公开(公告)号：US09611415B2

公开(公告)日：2017-04-04

申请号：US14553161

申请日：2014-11-25

申请人： KOREA INSTITUTE OF MACHINERY & MATERIALS

发明人： Sang-Kwan Lee ,  Sang-Bok Lee ,  Jung-Yeul Yun

IPC分类号： C09K5/14 ,  F28F21/04 ,  B29C67/04 ,  B32B18/00 ,  C04B41/88 ,  C04B41/00 ,  C04B41/45 ,  H01L23/373 ,  B22F7/06 ,  C22C32/00 ,  C04B35/645 ,  F21V29/85 ,  F21V29/89 ,  B32B5/18 ,  B32B15/04 ,  B32B5/16 ,  B32B7/04 ,  B32B9/00 ,  B32B9/04 ,  F28F21/08 ,  F28F13/00 ,  H01L33/64 ,  C04B111/00

CPC分类号： C09K5/14 ,  B22F7/062 ,  B29C67/04 ,  B32B5/16 ,  B32B5/18 ,  B32B7/04 ,  B32B9/005 ,  B32B9/041 ,  B32B15/04 ,  B32B18/00 ,  B32B2250/03 ,  B32B2264/107 ,  B32B2307/302 ,  C04B35/645 ,  C04B41/009 ,  C04B41/4523 ,  C04B41/88 ,  C04B2111/00844 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/36 ,  C04B2237/361 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/586 ,  C04B2237/704 ,  C22C32/0005 ,  C22C32/0021 ,  C22C32/0036 ,  C22C32/0047 ,  C22C32/0052 ,  C22C32/0068 ,  F21V29/86 ,  F21V29/89 ,  F28F13/003 ,  F28F21/04 ,  F28F21/08 ,  H01L23/3731 ,  H01L23/3733 ,  H01L33/642 ,  H01L2924/0002 ,  Y10T428/24992 ,  Y10T428/249957 ,  C04B35/00 ,  C04B38/00 ,  C04B35/10 ,  C04B41/4521 ,  C04B41/5155 ,  C04B41/515 ,  C04B41/5127 ,  H01L2924/00

摘要： The present disclosure provides a composite heat-dissipation substrate and a method of manufacturing the same. The composite heat-dissipation substrate includes a first ceramic layer having insulating properties, a second porous ceramic layer and a metal layer, wherein the first ceramic layer and the second ceramic layer are continuously connected to each other so as not to form an interface therebetween, and the metal layer is infiltrated into plural pores of the second ceramic layer to be coupled to the ceramic layers, whereby interfacial coupling force between the ceramic layers and the metal layer is very high, thereby providing significantly improved heat dissipation characteristics.

公开(公告)号：US08920707B2

公开(公告)日：2014-12-30

申请号：US13726378

申请日：2012-12-24

申请人： Korea Institute of Machinery & Materials

发明人： Sang-Kwan Lee ,  Sang-Bok Lee ,  Jung-Yeul Yun

IPC分类号： C04B41/88 ,  B29C67/04 ,  C22C32/00 ,  H01L23/373 ,  C04B35/645 ,  F21V29/00 ,  B22F7/06 ,  C04B41/45 ,  F28F21/04 ,  C04B41/00 ,  B32B18/00 ,  C04B111/00 ,  F28F13/00 ,  H01L33/64 ,  F28F21/08

CPC分类号： C09K5/14 ,  B22F7/062 ,  B29C67/04 ,  B32B5/16 ,  B32B5/18 ,  B32B7/04 ,  B32B9/005 ,  B32B9/041 ,  B32B15/04 ,  B32B18/00 ,  B32B2250/03 ,  B32B2264/107 ,  B32B2307/302 ,  C04B35/645 ,  C04B41/009 ,  C04B41/4523 ,  C04B41/88 ,  C04B2111/00844 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/36 ,  C04B2237/361 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/586 ,  C04B2237/704 ,  C22C32/0005 ,  C22C32/0021 ,  C22C32/0036 ,  C22C32/0047 ,  C22C32/0052 ,  C22C32/0068 ,  F21V29/86 ,  F21V29/89 ,  F28F13/003 ,  F28F21/04 ,  F28F21/08 ,  H01L23/3731 ,  H01L23/3733 ,  H01L33/642 ,  H01L2924/0002 ,  Y10T428/24992 ,  Y10T428/249957 ,  C04B35/00 ,  C04B38/00 ,  C04B35/10 ,  C04B41/4521 ,  C04B41/5155 ,  C04B41/515 ,  C04B41/5127 ,  H01L2924/00

摘要： The present disclosure provides a composite heat-dissipation substrate and a method of manufacturing the same. The composite heat-dissipation substrate includes a first ceramic layer having insulating properties, a second porous ceramic layer and a metal layer, wherein the first ceramic layer and the second ceramic layer are continuously connected to each other so as not to form an interface therebetween, and the metal layer is infiltrated into plural pores of the second ceramic layer to be coupled to the ceramic layers, whereby interfacial coupling force between the ceramic layers and the metal layer is very high, thereby providing significantly improved heat dissipation characteristics.

摘要翻译： 本发明提供一种复合散热基板及其制造方法。 复合散热基板包括具有绝缘性的第一陶瓷层，第二多孔陶瓷层和金属层，其中第一陶瓷层和第二陶瓷层彼此连续地连接，以便不在其间形成界面， 并且金属层渗透到要耦合到陶瓷层的第二陶瓷层的多个孔中，由此陶瓷层和金属层之间的界面耦合力非常高，从而提供显着改善的散热特性。