Strain sensor and method of fabricating the same

    公开(公告)号:US10859450B2

    公开(公告)日:2020-12-08

    申请号:US16564198

    申请日:2019-09-09

    IPC分类号: G01L1/00 G01L1/22 G01L1/18

    摘要: The present disclosure discloses a strain sensor and a method of fabricating the same. The strain sensor according to an embodiment of the present disclosure includes an X-axis sensor formed on a flexible insulating substrate and responsible for sensing X-axis strain; a Y-axis sensor formed on the flexible insulating substrate to be orthogonal to the X-axis sensor and responsible for sensing Y-axis strain; a metal electrode formed on a region of the flexible insulating substrate where the X-axis sensor and the Y-axis sensor are not formed; and an encapsulation layer formed on the X-axis sensor, the Y-axis sensor, and the metal electrode. In this case, the X-axis sensor and the Y-axis sensor have a metal-insulator heterostructure.

    High-sensitivity temperature sensor and method of manufacturing the same

    公开(公告)号:US11788901B2

    公开(公告)日:2023-10-17

    申请号:US17074821

    申请日:2020-10-20

    IPC分类号: G01K7/00 G01K7/18

    CPC分类号: G01K7/186

    摘要: Disclosed are a high-sensitivity temperature sensor and a method of manufacturing the same. A high-sensitivity temperature sensor according to an embodiment of the present disclosure includes a stretchable substrate; a first temperature-sensing layer formed on the stretchable substrate and configured to include a first temperature-sensing part in which cracks are formed by conductive nanoparticles surrounded with a second organic ligand; first and second electrodes formed to be spaced apart from each other on the first temperature-sensing layer and configured to include conductive nanoparticles surrounded with an inorganic ligand; a second temperature-sensing part formed between the first and second electrodes and cracked due to the conductive nanoparticles surrounded with the second organic ligand; a second temperature-sensing layer formed on the first and second electrodes and cracked due to the conductive nanoparticles surrounded with the second organic ligand; and a protective layer formed on the second temperature-sensing part.