管芯的封装耦合到所述印刷电路板的芯部，使得所述封装的侧壁的至少一部分嵌入所述堆积部分的至少一部分中。 一种包括本体的印刷电路板的设备; 包括包括布置在印刷电路板的主体内的微处理器的封装的计算设备; 以及向计算设备提供输入或输出的外围设备。
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