公开(公告)号：US08264469B2

公开(公告)日：2012-09-11

申请号：US12506665

申请日：2009-07-21

申请人： Kiyohiro Kimura ,  Kazuhiro Miura ,  Harutoshi Oikawa ,  Osamu Sugawara ,  Toshinori Kadowaki

发明人： Kiyohiro Kimura ,  Kazuhiro Miura ,  Harutoshi Oikawa ,  Osamu Sugawara ,  Toshinori Kadowaki

IPC分类号： G06F3/041

CPC分类号： G06F3/044 ,  G06F3/045 ,  H05K3/361 ,  H05K2203/1572

摘要： A touch panel capable of decreasing concavity and convexity generated on the surface and a display unit including the same are provided. The touch panel includes: a first spacer layer on both side faces of a first wiring layer provided on a first transparent substrate; and a second wiring layer on both side faces of a second wiring layer provided on a second transparent substrate. The touch panel also includes a flexible printed circuit board in a gap between the first transparent substrate and the second transparent substrate and in a region including at least part of a region not provided with the adhesion layer in the region opposed to the first wiring layer, the second wiring layer, the first spacer layer, and the second spacer layer.

摘要翻译： 提供能够减小表面上产生的凹凸的触摸面板和包括该触摸面板的显示单元。 触摸面板包括：设置在第一透明基板上的第一布线层的两个侧面上的第一间隔层; 以及设置在第二透明基板上的第二布线层的两个侧面上的第二布线层。 触摸面板还包括在第一透明基板和第二透明基板之间的间隙中的柔性印刷电路板，并且在与第一布线层相对的区域中包括至少部分未设置有粘合层的区域的区域中， 第二布线层，第一间隔层和第二间隔层。

公开(公告)号：US20100026648A1

公开(公告)日：2010-02-04

申请号：US12506665

申请日：2009-07-21

申请人： Kiyohiro Kimura ,  Kazuhiro Miura ,  Harutoshi Oikawa ,  Osamu Sugawara ,  Toshinori Kadowaki

发明人： Kiyohiro Kimura ,  Kazuhiro Miura ,  Harutoshi Oikawa ,  Osamu Sugawara ,  Toshinori Kadowaki

IPC分类号： G06F3/041

CPC分类号： G06F3/044 ,  G06F3/045 ,  H05K3/361 ,  H05K2203/1572

摘要： A touch panel capable of decreasing concavity and convexity generated on the surface and a display unit including the same are provided. The touch panel includes: a first spacer layer on both side faces of a first wiring layer provided on a first transparent substrate; and a second wiring layer on both side faces of a second wiring layer provided on a second transparent substrate. The touch panel also includes a flexible printed circuit board in a gap between the first transparent substrate and the second transparent substrate and in a region including at least part of a region not provided with the adhesion layer in the region opposed to the first wiring layer, the second wiring layer, the first spacer layer, and the second spacer layer.

摘要翻译： 提供能够减小表面上产生的凹凸的触摸面板和包括该触摸面板的显示单元。 触摸面板包括：设置在第一透明基板上的第一布线层的两个侧面上的第一间隔层; 以及设置在第二透明基板上的第二布线层的两个侧面上的第二布线层。 触摸面板还包括在第一透明基板和第二透明基板之间的间隙中的柔性印刷电路板，并且在与第一布线层相对的区域中包括至少部分未设置有粘合层的区域的区域中， 第二布线层，第一间隔层和第二间隔层。

公开(公告)号：US09007330B2

公开(公告)日：2015-04-14

申请号：US12596718

申请日：2009-01-29

申请人： Kiyohiro Kimura ,  Kazuhiro Miura

发明人： Kiyohiro Kimura ,  Kazuhiro Miura

IPC分类号： G06F3/045

CPC分类号： G06F3/045 ,  Y10T29/49117

摘要： A touch panel and a method of producing the touch panel are provided in which a touch panel having a gap between two transparent substrates that is uniform in a plane can stably be obtained by setting a gap between the two transparent substrates in an area where a wiring substrate is disposed to a desired gap. A touch panel includes a pair of transparent substrates opposed to and away from each other and connection terminals provided on at least one of opposed surfaces of the pair of transparent substrates. A wiring substrate that is disposed between the pair of transparent substrates and has one surface electrically connected to the connection terminals and the other surface disposed away from one of the transparent substrates opposed to the other transparent substrate on which the connection terminals are provided. An insulating layer provided in a gap between the pair of transparent substrates in an area where the wiring substrate is disposed in a state where the wiring substrate and the connection terminals are connected.

摘要翻译： 提供一种触摸面板和制造触摸面板的方法，其中通过在两个透明基板之间设置间隙，可以稳定地获得具有在平面中均匀的两个透明基板之间的间隙的触摸面板 衬底被设置到期望的间隙。 触摸面板包括彼此相对且远离的一对透明基板和设置在该对透明基板的至少一个相对表面上的连接端子。 布线基板，其布置在所述一对透明基板之间，并且具有与连接端子电连接的一个表面和远离设置有连接端子的另一透明基板相对的透明基板之一的另一表面。 在配线基板和连接端子连接的状态下，在配线基板的配置区域中设置在一对透明基板的间隙中的绝缘层。

公开(公告)号：US20100128001A1

公开(公告)日：2010-05-27

申请号：US12596718

申请日：2009-01-29

申请人： Kiyohiro Kimura ,  Kazuhiro Miura

发明人： Kiyohiro Kimura ,  Kazuhiro Miura

IPC分类号： G06F3/045 ,  H01R43/00

CPC分类号： G06F3/045 ,  Y10T29/49117

摘要： A touch panel and a method of producing the touch panel are provided in which a touch panel having a gap between two transparent substrates that is uniform in a plane can stably be obtained by setting a gap between the two transparent substrates in an area where a wiring substrate is disposed to a desired gap. A touch panel includes a pair of transparent substrates opposed to and away from each other and connection terminals provided on at least one of opposed surfaces of the pair of transparent substrates. A wiring substrate that is disposed between the pair of transparent substrates and has one surface electrically connected to the connection terminals and the other surface disposed away from one of the transparent substrates opposed to the other transparent substrate on which the connection terminals are provided. An insulating layer provided in a gap between the pair of transparent substrates in an area where the wiring substrate is disposed in a state where the wiring substrate and the connection terminals are connected.

摘要翻译： 提供一种触摸面板和制造触摸面板的方法，其中通过在两个透明基板之间设置间隙，可以稳定地获得具有在平面中均匀的两个透明基板之间的间隙的触摸面板 衬底被设置到期望的间隙。 触摸面板包括彼此相对且远离的一对透明基板和设置在该对透明基板的至少一个相对表面上的连接端子。 布线基板，其布置在所述一对透明基板之间，并且具有与连接端子电连接的一个表面和远离设置有连接端子的另一透明基板相对的透明基板之一的另一表面。 在配线基板和连接端子连接的状态下，在配线基板的配置区域中设置在一对透明基板的间隙中的绝缘层。

公开(公告)号：US20130335189A1

公开(公告)日：2013-12-19

申请号：US13985473

申请日：2012-04-16

申请人： Yuuichi Abe ,  Kenji Oka ,  Fuyuki Abe ,  Kazuhiro Miura ,  Mikinori Amisawa ,  Atsumi Miyakawa ,  Takahiro Senshu ,  Yuji Yamagishi ,  Jun Ootsuki

发明人： Yuuichi Abe ,  Kenji Oka ,  Fuyuki Abe ,  Kazuhiro Miura ,  Mikinori Amisawa ,  Atsumi Miyakawa ,  Takahiro Senshu ,  Yuji Yamagishi ,  Jun Ootsuki

IPC分类号： H02H9/04 ,  H01C17/30

CPC分类号： H02H9/04 ,  H01C1/014 ,  H01C7/1006 ,  H01C7/102 ,  H01C7/112 ,  H01C17/30 ,  Y10T29/49082

摘要： An electrostatic discharge (ESD) protector includes a first high heat-conductive substrate, a second high heat-conductive substrate, a varistor layer, and a plurality of via-hole electrodes. The first high heat-conductive substrate is provided with a plurality of first through-holes. The second high heat-conductive substrate is provided with a plurality of second through-holes. The varistor layer that is mainly composed of zinc oxide is disposed between the first high heat-conductive substrate and the second high heat-conductive substrate. The varistor layer includes internal electrodes. Each of via-hole electrodes penetrates the varistor layer and fills both one of the first through-holes and one of the second through-holes to couple both the ones to each other.

摘要翻译： 静电放电（ESD）保护器包括第一高导热衬底，第二高导热衬底，变阻器层和多个通孔电极。 第一高导热基板设置有多个第一通孔。 第二高导热基板设置有多个第二通孔。 主要由氧化锌构成的变阻器层配置在第一高导热性基板和第二高导热性基板之间。 压敏电阻层包括内部电极。 每个通孔电极穿透压敏电阻层，并且填充第一通孔和第二通孔中的一个，以将两者彼此连接。

公开(公告)号：US5662755A

公开(公告)日：1997-09-02

申请号：US526312

申请日：1995-09-11

申请人： Kazuhiro Miura ,  Yoshihiro Bessho ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Minehiro Itagaki ,  Yoshifumi Nakamura ,  Akihiko Miyoshi

发明人： Kazuhiro Miura ,  Yoshihiro Bessho ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Minehiro Itagaki ,  Yoshifumi Nakamura ,  Akihiko Miyoshi

IPC分类号： H01L21/48 ,  H01L23/15 ,  H05K3/24 ,  B32B31/26 ,  B32B31/12

CPC分类号： H05K3/248 ,  H01L21/4857 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K2203/308 ,  H05K3/4629 ,  Y10T29/49163

摘要： A method of making a multi-layered ceramic substrate which includes the steps of laminating a desired number of green sheets each being made of glass ceramics containing at least an organic binder and a solvent and each having a pattern of electrodes formed thereon by the use of an electroconductive paste, to thereby provide a green sheet laminate, The electrodes on opposite surfaces or an entire surface layer of the green sheet laminate are subsequently printed with a paste comprising an inorganic component added with at least an organic binder containing a Zn composition. On each surface of the laminate printed with the paste of the Zn composition, a green sheet made of an inorganic composition incapable of being sintered at a temperature of crystallization of the glass ceramics is then laminated thereby providing a laminate plate which is subsequently fired. After the firing, both of the inorganic composition incapable of firing sintered and the Zn composition are removed from the opposite surfaces of the laminate. The paste of the Zn composition may contains a main component selected from the group consisting of Zn, ZnO, Zn(OH).sub.2, ZnAl.sub.2 O.sub.4, and ZnCO.sub.3.

摘要翻译： 一种制造多层陶瓷基板的方法，其包括以下步骤：将所需数量的生坯片材层叠，所述生坯片材由至少含有有机粘合剂和溶剂的玻璃陶瓷制成，并且各自具有通过使用 导电糊，从而提供生片层压体。随后用包含添加至少含有Zn组合物的有机粘合剂的无机组分的糊料印刷相对表面上的电极或生片层压体的整个表面层。 在印有Zn组合物的糊料的层压板的每个表面上，将由玻璃陶瓷的结晶温度下不能烧结的无机组合物制成的生片层叠，从而提供随后烧制的层压板。 烧成后，从层叠体的相对面除去无法烧成的无机组合物和Zn组合物。 Zn组合物的糊剂可以含有选自Zn，ZnO，Zn（OH）2，ZnAl 2 O 4和ZnCO 3的主要成分。

公开(公告)号：US6141847A

公开(公告)日：2000-11-07

申请号：US997164

申请日：1997-12-23

申请人： Masayuki Mizuno ,  Masaaki Hayama ,  Kazuhiro Miura ,  Noboru Mori ,  Akira Hashimoto ,  Mitsuteru Yamada

发明人： Masayuki Mizuno ,  Masaaki Hayama ,  Kazuhiro Miura ,  Noboru Mori ,  Akira Hashimoto ,  Mitsuteru Yamada

IPC分类号： H01G4/40 ,  H01G7/00

CPC分类号： H01G4/40 ,  Y10T29/435 ,  Y10T29/4902

摘要： A ceramic substrate 1 made of magnetic substance on which an inductor 2 is formed is prepared. A ceramic substrate 3 made of dielectric substance on which a capacitor 4 is formed is also prepared. An intermediate layer 5 made of lass paste is printed on the inductor 2 and the capacitor 4. After debinding the substrates 1 and 3 independently, both the substrates are filed with the intermediate layer 5 therebetween so that both the substrates may be glued and integrated. As such, because the debinding process is provided before filing, less gas is generated in firing, and as a result, voids are restrained from occurring.

摘要翻译： 制备由其上形成有电感器2的磁性物质制成的陶瓷基板1。 还制备了由其上形成有电容器4的介电材料制成的陶瓷基板3。 在电感器2和电容器4上印刷由轻质糊料制成的中间层5.在独立地剥离基板1和3之后，两个基板之间留有中间层5，使得两个基板可以胶合并整合。 因此，因为脱脂处理在提交之前提供，所以在烧制中产生较少的气体，结果，抑制了空隙的发生。

公开(公告)号：US5688441A

公开(公告)日：1997-11-18

申请号：US581352

申请日：1995-12-26

申请人： Minehiro Itagaki ,  Yoshihiro Bessho ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Kazuhiro Miura ,  Kazuyuki Okano

发明人： Minehiro Itagaki ,  Yoshihiro Bessho ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Kazuhiro Miura ,  Kazuyuki Okano

IPC分类号： C04B41/88 ,  H01B1/16 ,  H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K3/46 ,  H01B1/22

CPC分类号： H01L23/49883 ,  H01L21/486 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092

摘要： A conductive paste includes inorganic material powders containing conductive powders and glass powders, an organic vehicle containing an organic binder and an organic solvent, and a metal organic compound.

摘要翻译： 导电浆料包括含有导电粉末和玻璃粉末的无机材料粉末，含有机粘合剂和有机溶剂的有机载体和金属有机化合物。

公开(公告)号：US5496619A

公开(公告)日：1996-03-05

申请号：US254414

申请日：1994-06-06

申请人： Minehiro Itagaki ,  Kazuyuki Okano ,  Suzushi Kimura ,  Seiichi Nakatani ,  Yoshihiro Bessho ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Kazuhiro Miura

发明人： Minehiro Itagaki ,  Kazuyuki Okano ,  Suzushi Kimura ,  Seiichi Nakatani ,  Yoshihiro Bessho ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Kazuhiro Miura

IPC分类号： H01L23/498 ,  B32B15/04 ,  B32B17/06 ,  H01B1/16 ,  H01L21/4763

CPC分类号： H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S428/901 ,  Y10T428/24917

摘要： Conductive paste for via connection of a multilayer ceramic substrate, comprising: an inorganic component which consists of 30.0 to 70.0% by weight of powder of conductive material and the remainder being one of glass powder having a softening point higher than a starting point of sintering of insulating material and crystalline glass ceramic powder having a glass transition point higher than the starting point of sintering of the insulating material; and an organics vehicle component which consists of at least organic binder and solvent.

摘要翻译： 用于多层陶瓷基板的通孔连接的导电浆料，其包含：无机成分，其由导电材料粉末的30.0〜70.0重量％组成，其余为软化点高于烧结起始点的玻璃粉末之一 绝缘材料和晶体玻璃陶瓷粉末，其玻璃化转变点高于绝缘材料的烧结起点; 以及由至少有机粘合剂和溶剂组成的有机物载体组分。

公开(公告)号：US5407473A

公开(公告)日：1995-04-18

申请号：US174807

申请日：1993-12-29

申请人： Kazuhiro Miura ,  Yoshihiro Bessho ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Minehiro Itagaki ,  Yoshifumi Nakamura ,  Akihiko Miyoshi

发明人： Kazuhiro Miura ,  Yoshihiro Bessho ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Minehiro Itagaki ,  Yoshifumi Nakamura ,  Akihiko Miyoshi

IPC分类号： H01B1/14 ,  H01L23/498 ,  H05K1/09 ,  C09D11/02

CPC分类号： H01B1/14 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092

摘要： Conductive ink has an inorganic compound comprising 70.0-95.0 wt. % of CuO which is conductive and 5.0-30.0 wt. % of inorganic binder mixed with each other, and solvent and organic binder in which the inorganic compound is dispersed. The inorganic binder consists of lead borosilicate crystalline glass or aluminum borosilicate crystalline glass soften and crystallizes at 850.degree.-950.degree. C. The diameter of CuO powder of the inorganic compound is 100-7.0 .mu.m. The diameter of the lead borosilicate crystalline glass powder or the aluminum borosilicate crystalline glass powder of the inorganic compound is 1.0-5.0 .mu.m. The organic binder consists of ethyl cellulose or copolymer of polyisobytylmethacrylate and poly.alpha.-methylstyrene. The conductive ink contains the organic binder at 0.5-2.0 wt. %.

摘要翻译： 导电油墨具有70.0-95.0重量％的无机化合物。 导电的CuO％和5.0-30.0wt。 相互混合的无机粘合剂的％，以及其中分散无机化合物的溶剂和有机粘合剂。 无机粘合剂由硼硅酸铅晶体玻璃或硼硅酸铝晶体玻璃软化并在850-950℃下结晶。无机化合物的CuO粉末的直径为100-7.0μm。 硼硅酸铅晶体玻璃粉末或无机化合物的硼硅酸铝结晶玻璃粉末的直径为1.0-5.0μm。 有机粘合剂由乙基纤维素或聚甲基丙烯酸异丁酯和聚α-甲基苯乙烯的共聚物组成。 导电油墨含有0.5-2.0重量％的有机粘合剂。 ％。