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15 条记录 (耗时 0.029 秒)

    Methods of manufacturing glucose measuring assemblies with hydrogels
    1.
    发明授权
    Methods of manufacturing glucose measuring assemblies with hydrogels 有权
    用水凝胶制造葡萄糖测量组件的方法

    公开(公告)号：US07183068B2

    公开(公告)日：2007-02-27

    申请号：US11060524

    申请日：2005-02-17

    申请人： Kim K. Burson ,  Michelle Van Wyhe ,  Jeffrey Pudlo ,  Michael Reidy ,  Pravin Soni ,  Christopher Uhegbu ,  Prema Vijayakumar

    发明人： Kim K. Burson ,  Michelle Van Wyhe ,  Jeffrey Pudlo ,  Michael Reidy ,  Pravin Soni ,  Christopher Uhegbu ,  Prema Vijayakumar

    IPC分类号： C12Q1/54

    CPC分类号： A61N1/30

    摘要： This invention relates to methods for reducing the presence of a compound in an ionically conductive material, e.g., for use in iontophoretic devices, wherein the presence of the compound interferes with detecting a selected analyte. Removal of the compound can typically take place either during or after the manufacture of the ionically conductive material or an assembly comprising this material. Also disclosed are methods for generating selectively permeable barriers on the reactive faces of electrodes. Further, this invention relates to hydrogels comprising one or more biocides, as well as assemblies containing such hydrogels.

    摘要翻译： 本发明涉及用于减少离子导电材料中化合物的存在的方法，例如用于离子电渗法的装置，其中化合物的存在妨碍检测选定的分析物。 化合物的除去通常可以在离子导电材料制造期间或之后或包含该材料的组合件中进行。 还公开了用于在电极的反应面上产生选择性渗透阻挡层的方法。 此外，本发明涉及包含一种或多种杀生物剂的水凝胶以及含有这种水凝胶的组合物。

    Methods and devices for removing interfering species
    3.
    发明授权
    Methods and devices for removing interfering species 有权
    包含十一碳烯酸酯的水凝胶制剂及其使用方法

    公开(公告)号：US06615078B1

    公开(公告)日：2003-09-02

    申请号：US09556486

    申请日：2000-04-21

    申请人： Kim K. Burson ,  Michelle Van Wyhe ,  Jeffrey Pudlo ,  Michael Reidy ,  Pravin Soni ,  Christopher Uhegbu ,  Prema Vijayakumar

    发明人： Kim K. Burson ,  Michelle Van Wyhe ,  Jeffrey Pudlo ,  Michael Reidy ,  Pravin Soni ,  Christopher Uhegbu ,  Prema Vijayakumar

    IPC分类号： A61N130

    CPC分类号： A61N1/30

    摘要： This invention relates to methods for reducing the presence of a compound in an ionically conductive material, e.g., for use in iontophoretic devices, wherein the presence of the compound interferes with detecting a selected analyte. Removal of the compound can typically take place either during or after the manufacture of the ionically conductive material or an assembly comprising this material. Also disclosed are methods for generating selectively permeable barriers on the reactive faces of electrodes. Further, this invention relates to hydrogels comprising one or more biocides, as well as assemblies containing such hydrogels.

    摘要翻译： 本发明涉及用于减少离子导电材料中化合物的存在的方法，例如用于离子电渗法的装置，其中化合物的存在妨碍检测选定的分析物。 化合物的除去通常可以在离子导电材料制造期间或之后或包含该材料的组合件中进行。 还公开了用于在电极的反应面上产生选择性渗透阻挡层的方法。 此外，本发明涉及包含一种或多种杀生物剂的水凝胶以及含有这种水凝胶的组合物。

    Device for forming a solder connection
    5.
    发明授权
    Device for forming a solder connection 失效
    用于形成焊接连接​​的装置

    公开(公告)号：US4940179A

    公开(公告)日：1990-07-10

    申请号：US368756

    申请日：1989-06-20

    申请人： Pravin Soni

    发明人： Pravin Soni

    IPC分类号： C09J7/02 ,  B29C61/06 ,  H01R4/02 ,  H01R4/72

    CPC分类号： H01R4/723 ,  B29C61/0616 ,  H01R4/02 ,  Y10S174/08

    摘要： A device for connecting two bodies such as wires, and for sealing the connection between them, comprising a heat-shrinkable sleeve, a solder insert and an annular composite adhesive insert which comprises two layers of heat-activatable adhesive material. The viscosity of the radially inner layer is less than that of the outer layer. The device is heated to cause the sleeve to shrink and to cause the solder to fuse to form a connection between the bodies. Flow of the inner, less viscous layer of the adhesive insert is restricted by the outer viscous layer, to minimize contamination of the solder by the material of the inner layer.

    摘要翻译： 用于连接诸如电线的两个主体并用于密封它们之间的连接的装置，包括可热收缩的套筒，焊接插入件和包括两层可热激活的粘合剂材料的环形复合粘合剂插入件。 径向内层的粘度小于外层的粘度。 该装置被加热以使套管收缩并使焊料熔化以形成主体之间的连接。 粘合剂插入件的内部较小粘性层的流动由外部粘性层限制，以通过内层材料最小化焊料的污染。

    Contact for terminating an optical fiber
    6.
    发明授权
    Contact for terminating an optical fiber 失效
    用于端接光纤的接点

    公开(公告)号：US4790622A

    公开(公告)日：1988-12-13

    申请号：US799898

    申请日：1985-11-20

    申请人： Frank H. Levinson ,  Pravin Soni ,  Adam C. Tanous ,  Richard J. McCrae ,  Mark Ostasiuk

    发明人： Frank H. Levinson ,  Pravin Soni ,  Adam C. Tanous ,  Richard J. McCrae ,  Mark Ostasiuk

    IPC分类号： G02B6/36 ,  G02B6/38

    CPC分类号： G02B6/3861 ,  G02B6/382 ,  G02B6/3821 ,  G02B6/3833

    摘要： An optical fiber contact for terminating an optical fiber includes a solid multi-part thermoset mixture in a cavity in a front portion of the contact, an optical fiber being terminated by heating the thermoset so as to cause it to soften and liquify and subsequently inserting an optical fiber through the contact. The thermoset when liquified chemically reacts so as to form an epoxy adhesive which secures the optical fiber within the contact and keeps the optical fiber in place even when subjected to extremely wide temperature variations.

    摘要翻译： 用于端接光纤的光纤接头包括在接触前部的空腔中的固体多部分热固性混合物，光纤通过加热热固性材料而终止，从而使其软化和液化并随后插入 光纤通过接触。 液化后的热固性物质会发生反应，形成环氧树脂粘合剂，将光纤固定在触点内，并将光纤保持在适当的位置，即使经受非常宽的温度变化。

    Heating Units
    7.
    发明申请
    Heating Units 审中-公开
    加热单元

    公开(公告)号：US20100065052A1

    公开(公告)日：2010-03-18

    申请号：US12211247

    申请日：2008-09-16

    申请人： C.V. Krishnamohan Sharma ,  Mingzu Lei ,  Karen Wang ,  Hoi Sze Lau ,  Ron L. Hale ,  Reynaldo Quintana ,  Pravin Soni

    发明人： C.V. Krishnamohan Sharma ,  Mingzu Lei ,  Karen Wang ,  Hoi Sze Lau ,  Ron L. Hale ,  Reynaldo Quintana ,  Pravin Soni

    IPC分类号： A61M15/00 ,  B32B37/06 ,  B32B37/12

    CPC分类号： A61M11/041 ,  A61M11/047 ,  A61M11/048 ,  A61M15/0003 ,  A61M31/00 ,  A61M35/00

    摘要： A heating unit comprises a substrate having a first surface and a second surface. A chemical reactant material capable of undergoing an exothermic reaction is disposed on at least a portion of the first surface of the substrate. An igniter is in proximity with the chemical reactant material. A layer of adhesive material overlays at least a portion of at least one of the chemical reactant material and the first surface of the substrate. Other embodiments of the heating unit include a first and a second substrate, each having first and second surfaces positioned with the first surfaces opposing each other in a sandwich construction. A chemical reactant material is disposed on at least a portion of the first surface of at least one of the substrates. The first and the second substrates are sealed together to define a cavity containing the chemical reactant material and an igniter is provided in proximity with the chemical reactant material.

    摘要翻译： 加热单元包括具有第一表面和第二表面的基底。 能够经受放热反应的化学反应物质被设置在基板的第一表面的至少一部分上。 点火器靠近化学反应物料。 一层粘合剂材料覆盖至少一部分化学反应物质和基材的第一表面的至少一部分。 加热单元的其它实施例包括第一和第二基板，每个基板具有第一和第二表面，其中第一表面和第二表面以夹层结构彼此相对。 化学反应物料设置在至少一个基底的第一表面的至少一部分上。 将第一和第二基板密封在一起以限定包含化学反应物料的空腔，并且靠近化学反应物料提供点火器。

    Thermoplastic fluoropolymer adhesive composition
    8.
    发明授权
    Thermoplastic fluoropolymer adhesive composition 失效
    热塑性氟聚合物粘合剂组合物

    公开(公告)号：US5143761A

    公开(公告)日：1992-09-01

    申请号：US687191

    申请日：1991-04-17

    申请人： Achilles Chiotis ,  Pravin Soni

    发明人： Achilles Chiotis ,  Pravin Soni

    IPC分类号： C08J5/12 ,  B29C61/06 ,  B29C65/48 ,  C09J7/02 ,  C09J127/12 ,  C09J127/16 ,  H01B3/44 ,  H01R4/72

    CPC分类号： H01R4/72 ,  C09J127/12 ,  C09J127/16 ,  Y10S174/08 ,  Y10T428/1328 ,  Y10T428/1331

    摘要： A thermoplastic fluoropolymer adhesive composition containing a thermoplastic fluoropolymer, an elastomeric fluoropolymer, a thermoplastic ethylene copolymer and a tackifier, in which the combined amount of ethylene copolymer and tackifier is less than about 30% by weight (based on the weight of the four components) and the ratio of ethylene copolymer is less than about 2:1, has improved sealing performance and flame resistance than similar compositions containing greater amounts of ethylene copolymer and tackifier. The composition is particularly useful for sealing surfaces of uncrosslinked ethylene-tetrafluoroethylene copolymers.

    摘要翻译： 含有热塑性含氟聚合物，弹性体氟聚合物，热塑性乙烯共聚物和增粘剂的热塑性含氟聚合物粘合剂组合物，其中乙烯共聚物和增粘剂的总量小于约30重量％（基于四个组分的重量） 并且乙烯共聚物的比例小于约2:1，具有比含有更多量的乙烯共聚物和增粘剂的类似组合物更好的密封性能和阻燃性。 该组合物特别可用于密封未交联的乙烯 - 四氟乙烯共聚物的表面。

    Heat-recoverable soldering device
    10.
    发明授权
    Heat-recoverable soldering device 失效
    热回收焊接装置

    公开(公告)号：US5052610A

    公开(公告)日：1991-10-01

    申请号：US565874

    申请日：1990-08-09

    申请人： Robert Guerra ,  Michael Nordling ,  Pravin Soni

    发明人： Robert Guerra ,  Michael Nordling ,  Pravin Soni

    IPC分类号： H01R4/72

    CPC分类号： H01R4/723 ,  Y10S174/08 ,  Y10T403/48

    摘要： Heat recoverable soldering devices comprising a heat recoverable tubular article having at least one open end, and containing a solder insert, is provided with a curable adhesive insert between the solder insert and the open end. The curable adhesive melts, flows and cures when heat is applied to recover the article. The adhesive cures such that its viscosity increases to a value of at least 1.5 its initial viscosity during recovery of the article. Curing of the adhesive inhibits flow of the adhesive through the open end of the article and/or into the solder connection formed between two (or more) elongate bodies inserted into the article.

    摘要翻译： 包括具有至少一个开口端并且包含焊料插入件的可热回收管状制品的可回收焊接装置在焊料插入件和开口端之间设置有可固化的粘合剂插入物。 当施加热量时，可固化的粘合剂熔化，流动和固化以回收物品。 粘合剂固化使得其粘度在回收制品期间增加至至少为其初始粘度的值。 粘合剂的固化阻止粘合剂流过制品的开口端和/或阻止在插入到制品中的两个（或多个）细长体之间形成的焊料连接。