公开(公告)号：US08120159B2

公开(公告)日：2012-02-21

申请号：US12797192

申请日：2010-06-09

申请人： Mayumi Yamaguchi ,  Konami Izumi

发明人： Mayumi Yamaguchi ,  Konami Izumi

IPC分类号： H01L23/02

CPC分类号： H01L27/1266 ,  H01L21/6835 ,  H01L21/8221 ,  H01L21/84 ,  H01L23/4985 ,  H01L23/49855 ,  H01L23/5389 ,  H01L25/105 ,  H01L27/0688 ,  H01L27/12 ,  H01L27/124 ,  H01L2224/24145 ,  H01L2224/76155 ,  H01L2924/01019 ,  H01L2924/07811 ,  H01L2924/12032 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/00

摘要： A step of forming a through hole in a semiconductor substrate, or a step of polishing the semiconductor substrate from its back surface requires a very long time and causes decrease of productivity. In addition, when semiconductor substrates are stacked, a semiconductor integrated circuit which is formed of the stack is thick and has poor mechanical flexibility. A release layer is formed over each of a plurality of substrates, layers each having a semiconductor element and an opening for forming a through wiring are formed over each of the release layers. Then, layers each having the semiconductor element are peeled off from the substrates, and then overlapped and stacked, a conductive layer is formed in the opening, and the through wiring is formed; thus, a semiconductor integrated circuit is formed.

摘要翻译： 在半导体衬底中形成通孔的步骤或从其背面抛光半导体衬底的步骤需要很长时间并且导致生产率降低。 此外，当堆叠半导体衬底时，由堆叠形成的半导体集成电路厚并且机械灵活性差。 在多个基板的每一个上形成剥离层，每个剥离层上形成有各自具有半导体元件的层和用于形成贯通布线的开口。 然后，将具有半导体元件的层从基板剥离，然后重叠堆叠，在开口中形成导电层，形成贯通布线; 从而形成半导体集成电路。

公开(公告)号：US20120037966A1

公开(公告)日：2012-02-16

申请号：US13283648

申请日：2011-10-28

申请人： Mayumi Yamaguchi ,  Konami Izumi

发明人： Mayumi Yamaguchi ,  Konami Izumi

IPC分类号： H01L29/78 ,  H01L21/302

CPC分类号： H01L51/0021 ,  H01L27/1214 ,  H01L27/1255 ,  H01L27/1266

摘要： A micromachine is generally formed using a semiconductor substrate such as a silicon wafer. One of the objects of the present invention is to realize further reduction in cost by integrating a minute structure and a semiconductor element controlling the minute structure over one insulating surface in one step. A minute structure has a structure in which a first layer formed into a frame-shape are provided over an insulating surface, a space is formed inside the frame, and a second layer is formed to cross over the first layer. Such a minute structure and a thin film transistor can be integrated over one insulating surface in one step.

摘要翻译： 微机械通常使用诸如硅晶片的半导体衬底形成。 本发明的目的之一是通过在一个步骤中将微结构和控制微结构的半导体元件集成在一个绝缘表面上来实现成本的进一步降低。 微小结构具有这样的结构，其中形成为框架形状的第一层设置在绝缘表面上，在框架内部形成空间，并且形成第二层以跨越第一层。 这样的微小结构和薄膜晶体管可以在一个步骤中集成在一个绝缘表面上。

公开(公告)号：US07785938B2

公开(公告)日：2010-08-31

申请号：US11785149

申请日：2007-04-16

申请人： Mayumi Yamaguchi ,  Konami Izumi

发明人： Mayumi Yamaguchi ,  Konami Izumi

IPC分类号： H01L21/00

CPC分类号： H01L27/1266 ,  H01L21/6835 ,  H01L21/8221 ,  H01L21/84 ,  H01L23/4985 ,  H01L23/49855 ,  H01L23/5389 ,  H01L25/105 ,  H01L27/0688 ,  H01L27/12 ,  H01L27/124 ,  H01L2224/24145 ,  H01L2224/76155 ,  H01L2924/01019 ,  H01L2924/07811 ,  H01L2924/12032 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/00

摘要： A step of forming a through hole in a semiconductor substrate, or a step of polishing the semiconductor substrate from its back surface requires a very long time and causes decrease of productivity. In addition, when semiconductor substrates are stacked, a semiconductor integrated circuit which is formed of the stack is thick and has poor mechanical flexibility. A release layer is formed over each of a plurality of substrates, layers each having a semiconductor element and an opening for forming a through wiring are formed over each of the release layers. Then, layers each having the semiconductor element are peeled off from the substrates, and then overlapped and stacked, a conductive layer is formed in the opening, and the through wiring is formed; thus, a semiconductor integrated circuit is formed.

摘要翻译： 在半导体衬底中形成通孔的步骤或从其背面抛光半导体衬底的步骤需要很长时间并且导致生产率降低。 此外，当堆叠半导体衬底时，由堆叠形成的半导体集成电路厚并且机械灵活性差。 在多个基板的每一个上形成剥离层，每个剥离层上形成有各自具有半导体元件的层和用于形成贯通布线的开口。 然后，将具有半导体元件的层从基板剥离，然后重叠堆叠，在开口中形成导电层，形成贯通布线; 从而形成半导体集成电路。

公开(公告)号：US07560789B2

公开(公告)日：2009-07-14

申请号：US11420150

申请日：2006-05-24

申请人： Konami Izumi ,  Mayumi Yamaguchi

发明人： Konami Izumi ,  Mayumi Yamaguchi

IPC分类号： H01L29/82

CPC分类号： B81C1/00246 ,  B81C2203/0735 ,  H01L21/0237 ,  H01L21/02532 ,  H01L21/02672 ,  H01L21/02675 ,  H01L21/02691 ,  H01L27/1266 ,  H01L27/1277

摘要： A microstructure and a semiconductor element which are included in a micromachine have been generally formed in different steps. It is an object to provide a method for manufacturing a micromachine in which a microstructure and a semiconductor element are formed over one insulating substrate. A feature of the invention is a micromachine including a movable layer containing polycrystalline silicon which is thermally crystallized or crystallized by a laser using metal and a space below or above the layer. Such polycrystalline silicon has high strength and is formed on an insulating surface, so that it is used as a microstructure and used for forming a semiconductor element. Accordingly, a semiconductor device in which a microstructure and a semiconductor element are formed over one insulating substrate can be formed.

摘要翻译： 包括在微加工机中的微结构和半导体元件通常以不同的步骤形成。 本发明的目的是提供一种在一个绝缘基板上形成微结构和半导体元件的微机械的制造方法。 本发明的特征是包括含有多晶硅的可移动层的微机械，其通过使用金属的激光和层的下方或上方的空间热结晶或结晶。 这种多晶硅具有高强度并形成在绝缘表面上，因此用作微结构并用于形成半导体元件。 因此，可以形成其中在一个绝缘基板上形成微结构和半导体元件的半导体器件。

公开(公告)号：US07537953B2

公开(公告)日：2009-05-26

申请号：US11557353

申请日：2006-11-07

申请人： Fuminori Tateishi ,  Konami Izumi ,  Mayumi Yamaguchi

发明人： Fuminori Tateishi ,  Konami Izumi ,  Mayumi Yamaguchi

IPC分类号： G01R31/26

CPC分类号： B81C1/00476

摘要： To reduce the number of photomasks which are used to form sacrificial layers for producing spaces of a microstructure, thereby reducing the manufacturing cost. Sacrificial layers are formed by using resist masks which are patterned with the same photomask. Specifically, after forming a first sacrificial layer by etching using a resist mask, a second sacrificial layer is formed by etching using a resist mask which is pattered with same photomask as the resist mask of the first sacrificial layer. By deforming one of the resist masks before etching its corresponding sacrificial layer, for example by increasing or reducing the external dimension of the resist mask, sacrificial layers having different sizes from each other can be formed.

摘要翻译： 为了减少用于形成用于形成微结构的空间的牺牲层的光掩模的数量，从而降低制造成本。 牺牲层通过使用用相同光掩模图案化的抗蚀剂掩模形成。 具体而言，在使用抗蚀剂掩模蚀刻形成第一牺牲层之后，通过使用与第一牺牲层的抗蚀剂掩模相同的光掩模图案化的抗蚀剂掩模进行蚀刻来形成第二牺牲层。 在蚀刻其相应的牺牲层之前，通过使抗蚀剂掩模之一变形，例如通过增加或减小抗蚀剂掩模的外部尺寸，可以形成具有彼此不同尺寸的牺牲层。

公开(公告)号：US20080055279A1

公开(公告)日：2008-03-06

申请号：US11892591

申请日：2007-08-24

申请人： Takeshi Osada ,  Mayumi Yamaguchi ,  Konami Izumi

发明人： Takeshi Osada ,  Mayumi Yamaguchi ,  Konami Izumi

IPC分类号： G06F3/033

CPC分类号： G06F3/03545 ,  G06F3/033 ,  G06F3/03542 ,  G06F3/044 ,  G06F3/04883 ,  G06K9/00402 ,  G06K9/22 ,  G06K9/222 ,  H02J7/025

摘要： To provide a small and light-weight writing instrument that can accurately read information written down on a display portion as electronic information. A pen-shaped device which includes a battery capable of being charged wirelessly from the outside, a first sensor which detects whether a pen nib has contact with a surface, a second sensor which detects movement of the pen nib in contact with the surface, a control circuit which is electrically connected to the first sensor and the second sensor, and a memory which is electrically connected to the control circuit, where the first sensor, the second sensor, the control circuit, and the memory operate by supply of electric power from the battery.

摘要翻译： 提供一种小型轻便的书写工具，可以准确地读取在显示部分上写入的信息作为电子信息。 一种笔状装置，包括能够从外部无线充电的电池，检测笔尖是否与表面接触的第一传感器，检测笔尖与表面接触的移动的第二传感器， 电连接到第一传感器和第二传感器的控制电路，以及电连接到控制电路的存储器，其中第一传感器，第二传感器，控制电路和存储器通过从 电池。

公开(公告)号：US08585775B2

公开(公告)日：2013-11-19

申请号：US12068451

申请日：2008-02-06

申请人： Takashi Hirota ,  Mayumi Yamaguchi ,  Konami Izumi

发明人： Takashi Hirota ,  Mayumi Yamaguchi ,  Konami Izumi

IPC分类号： A61F2/72 ,  A61F2/54

CPC分类号： A61F2/68 ,  A61F2/54 ,  A61F2/72 ,  A61F2002/704 ,  A61F2002/705 ,  A61F2002/707 ,  A61F2002/7625 ,  A61F2002/7635 ,  A61F2002/764 ,  A61F2002/7665 ,  A61F2002/768 ,  B25J13/02 ,  H01L27/1214 ,  H01L27/1255 ,  H01L27/1266 ,  H01L27/13

摘要： The present invention provides a higher-performance assist device which is safer by using a wireless charging technique. The assist device includes a detecting portion and an assist device driving portion. The detecting portion includes a sensor, a first transmitting/receiving circuit, a first data processing circuit, a first charging circuit, and a first battery. The assist device driving portion includes a driving portion, a second data processing circuit, a second transmitting/receiving circuit, a second charging circuit, and a second battery. Electromagnetic waves are transmitted from the second transmitting/receiving circuit provided in the assist device driving portion, and the first transmitting/receiving circuit provided in the detecting portion receives the electromagnetic waves. Induced electromotive force generated at this time is input to the first charging circuit through the first data processing circuit provided in the detecting portion, and the first battery provided in the detecting portion is charged.

摘要翻译： 本发明提供一种通过使用无线充电技术更安全的更高性能的辅助装置。 辅助装置包括检测部和辅助装置驱动部。 检测部分包括传感器，第一发送/接收电路，第一数据处理电路，第一充电电路和第一电池。 辅助装置驱动部分包括驱动部分，第二数据处理电路，第二发送/接收电路，第二充电电路和第二电池。 电磁波从设置在辅助装置驱动部的第二发送/接收电路发送，并且设置在检测部分中的第一发送/接收电路接收电磁波。 此时产生的感应电动势通过设置在检测部分中的第一数据处理电路输入到第一充电电路，并且设置在检测部分中的第一电池被充电。

公开(公告)号：US08470695B2

公开(公告)日：2013-06-25

申请号：US13214293

申请日：2011-08-22

申请人： Mayumi Yamaguchi ,  Konami Izumi

发明人： Mayumi Yamaguchi ,  Konami Izumi

IPC分类号： H01L21/20 ,  H01L21/283 ,  H01L29/786

CPC分类号： B81B7/008 ,  B81C1/00246 ,  B81C2203/0742 ,  H01L27/1222 ,  H01L29/78678

摘要： A semiconductor element of the electric circuit includes a semiconductor layer over a gate electrode. The semiconductor layer of the semiconductor element is formed of a layer including polycrystalline silicon which is obtained by crystallizing amorphous silicon by heat treatment or laser irradiation, over a substrate. The obtained layer including polycrystalline silicon is also used for a structure layer such as a movable electrode of a structure body. Therefore, the structure body and the electric circuit for controlling the structure body can be formed over one substrate. As a result, a micromachine can be miniaturized. Further, assembly and packaging are unnecessary, so that manufacturing cost can be reduced.

摘要翻译： 电路的半导体元件包括在栅电极上的半导体层。 半导体元件的半导体层由包含多晶硅的层形成，该多晶硅通过在基板上通过热处理或激光照射而使非晶硅结晶而获得。 所获得的包含多晶硅的层也用于结构体的结构层，例如结构体的可动电极。 因此，可以在一个基板上形成用于控制结构体的结构体和电路。 结果，微型机器可以被小型化。 此外，组装和包装是不必要的，从而可以降低制造成本。

公开(公告)号：US20120032304A1

公开(公告)日：2012-02-09

申请号：US13275383

申请日：2011-10-18

申请人： Mayumi Yamaguchi ,  Konami Izumi

发明人： Mayumi Yamaguchi ,  Konami Izumi

IPC分类号： H01L29/93

CPC分类号： H01L27/1203 ,  B81C1/00547 ,  B81C2201/0135 ,  H01L21/84 ,  H01L27/016 ,  H01L27/12 ,  H01L27/13

摘要： It is an object of the present invention to manufacture a micromachine having a plurality of structural bodies with different functions and to shorten the time required for sacrifice layer etching in a process of manufacturing the micromachine. Another object of the present invention is to prevent a structural layer from being attached to a substrate after the sacrifice layer etching. In other words, an object of the present invention is to provide an inexpensive and high-value-added micromachine by improving throughput and yield. The sacrifice layer etching is conducted in multiple steps. In the multiple steps of the sacrifice layer etching, a part of the sacrifice layer that does not overlap with the structural layer is removed by the earlier sacrifice layer etching and a part of the sacrifice layer that is under the structural layer is removed by the later sacrifice layer etching.

摘要翻译： 本发明的目的是制造具有多个具有不同功能的结构体的微型机械，并且缩短在制造微机械过程中牺牲层蚀刻所需的时间。 本发明的另一个目的是在牺牲层蚀刻之后防止结构层附着到基底上。 换句话说，本发明的目的是通过提高生产量和产量来提供廉价和高附加值的微机械。 牺牲层蚀刻以多个步骤进行。 在牺牲层蚀刻的多个步骤中，通过较早的牺牲层蚀刻去除与结构层不重叠的牺牲层的一部分，并且在结构层之下的部分牺牲层被后面的部分去除 牺牲层蚀刻。

公开(公告)号：US20110312118A1

公开(公告)日：2011-12-22

申请号：US13219784

申请日：2011-08-29

申请人： Konami Izumi ,  Mayumi Yamaguchi

发明人： Konami Izumi ,  Mayumi Yamaguchi

IPC分类号： H01L21/30

CPC分类号： B81C1/00246 ,  B81C2203/0735 ,  H01L21/0237 ,  H01L21/02532 ,  H01L21/02672 ,  H01L21/02675 ,  H01L21/02691 ,  H01L27/1266 ,  H01L27/1277

摘要： A micromachine includes a microstructure and a semiconductor element formed over one insulating substrate. The micromachine includes including a movable layer containing polycrystalline silicon and a space below or above the layer. Such polycrystalline silicon is formed on an insulating surface, so that it is used as a microstructure and used for forming a semiconductor element. Accordingly, a semiconductor device may include a microstructure and a semiconductor provided over one insulating substrate.

摘要翻译： 微机械包括在一个绝缘基板上形成的微结构和半导体元件。 微机械包括包括多晶硅的可移动层和层之下或之上的空间。 这种多晶硅形成在绝缘表面上，从而被用作微结构并用于形成半导体元件。 因此，半导体器件可以包括设置在一个绝缘基板上的微结构和半导体。