Semiconductor apparatus having elevated source and drain structure and manufacturing method therefor
    1.
    发明授权
    Semiconductor apparatus having elevated source and drain structure and manufacturing method therefor 有权
    具有升高的源极和漏极结构的半导体器件及其制造方法

    公开(公告)号:US06232641B1

    公开(公告)日:2001-05-15

    申请号:US09321846

    申请日:1999-05-28

    IPC分类号: H01L31119

    CPC分类号: H01L29/66628 H01L29/66545

    摘要: A semiconductor apparatus on which a MOS transistor having an elevated source and drain structure is formed is arranged to have a gate electrode which is formed on the surface of a silicon substrate through an insulating film. An elevated source film and an elevated drain film each having at least a surface portion constituted by a metal silicide film, being conductive and elevated over the surface of the silicon substrate are formed on a source region and a drain region on the surface of the silicon substrate. Thus, a MOS transistor having a structure in which the surfaces of the source region and the drain region are elevated over the surface of the silicon substrate is formed. A first gate-side-wall insulating film is formed on the side wall of the gate electrode of the MOS transistor and having a bottom surface formed apart from the surface of the silicon substrate. A second gate-side-wall insulating film is formed between the first gate-side-wall insulating film and the gate electrode and on the bottom surface of the first gate-side-wall insulating film. The portion formed on the bottom surface exists in an inner bottom surface portion of the bottom surface of the first gate-side-wall insulating film adjacent to the gate electrode. The elevated source film and the elevated drain film are free from any facet in portions made contact with the first gate-side-wall insulating film.

    摘要翻译: 形成具有升高的源极和漏极结构的MOS晶体管的半导体器件被布置成具有通过绝缘膜形成在硅衬底的表面上的栅电极。 在硅的表面上的源极区域和漏极区域上形成有在硅衬底的表面上导电且升高的至少一层由金属硅化物膜构成的表面部分的升高的源极膜和升高的漏极膜 基质。 因此,形成具有使源极区域和漏极区域的表面在硅衬底的表面上升高的结构的MOS晶体管。 第一栅极侧壁绝缘膜形成在MOS晶体管的栅电极的侧壁上,并且具有与硅衬底的表面分开形成的底表面。 在第一栅极侧壁绝缘膜和栅电极之间以及第一栅极侧壁绝缘膜的底面上形成第二栅极侧壁绝缘膜。 形成在底表面上的部分存在于与栅电极相邻的第一栅极侧壁绝缘膜的底表面的内底表面部分中。 升高的源极膜和升高的漏极膜在与第一栅极侧壁绝缘膜接触的部分中没有任何刻面。

    Semiconductor apparatus having elevated source and drain structure and manufacturing method therefor

    公开(公告)号:US06335251B1

    公开(公告)日:2002-01-01

    申请号:US09824215

    申请日:2001-04-03

    IPC分类号: H01L21336

    摘要: A semiconductor apparatus on which a MOS transistor having an elevated source and drain structure is formed is arranged to have a gate electrode which is formed on the surface of a silicon substrate through an insulating film. An elevated source film and an elevated drain film each having at least a surface portion constituted by a metal silicide film, being conductive and elevated over the surface of the silicon substrate are formed on a source region and a drain region on the surface of the silicon substrate. Thus, a MOS transistor having a structure in which the surfaces of the source region and the drain region are elevated over the surface of the silicon substrate is formed. A first gate-side-wall insulating film is formed on the side wall of the gate electrode of the MOS transistor and having a bottom surface formed apart from the surface of the silicon substrate. A second gate-side-wall insulating film is formed between the first gate-side-wall insulating film and the gate electrode and on the bottom surface of the first gate-side-wall insulating film. The portion formed on the bottom surface exists in an inner bottom surface portion of the bottom surface of the first gate-sidewall insulating film adjacent to the gate electrode. The elevated source film and the elevated drain film are free from any facet in portions made contact with the first gate-side-wall insulating film.