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    Method of manufacturing composite electronic component
    1.
    发明授权
    Method of manufacturing composite electronic component 失效
    复合电子元器件制造方法

    公开(公告)号：US6141847A

    公开(公告)日：2000-11-07

    申请号：US997164

    申请日：1997-12-23

    申请人： Masayuki Mizuno ,  Masaaki Hayama ,  Kazuhiro Miura ,  Noboru Mori ,  Akira Hashimoto ,  Mitsuteru Yamada

    发明人： Masayuki Mizuno ,  Masaaki Hayama ,  Kazuhiro Miura ,  Noboru Mori ,  Akira Hashimoto ,  Mitsuteru Yamada

    IPC分类号： H01G4/40 ,  H01G7/00

    CPC分类号： H01G4/40 ,  Y10T29/435 ,  Y10T29/4902

    摘要： A ceramic substrate 1 made of magnetic substance on which an inductor 2 is formed is prepared. A ceramic substrate 3 made of dielectric substance on which a capacitor 4 is formed is also prepared. An intermediate layer 5 made of lass paste is printed on the inductor 2 and the capacitor 4. After debinding the substrates 1 and 3 independently, both the substrates are filed with the intermediate layer 5 therebetween so that both the substrates may be glued and integrated. As such, because the debinding process is provided before filing, less gas is generated in firing, and as a result, voids are restrained from occurring.

    摘要翻译： 制备由其上形成有电感器2的磁性物质制成的陶瓷基板1。 还制备了由其上形成有电容器4的介电材料制成的陶瓷基板3。 在电感器2和电容器4上印刷由轻质糊料制成的中间层5.在独立地剥离基板1和3之后，两个基板之间留有中间层5，使得两个基板可以胶合并整合。 因此，因为脱脂处理在提交之前提供，所以在烧制中产生较少的气体，结果，抑制了空隙的发生。

    Conductive paste
    2.
    发明授权
    Conductive paste 失效
    导电胶

    公开(公告)号：US06372158B1

    公开(公告)日：2002-04-16

    申请号：US09696687

    申请日：2000-10-26

    申请人： Akira Hashimoto ,  Takeo Yasuho ,  Masaaki Hayama ,  Kazuhiro Miura

    发明人： Akira Hashimoto ,  Takeo Yasuho ,  Masaaki Hayama ,  Kazuhiro Miura

    IPC分类号： H01B122

    CPC分类号： H05K1/092 ,  H01B1/22

    摘要： A paste of the present invention comprises a precious metal organic acid salt added to precious metal powder as a precious metal component of the conductive paste. The base metal organic acid salts are also used instead of base metal components in the inorganic binders to exclude particles with larger diameters from the conductive paste. The conductive paste of the present invention allows the lumps in the paste caused by the insufficient dispersion to be 10 &mgr;m &PHgr; or less, thereby remarkably reducing the screen blockage during screen printing of wiring pattern of 100 &mgr;m or less in width.

    摘要翻译： 本发明的糊剂包含贵金属有机酸盐，作为导电浆料的贵金属成分添加到贵金属粉末中。 也可以使用贱金属有机酸盐代替无机粘合剂中的贱金属成分，以从导电糊中排除具有较大直径的颗粒。 本发明的导电性糊料使由分散不充分引起的糊状物块为10μm＆amp; PHgr; 以下，在丝网印刷期间显着降低宽度为100μm以下的布线图案的屏幕堵塞。

    Method of manufacturing multilayer ceramic wiring board and conductive paste for use
    3.
    发明授权
    Method of manufacturing multilayer ceramic wiring board and conductive paste for use 失效
    制造多层陶瓷布线板和使用的导电浆料的方法

    公开(公告)号：US06846375B2

    公开(公告)日：2005-01-25

    申请号：US09979018

    申请日：2001-03-15

    申请人： Masaaki Hayama ,  Kazuhiro Miura ,  Akira Hashimoto ,  Takeo Yasuho

    发明人： Masaaki Hayama ,  Kazuhiro Miura ,  Akira Hashimoto ,  Takeo Yasuho

    IPC分类号： H01L21/48 ,  H05K3/46 ,  B32B31/26

    CPC分类号： H01L21/4857 ,  H01L21/4867 ,  H05K3/4664

    摘要： The present invention provides a method of manufacturing a low-temperature sintering multilayer ceramic wiring board comprising the steps of: forming a wiring layer by printing conductive paste (4) on an unfired green sheet (1); forming a laminate by laminating, on at least one side of a ceramic substrate, the unfired green sheet having the wiring layer; and firing the laminate. The present invention also provides paste for use with this method. In the firing step, after an adhesive layer (8) or binder resin in said green sheet used for lamination burns, glass ceramic in the green sheet starts to sinter, and upon or after the start of sintering of the glass ceramic, conductive particles in the conductive paste starts to sinter. This manufacturing method can provide an precise wiring board without pattern deformation and also provide a low-temperature ceramic multilayer wiring board that has no cracks in the glass ceramic on the periphery of electrodes and has electrodes of a dense film structure.

    摘要翻译： 本发明提供一种制造低温烧结多层陶瓷布线板的方法，包括以下步骤：通过在未烧成的生片（1）上印刷导电浆料（4）形成布线层; 在陶瓷基板的至少一侧层叠具有布线层的未烧成的生片，形成层叠体; 并烧制层压板。 本发明还提供了用于该方法的糊剂。 在烧成工序中，在用于层压燃烧的所述生片中的粘合剂层（8）或粘合剂树脂后，生片中的玻璃陶瓷开始烧结，玻璃陶瓷的烧结开始或之后，导电粒子 导电膏开始烧结。 该制造方法可以提供没有图案变形的精确布线板，并且还提供在电极周边的玻璃陶瓷中没有裂纹并且具有致密膜结构的电极的低温陶瓷多层布线板。

    Method of manufacturing ceramic substrate
    4.
    发明授权
    Method of manufacturing ceramic substrate 有权
    制造陶瓷基板的方法

    公开(公告)号：US06374733B1

    公开(公告)日：2002-04-23

    申请号：US09601776

    申请日：2000-09-25

    申请人： Masaaki Hayama ,  Noboru Mouri ,  Hayami Matsunaga ,  Masayuki Mizuno ,  Eiji Kawamoto ,  Yuji Yagi

    发明人： Masaaki Hayama ,  Noboru Mouri ,  Hayami Matsunaga ,  Masayuki Mizuno ,  Eiji Kawamoto ,  Yuji Yagi

    IPC分类号： B41M110

    CPC分类号： H05K3/4647 ,  H01L21/4867 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/207 ,  H05K3/4053 ,  H05K3/4061 ,  H05K3/4605 ,  H05K3/4667 ,  H05K2203/0113 ,  H05K2203/0139

    摘要： The present invention relates to a manufacturing method of a ceramic substrate used in various electronic appliances, and more particularly to a manufacturing method of a ceramic substrate forming a conductor pattern by intaglio printing. A conductive paste is supplied in the intaglio by using any one of screen mask, metal mask, or drawing device, and therefore the conductive paste can be supplied uniformly in desired positions only. The supplying amount of the conductive paste can be adjusted by repeating printing, so that an optimum amount can be set depending on the pattern. As a result, a fine wiring pattern of thick film can be easily formed, and a ceramic circuit board low in wiring resistance, high in wiring density, and high in dimensional precision of wiring pattern can be obtained.

    摘要翻译： 本发明涉及用于各种电子设备的陶瓷基板的制造方法，更具体地说，涉及通过凹版印刷形成导体图案的陶瓷基板的制造方法。 通过使用屏幕掩模，金属掩模或拉制装置中的任何一个，在凹版中提供导电膏，因此导电浆可以均匀地供给到期望的位置。 可以通过重复印刷来调整导电浆料的供给量，从而可以根据图案设定最佳量。 结果，可以容易地形成厚膜的精细布线图案，并且可以获得布线电阻低，布线密度高，布线图形尺寸精度高的陶瓷电路板。

    Method of manufacturing electronic components using intaglio plate having dual releasing layers
    5.
    发明授权
    Method of manufacturing electronic components using intaglio plate having dual releasing layers 失效
    使用具有双重释放层的凹版印刷电路板制造方法

    公开(公告)号：US06347584B1

    公开(公告)日：2002-02-19

    申请号：US09589346

    申请日：2000-06-08

    申请人： Eiji Kawamoto ,  Kazuhiro Miura ,  Masaaki Hayama ,  Yoshihisa Takase

    发明人： Eiji Kawamoto ,  Kazuhiro Miura ,  Masaaki Hayama ,  Yoshihisa Takase

    IPC分类号： B41N106

    CPC分类号： B41N1/06 ,  B41M1/10 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/0393 ,  H05K3/207 ,  H05K2203/0113

    摘要： A method of manufacturing electronic components using intaglio transfer printing for improving printing yield. Intaglio 1 having a dual releasing layer structure is used. In this structure, first releasing layer 2 is formed on the surface of intaglio 1 by chemical absorption, and second releasing layer 3 is formed on the first releasing layer by physical adsorption. This structure allows intaglio 1 to have stable releasing ability, thereby improving the printing yield. In addition, because second releasing layer 3 can be added as required, the printing yield is not decreased even when the intaglio is repeatedly used for printing. Furthermore, the dual releasing layer structure can improve durability of the releasing ability of intaglio 1. As a result, patterns for electronic components can be formed on substrates at an excellent yield.

    摘要翻译： 使用凹版印刷制造电子元件以提高印刷产量的方法。 使用具有双重释放层结构的凹版1。 在这种结构中，通过化学吸收在凹版1的表面上形成第一释放层2，通过物理吸附在第一释放层上形成第二释放层3。 这种结构使得凹版印刷机1具有稳定的剥离能力，从而提高印刷产率。 此外，由于可以根据需要添加第二释放层3，所以即使在重复使用凹版印刷的情况下也不会降低打印质量。 此外，双释放层结构可以提高凹版印刷版1的释放能力的耐久性。结果，可以以优异的成品率在基板上形成电子部件的图案。

    Manufacturing method of wiring board, and conductive paste used therein
    7.
    发明授权
    Manufacturing method of wiring board, and conductive paste used therein 失效
    接线板的制造方法及其中使用的导电糊

    公开(公告)号：US06514364B2

    公开(公告)日：2003-02-04

    申请号：US09459778

    申请日：1999-12-13

    申请人： Kazuhiro Miura ,  Yoshihisa Takase ,  Masaaki Hayama ,  Eiji Kawamoto ,  Yuji Yagi

    发明人： Kazuhiro Miura ,  Yoshihisa Takase ,  Masaaki Hayama ,  Eiji Kawamoto ,  Yuji Yagi

    IPC分类号： B32B3112

    CPC分类号： H05K3/207 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/386 ,  H05K3/4647 ,  H05K2203/0113

    摘要： The conductive particles can be sintered without being influenced by softening and removing of the adhesive layer. As a result, a wiring pattern of high precision can be formed without causing deformation of conductive pattern. It includes a step of filling grooves having a wiring pattern on a film with a conductive paste containing conductive component and resins, a step of adhering the conductive paste side surface of the film having the conductive paste to the adhesive layer side surface of the ceramic substrate having the adhesive layer, a step of forming a conductive pattern on the adhesive layer surface by peeling off the film substrate from a first laminated body having the film, conductive paste, adhesive layer, ceramic substrate, and film, and transferring the conductive paste filling up the grooves onto the surface of the adhesive layer, and a step of firing a second laminated body having the ceramic substrate, adhesive layer and conductive pattern, removing the adhesive layer, and sintering the conductive particles, in which the conductive component in the conductive paste is sintered at least (i) after the adhesive layer is softened, or (ii) after the adhesive layer is burnt.

    摘要翻译： 导电粒子可以不受粘合剂层的软化和去除的影响而被烧结。 结果，可以形成高精度的布线图案，而不会导致导电图案的变形。 其包括在膜上填充具有导电性成分和树脂的导电膏的布线图案的槽的步骤，将具有导电性浆料的膜的导电性糊料侧表面粘接到陶瓷基板的粘合剂层侧面的工序 具有粘合剂层的步骤，通过从具有膜，导电浆料，粘合剂层，陶瓷基板和膜的第一层压体剥离薄膜基材，在粘合剂层表面上形成导电图案的步骤，并且将导电浆料填充物 将凹槽放置在粘合剂层的表面上，以及烧制具有陶瓷基板，粘合剂层和导电图案的第二层压体的步骤，去除粘合剂层并烧结导电颗粒，其中导电 糊剂至少（i）在粘合剂层软化之后烧结，或（ii）在粘合剂层被燃烧之后。

    Electronic part fabricated by intaglio printing and a method for fabricating the same
    10.
    发明授权
    Electronic part fabricated by intaglio printing and a method for fabricating the same 有权
    通过凹版印刷制造的电子部件及其制造方法

    公开(公告)号：US06378424B1

    公开(公告)日：2002-04-30

    申请号：US09539169

    申请日：2000-03-29

    申请人： Masaaki Hayama ,  Noboru Mohri ,  Keiichi Nakao

    发明人： Masaaki Hayama ,  Noboru Mohri ,  Keiichi Nakao

    IPC分类号： B41M110

    CPC分类号： B82Y30/00 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/165 ,  H05K3/207 ,  H05K3/4667 ,  H05K3/4685 ,  H05K2203/0113 ,  Y10T156/1064

    摘要： A method of fabricating electronic parts is provided which is capable of forming fine patterns with high accuracy as well as easily fabricating a multilayered structure of a conductor pattern with high performance. The disclosed method includes the steps of forming a pattern on a surface of a flexible resin sheet by laser process, and then forming a release layer on the surface of the thus obtained pattern, thereby forming an intaglio plate. Next, the intaglio plate is filled with Ag paste, dried and laminated onto an insulating substrate, on which a thermoplastic resin layer is formed. Thereafter, the intaglio plate is peeled from the substrate so that the pattern of the paste is transferred thereon, and a conductor pattern is formed. Further, an insulating layer is formed to cover the conductor pattern and another conductor pattern is formed on the insulating layer, thereby forming a multilayered structure.

    摘要翻译： 提供一种制造电子部件的方法，其能够以高精度形成精细图案以及容易地制造具有高性能的导体图案的多层结构。 所公开的方法包括以下步骤：通过激光工艺在柔性树脂片的表面上形成图案，然后在如此获得的图案的表面上形成剥离层，从而形成凹版。 接下来，将凹版板填充Ag膏，干燥并层压到形成有热塑性树脂层的绝缘基板上。 此后，将凹版从基板剥离，使糊状图案转印到其上，形成导体图形。 此外，形成绝缘层以覆盖导体图案，并且在绝缘层上形成另一导体图案，从而形成多层结构。