公开(公告)号：US20090267263A1

公开(公告)日：2009-10-29

申请号：US12501462

申请日：2009-07-12

申请人： Koichi Shibayama ,  Koji Yonezawa

发明人： Koichi Shibayama ,  Koji Yonezawa

IPC分类号： B29C71/00

CPC分类号： H05K1/0373 ,  C08K3/34 ,  C08K7/10 ,  C08L21/00 ,  C08L63/00 ,  H05K2201/0209 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/269

摘要： Disclosed is a thermosetting resin composition which enables to obtain a molded article that is excellent in mechanical properties, dimensional stability and heat resistance and is further capable of maintaining the shape of the article molded before curing even after the resin composition is cured. The thermosetting resin composition contains 100 parts by weight of a thermosetting resin and 1-100 parts by weight of an inorganic compound dispersed in the thermosetting resin, and the dispersion particle diameter of the inorganic compound is not more than 2 μm. Not less than 75% of the shape of an article molded before curing is maintained after the resin composition is cured. Also disclosed are a material for substrates and a film for substrates respectively composed by using such a thermosetting resin composition.

摘要翻译： 公开了一种热固性树脂组合物，其能够获得机械性能，尺寸稳定性和耐热性优异的成型体，并且即使在树脂组合物固化后，还能够保持固化前的制品的形状。 热固性树脂组合物含有100重量份热固性树脂和1-100重量份分散在热固性树脂中的无机化合物，并且无机化合物的分散体粒径不大于2μm。 在树脂组合物固化后，保持固化前模制的制品形状的75％以上。 还公开了通过使用这种热固性树脂组合物分别构成的基板材料和基板用薄膜。

公开(公告)号：US20070072963A1

公开(公告)日：2007-03-29

申请号：US10582883

申请日：2004-12-14

申请人： Koichi Shibayama ,  Koji Yonezawa

发明人： Koichi Shibayama ,  Koji Yonezawa

IPC分类号： C08K3/02

CPC分类号： H05K1/0373 ,  H05K2201/0129 ,  H05K2201/0209

摘要： Disclosed is a thermoplastic resin composition which enables to obtain a molded article that is capable of maintaining the molded shape even when the article is heated after molding and is excellent in dimensional stability and heat resistance. The thermoplastic resin composition contains 100 parts by weight of a thermoplastic resin and 0.1-100 parts by weight of an inorganic compound dispersed in the thermoplastic resin. Not less than 75% of the molded shape of an article can be maintained even after the article is heated to a temperature not less than the glass transition temperature or melting point of the thermoplastic resin. Also disclosed are a material and a film for substrates composed by using such a thermoplastic resin composition.

摘要翻译： 公开了一种热塑性树脂组合物，其能够获得即使在制品在成型后被加热并且尺寸稳定性和耐热性优异的情况下也能够保持模塑形状的模塑制品。 热塑性树脂组合物含有100重量份热塑性树脂和0.1-100重量份分散在热塑性树脂中的无机化合物。 即使制品被加热到不低于热塑性树脂的玻璃化转变温度或熔点的温度，也可以保持制品的模制形状的75％以上。 还公开了使用这种热塑性树脂组合物构成的基材的材料和薄膜。

公开(公告)号：US20090256283A1

公开(公告)日：2009-10-15

申请号：US12488560

申请日：2009-06-20

申请人： Koichi Shibayama ,  Koji Yonezawa

发明人： Koichi Shibayama ,  Koji Yonezawa

IPC分类号： B29C70/60

CPC分类号： H05K1/0373 ,  H05K2201/0129 ,  H05K2201/0209

摘要： Disclosed is a thermoplastic cresin composition which enables to obtain a molded article that is capable of maintaining the molded shape even when the article is heated after molding and is excellent in dimensional stability and heat resistence. The thermoplastic resin composition contains 100 parts by weight of a thermoplastic resin and 0.1-100 parts by weight of an inorganic compound dispersed in the thermoplastic resin. Not less than 75% of the molded shape of an article can be maintained even after the article is heated to a temperature not less than the glass transition temperature or melting point of the thermoplastic resin. Also disclosed are a material and a film for substrates composed by using such a thermoplastic resin composition.

摘要翻译： 公开了一种热塑性树脂组合物，其能够获得即使在成型后加热制品并且尺寸稳定性和耐热性优异的情况下也能够保持成型体的成型体。 热塑性树脂组合物含有100重量份热塑性树脂和0.1-100重量份分散在热塑性树脂中的无机化合物。 即使制品被加热到不低于热塑性树脂的玻璃化转变温度或熔点的温度，也可以保持制品的模制形状的75％以上。 还公开了使用这种热塑性树脂组合物构成的基材的材料和薄膜。

公开(公告)号：US20080233386A1

公开(公告)日：2008-09-25

申请号：US10581928

申请日：2004-12-07

申请人： Koichi Shibayama ,  Koji Yonezawa ,  Kazuyoshi Shiomi ,  Motohiro Yagi ,  Hidenobu Deguchi ,  Nobuhiro Goto

发明人： Koichi Shibayama ,  Koji Yonezawa ,  Kazuyoshi Shiomi ,  Motohiro Yagi ,  Hidenobu Deguchi ,  Nobuhiro Goto

IPC分类号： C08G59/62 ,  B32B15/092 ,  C08K3/36 ,  C08K5/17

CPC分类号： H01L23/295 ,  C08G59/625 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K2201/0245 ,  Y10T428/25 ,  Y10T428/259 ,  Y10T428/26 ,  Y10T428/31525 ,  H01L2924/00

摘要： A thermosetting resin composition capable of providing a molding, such as a resin sheet, that excels in not only dielectric characteristics but also dimensional stability at high temperature and even after exposure to high temperature thermal history, exhibits little dimensional change by the thermal history, namely, exhibiting low linear expansion coefficient. There are further provided a resin sheet and resin sheet for insulated substrate produced from the thermosetting resin composition. In particular, there is provided a thermosetting resin composition comprising an epoxy resin of 100 to 2000 epoxy equivalent, an epoxy resin hardening agent consisting of a phenolated compound, and a layered silicate, and are further provided a resin sheet comprised of the thermosetting resin composition and a resin sheet for insulated substrate comprised of the resin sheet.

摘要翻译： 能够提供诸如树脂片的成型体的热固性树脂组合物，不仅具有介电特性，而且在高温下甚至在暴露于高温热历史之后都具有优异的尺寸稳定性，其热历史几乎没有尺寸变化，即 ，显示出低的线性膨胀系数。 此外，还提供了由热固性树脂组合物制成的用于绝缘基板的树脂片和树脂片。 特别地，提供一种热固性树脂组合物，其包含环氧树脂为100至2000环氧当量的环氧树脂，由酚化合物和层状硅酸盐组成的环氧树脂硬化剂，并且还提供由热固性树脂组合物 以及由树脂片构成的绝缘基板用树脂片。

公开(公告)号：US07709085B2

公开(公告)日：2010-05-04

申请号：US10581928

申请日：2004-12-07

申请人： Koichi Shibayama ,  Koji Yonezawa ,  Kazuyoshi Shiomi ,  Motohiro Yagi ,  Hidenobu Deguchi ,  Nobuhiro Goto

发明人： Koichi Shibayama ,  Koji Yonezawa ,  Kazuyoshi Shiomi ,  Motohiro Yagi ,  Hidenobu Deguchi ,  Nobuhiro Goto

IPC分类号： B32B15/16 ,  C08L63/00 ,  C08K3/24 ,  B32B27/20 ,  B32B27/38

CPC分类号： H01L23/295 ,  C08G59/625 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K2201/0245 ,  Y10T428/25 ,  Y10T428/259 ,  Y10T428/26 ,  Y10T428/31525 ,  H01L2924/00

摘要： A thermosetting resin composition capable of providing a molding, such as a resin sheet, that excels in not only dielectric characteristics but also dimensional stability at high temperature and even after exposure to high temperature thermal history, exhibits little dimensional change by the thermal history, namely, exhibiting low linear expansion coefficient. There are further provided a resin sheet and resin sheet for insulated substrate produced from the thermosetting resin composition. In particular, there is provided a thermosetting resin composition comprising an epoxy resin of 100 to 2000 epoxy equivalent, an epoxy resin hardening agent consisting of a phenolated compound, and a layered silicate, and are further provided a resin sheet comprised of the thermosetting resin composition and a resin sheet for insulated substrate comprised of the resin sheet.

摘要翻译： 能够提供诸如树脂片的成型体的热固性树脂组合物，不仅具有介电特性，而且在高温下甚至在暴露于高温热历史之后都具有优异的尺寸稳定性，其热历史几乎没有尺寸变化，即 ，显示出低的线性膨胀系数。 此外，还提供了由热固性树脂组合物制成的用于绝缘基板的树脂片和树脂片。 特别地，提供一种热固性树脂组合物，其包含环氧树脂为100至2000环氧当量的环氧树脂，由酚化合物和层状硅酸盐组成的环氧树脂硬化剂，并且还提供由热固性树脂组合物 以及由树脂片构成的绝缘基板用树脂片。

公开(公告)号：US20050107497A1

公开(公告)日：2005-05-19

申请号：US10503490

申请日：2003-02-04

申请人： Kazunori Akaho ,  Koji Yonezawa ,  Motohiro Yagi ,  Akihiko Fujiwara ,  Koichi Shibayama ,  Hidenobu Deguchi

发明人： Kazunori Akaho ,  Koji Yonezawa ,  Motohiro Yagi ,  Akihiko Fujiwara ,  Koichi Shibayama ,  Hidenobu Deguchi

IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K3/46 ,  C08L63/00

CPC分类号： C08K3/346 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/4626 ,  H05K3/4635 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2201/068 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/269

摘要： A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed board, prepreg and adhesive sheet are provided which exhibit improved mechanical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermosetting resin and 0.1-65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (α2) of up to 17×10−3 [° C.−1] over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.

摘要翻译： 提供树脂组合物，基材，片，层压板，含树脂铜箔，覆铜层压板，TAB带，印刷板，预浸料和粘合片，其具有改进的机械性能，尺寸稳定性，耐热性和阻燃性， 特别是高温物理性能。 含有100重量份热固性树脂和0.1-65重量份无机化合物的树脂组合物，该树脂组合物的平均线性膨胀系数（α2）高达17×10 -3 [ 在比树脂组合物的玻璃化转变温度高10℃的温度到比树脂的玻璃化转变温度高50℃的温度的温度范围内， 组成。

公开(公告)号：US07682691B2

公开(公告)日：2010-03-23

申请号：US10503490

申请日：2003-02-04

申请人： Kazunori Akaho ,  Koji Yonezawa ,  Motohiro Yagi ,  Akihiko Fujiwara ,  Koichi Shibayama ,  Hidenobu Deguchi

发明人： Kazunori Akaho ,  Koji Yonezawa ,  Motohiro Yagi ,  Akihiko Fujiwara ,  Koichi Shibayama ,  Hidenobu Deguchi

IPC分类号： B32B27/20 ,  B32B27/18 ,  C08K3/34

CPC分类号： C08K3/346 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/4626 ,  H05K3/4635 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2201/068 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/269

摘要： A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed board, prepreg and adhesive sheet are provided which exhibit improved mechanical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. The resin composition containing 100 parts by weight of a thermosetting resin and 0.1-65 parts by weight of a layered silicate inorganic compound, the resin composition having a mean linear expansion coefficient (α2) of up to 17×10−3 [° C.−1 ] over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.

摘要翻译： 提供树脂组合物，基材，片，层压板，含树脂铜箔，覆铜层压板，TAB带，印刷板，预浸料和粘合片，其具有改进的机械性能，尺寸稳定性，耐热性和阻燃性， 特别是高温物理性能。 含有100重量份热固性树脂和0.1-65重量份层状硅酸盐无机化合物的树脂组合物，该树脂组合物的平均线性膨胀系数（α2）高达17×10-3 [℃ -1]在比树脂组合物的玻璃化转变温度高10℃的温度范围内，高于树脂组合物的玻璃化转变温度50℃。

公开(公告)号：US20080268257A1

公开(公告)日：2008-10-30

申请号：US12164906

申请日：2008-06-30

申请人： Koji Yonezawa ,  Koichi Shibayama ,  Masao Fushimi ,  Hideyuki Takahashi ,  Koji Taniguchi ,  Motohiro Yagi

发明人： Koji Yonezawa ,  Koichi Shibayama ,  Masao Fushimi ,  Hideyuki Takahashi ,  Koji Taniguchi ,  Motohiro Yagi

IPC分类号： B32B17/10

CPC分类号： H01B3/30 ,  B32B15/08 ,  C08K3/34 ,  C08K7/00 ,  H01L23/145 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K2201/0129 ,  H05K2201/0154 ,  Y10T428/265 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31678 ,  Y10T428/31681 ,  H01L2924/00

摘要： It is an object of the invention to provide a material for -insulating substrate, a printed board, a laminate, copper foil with resin, a copper-clad laminate, a polyimide film, a film for TAB and a prepreg, which are excellent in physical properties, dimensional stability, heat resistance, flame retardancy etc. and exhibit an excellent flame retardant effect particularly by a shape retention effect at the time of combustionThe invention provides a material for insulating substrate, comprising 100 parts by weight of a thermoplastic resin or a mixture of a thermoplastic resin and a thermosetting resin and 0.1 to 100 parts by weight of a layered silicate.

摘要翻译： 本发明的目的是提供一种用于绝缘衬底，印刷电路板，层压体，具有树脂的铜箔，覆铜层压板，聚酰亚胺膜，用于TAB的膜和预浸料的材料。 物理性质，尺寸稳定性，耐热性，阻燃性等，特别是通过燃烧时的形状保持效果而显示优异的阻燃效果本发明提供一种绝缘基材的材料，其包含100重量份的热塑性树脂或 热塑性树脂和热固性树脂的混合物和0.1至100重量份的层状硅酸盐。

公开(公告)号：US20080268237A1

公开(公告)日：2008-10-30

申请号：US12164952

申请日：2008-06-30

申请人： Koji Yonezawa ,  Koichi Shibayama ,  Masao Fushimi ,  Hideyuki Takahashi ,  Koji Taniguchi ,  Motohiro Yagi

发明人： Koji Yonezawa ,  Koichi Shibayama ,  Masao Fushimi ,  Hideyuki Takahashi ,  Koji Taniguchi ,  Motohiro Yagi

IPC分类号： H01B3/00 ,  H01B3/40

CPC分类号： H01B3/30 ,  B32B15/08 ,  C08K3/34 ,  C08K7/00 ,  H01L23/145 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K2201/0129 ,  H05K2201/0154 ,  Y10T428/265 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31678 ,  Y10T428/31681 ,  H01L2924/00

摘要： It is an object of the invention to provide a material for insulating substrate, a printed board, a laminate, copper foil with resin, a copper-clad laminate, a polyimide film, a film for TAB and a prepreg, which are excellent in physical properties, dimensional stability, heat resistance, flame retardancy etc. and exhibit an excellent flame retardant effect particularly by a shape retention effect at the time of combustionThe invention provides a material for insulating substrate, comprising 100 parts by weight of a thermoplastic resin or a mixture of a thermoplastic resin and a thermosetting resin and 0.1 to 100 parts by weight of a layered silicate.

摘要翻译： 本发明的目的是提供一种用于绝缘基板，印刷电路板，层压板，具有树脂的铜箔，覆铜层压板，聚酰亚胺膜，用于TAB的膜和预浸料的材料，其物理性质优异 特性，尺寸稳定性，耐热性，阻燃性等，特别是通过燃烧时的形状保持效果而显示优异的阻燃效果本发明提供一种绝缘基材的材料，其包含100重量份的热塑性树脂或 热塑性树脂和热固性树脂的混合物和0.1至100重量份层状硅酸盐。

公开(公告)号：US20070148442A1

公开(公告)日：2007-06-28

申请号：US10582881

申请日：2004-12-14

申请人： Koichi Shibayama ,  Koji Yonezawa

发明人： Koichi Shibayama ,  Koji Yonezawa

IPC分类号： G11B5/64

CPC分类号： H05K1/0373 ,  C08K3/34 ,  C08K7/10 ,  C08L21/00 ,  C08L63/00 ,  H05K2201/0209 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/269

摘要： Disclosed is a thermosetting resin composition which enables to obtain a molded article that is excellent in mechanical properties, dimensional stability and heat resistance and is further capable of maintaining the shape of the article molded before curing even after the resin composition is cured. The thermosetting resin composition contains 100 parts by weight of a thermosetting resin and 1-100 parts by weight of an inorganic compound dispersed in the thermosetting resin, and the dispersion particle diameter of the inorganic compound is not more than 2 μm. Not less than 75% of the shape of an article molded before curing is maintained after the resin composition is cured. Also disclosed are a material for substrates and a film for substrates respectively composed by using such a thermosetting resin composition.

摘要翻译： 公开了一种热固性树脂组合物，其能够获得机械性能，尺寸稳定性和耐热性优异的成型体，并且即使在树脂组合物固化后，还能够保持固化前的制品的形状。 热固性树脂组合物含有100重量份热固性树脂和1-100重量份分散在热固性树脂中的无机化合物，并且无机化合物的分散体粒径不大于2μm。 在树脂组合物固化后，保持固化前模制的制品形状的75％以上。 还公开了通过使用这种热固性树脂组合物分别构成的基板材料和基板用薄膜。