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公开(公告)号：US09490055B2
公开(公告)日：2016-11-08
申请号：US13287255
申请日：2011-11-02
申请人： Kota Zenzai , Hisayoshi Omori , Takashi Kanayama , Kiyoyasu Sakurada , Naoki Shimizu , Seiji Katsuta , Shinji Otani
发明人： Kota Zenzai , Hisayoshi Omori , Takashi Kanayama , Kiyoyasu Sakurada , Naoki Shimizu , Seiji Katsuta , Shinji Otani
CPC分类号： H01G4/30 , H01F17/0013 , H01F27/292 , H01G4/005 , H01G4/008 , H01G4/012 , H01G4/12 , H01G4/248 , Y10T29/49002
摘要： A ceramic electronic component includes a ceramic body, an inner electrode, an outer electrode, and a connecting portion. The inner electrode is disposed inside the ceramic body. The end portion of the inner electrode extends to a surface of the ceramic body. The outer electrode is disposed on the surface of the ceramic body so as to cover the end portion of the inner electrode. The outer electrode includes a resin and a metal. The connecting portion is disposed so as to extend from an inside of the outer electrode to an inside of the ceramic body. In a portion of the surface of the ceramic body on which the outer electrode is disposed, the length of the connecting portion that extends in a direction in which the inner electrode is extends about 2.4 μm or more.
摘要翻译： 陶瓷电子部件包括陶瓷体，内电极，外电极和连接部。 内部电极设置在陶瓷体的内部。 内部电极的端部延伸到陶瓷体的表面。 外部电极设置在陶瓷体的表面上以覆盖内部电极的端部。 外部电极包括树脂和金属。 连接部被配置成从外部电极的内部延伸到陶瓷体的内部。 在设置有外部电极的陶瓷体的表面的一部分中，连接部的在内部电极的延伸方向上延伸约2.4μm以上的长度。
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公开(公告)号：US09202640B2
公开(公告)日：2015-12-01
申请号：US13287276
申请日：2011-11-02
申请人： Kota Zenzai , Hisayoshi Omori , Takashi Kanayama , Kiyoyasu Sakurada , Naoki Shimizu , Seiji Katsuta , Shinji Otani
发明人： Kota Zenzai , Hisayoshi Omori , Takashi Kanayama , Kiyoyasu Sakurada , Naoki Shimizu , Seiji Katsuta , Shinji Otani
CPC分类号： H01G4/30 , H01G4/005 , H01G4/012 , H01G4/12 , H01G4/248 , H01G4/252 , H01G13/006 , H05K3/1283 , H05K3/4664
摘要： A ceramic body includes an inner electrode disposed inside the ceramic body and in which an end portion of the inner electrode extends to a surface of the ceramic body. An electrode layer is formed on the surface of the ceramic body so as to cover the end portion of the inner electrode, the electrode layer including a resin, a first metal filler that contains a first metal component, and a second metal filler that contains a second metal component having a higher melting point than the first metal component. A step of heating the electrode layer is performed to form an electrode including a metal layer that is located on the surface of the ceramic body and that includes the first and second metal components and a metal contained in the inner electrode.
摘要翻译： 陶瓷体包括设置在陶瓷体内部的内部电极，内部电极的端部延伸到陶瓷体的表面。 在陶瓷体的表面上形成电极层，以覆盖内部电极的端部，包括树脂的电极层，含有第一金属成分的第一金属填料和含有第一金属成分的第二金属填料 具有比第一金属成分高的熔点的第二金属成分。 执行加热电极层的步骤，以形成包括位于陶瓷体表面上并且包括第一和第二金属成分的金属层和包含在内部电极中的金属的电极。
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3.发明授权公开(公告)号：US08988855B2
公开(公告)日：2015-03-24
申请号：US13287253
申请日：2011-11-02
申请人： Kiyoyasu Sakurada , Kota Zenzai , Hisayoshi Omori , Takashi Kanayama , Shinji Otani , Naoki Shimizu , Seiji Katsuta
发明人： Kiyoyasu Sakurada , Kota Zenzai , Hisayoshi Omori , Takashi Kanayama , Shinji Otani , Naoki Shimizu , Seiji Katsuta
CPC分类号： H01G4/2325 , H01G4/12 , H01G4/30
摘要： A ceramic electronic component includes a ceramic body and an outer electrode. The outer electrode is disposed on the ceramic body. The outer electrode includes a first conductive layer and a second conductive layer. The first conductive layer includes a resin, a first metal component, and a second metal component having a higher melting point than the first metal component. The second conductive layer is disposed on the first conductive layer. The second conductive layer is includes a plating film. An alloy particle containing the first metal component and the second metal component protrudes to the second conductive layer side from a surface of the first conductive layer.
摘要翻译： 陶瓷电子部件包括陶瓷体和外部电极。 外部电极设置在陶瓷体上。 外电极包括第一导电层和第二导电层。 第一导电层包括树脂，第一金属组分和具有比第一金属组分更高的熔点的第二金属组分。 第二导电层设置在第一导电层上。 第二导电层包括镀膜。 含有第一金属成分和第二金属成分的合金粒子从第一导电层的表面突出到第二导电层侧。
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公开(公告)号：US5579213A
公开(公告)日：1996-11-26
申请号：US587546
申请日：1996-01-18
IPC分类号： H01C1/14 , H01C10/00 , H01C13/00 , H01R4/48 , H01R4/64 , H01R13/24 , H01R13/53 , H05K3/32 , H01R9/00
CPC分类号： H01C10/00 , H01R12/515 , H01R13/24 , H01R4/4818 , H01F2038/423 , H01R12/57 , H01R13/53 , H05K3/325
摘要： A high-voltage variable resistor capable of electrically connecting a connection electrode on a circuit board and a terminal fitment to each other without using any conductive rubber or soldering. A terminal fitment which is electrically connected to a connection electrode on a circuit board without soldering is arranged between a front surface of the circuit board and an inner surface of an insulating casing. The terminal fitment is provided with a connection conductor holding section including a plurality of edges biting into an end of a connection conductor inserted into the insulating casing via each of through-holes of the insulating casing when a force in a direction of drawing the connection conductor out of the connection conductor holding section is applied to the connection conductor. The terminal fitment is integrally provided with a contact terminal section exhibiting elasticity. The contact terminal section has a contact pressed against the connection electrode on the circuit board by elasticity of the contact terminal section.
摘要翻译： 一种高电压可变电阻器，其能够将电路板上的连接电极和端子配件彼此电连接，而不使用任何导电橡胶或焊接。 在电路板的前表面和绝缘壳体的内表面之间布置有电连接到电路板上的连接电极而没有焊接的端子配件。 端子配件设置有连接导体保持部，该连接导体保持部包括在将连接导体拉伸的方向上的力时，通过绝缘壳体的每个通孔插入插入绝缘壳体的连接导体的端部的多个边缘 连接导体保持部的外部被施加到连接导体。 端子配件一体地设置有显示弹性的接触端子部。 接触端子部分具有通过接触端子部分的弹性压靠电路板上的连接电极的接触。
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公开(公告)号：US5546280A
公开(公告)日：1996-08-13
申请号：US365497
申请日：1994-12-28
IPC分类号： H01C1/14 , H01C10/00 , H01C13/00 , H01R4/48 , H01R4/64 , H01R13/24 , H01R13/53 , H05K3/32 , H05K5/00
CPC分类号： H01C10/00 , H01R12/515 , H01R13/24 , H01R4/4818 , H01F2038/423 , H01R12/57 , H01R13/53 , H05K3/325
摘要： A high-voltage variable resistor capable of electrically connecting a connection electrode on a circuit board and a terminal fitment to each other without using any conductive rubber or soldering. A terminal fitment which is electrically connected to a connection electrode on a circuit board without soldering is arranged between a front surface of the circuit board and an inner surface of an insulating casing. The terminal fitment is provided with a connection conductor holding section including a plurality of edges biting into an end of a connection conductor inserted into the insulating casing via each of through-holes of the insulating casing when a force in a direction of drawing the connection conductor out of the connection conductor holding section is applied to the connection conductor. The terminal fitment is integrally provided with a contact terminal section exhibiting elasticity. The contact terminal section has a contact pressed against the connection electrode on the circuit board by elasticity of the contact terminal section.
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