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    SOLID-STATE IMAGING DEVICE AND METHOD OF FABRICATING THE SAME
    1.
    发明申请
    SOLID-STATE IMAGING DEVICE AND METHOD OF FABRICATING THE SAME 有权
    固态成像装置及其制造方法

    公开(公告)号：US20080315340A1

    公开(公告)日：2008-12-25

    申请号：US12102328

    申请日：2008-04-14

    申请人： Kouichi Harada ,  Yasuhiro Ueda ,  Nobuhiko Umezu ,  Kazushi Wada ,  Yoshinori Toumiya ,  Takeshi Matsuda

    发明人： Kouichi Harada ,  Yasuhiro Ueda ,  Nobuhiko Umezu ,  Kazushi Wada ,  Yoshinori Toumiya ,  Takeshi Matsuda

    IPC分类号： H01L31/0232

    CPC分类号： H01L27/1462 ,  H01L27/14627

    摘要： A solid-state imaging device includes a layer including an on-chip lens above a sensor section, and the layer including the on-chip lens is composed of an inorganic film which transmits ultraviolet light. The layer including the on-chip lens may further include a planarizing film located below the on-chip lens. A method of fabricating a solid-state imaging device includes the steps of forming a planarizing film composed of a first inorganic film, forming a second inorganic film on the planarizing film, forming a lens-shaped resist layer on the second inorganic film, and etching back the resist layer to form an on-chip lens composed of the second inorganic film. The first inorganic film constituting the planarizing film and the second inorganic film constituting the on-chip lens preferably transmit ultraviolet light.

    摘要翻译： 固态成像装置包括在传感器部分上方具有片上透镜的层，并且包括片上透镜的层由透射紫外光的无机膜构成。 包括片上透镜的层还可以包括位于片上透镜下方的平坦化膜。 制造固态成像装置的方法包括以下步骤：形成由第一无机膜构成的平坦化膜，在平坦化膜上形成第二无机膜，在第二无机膜上形成透镜形状的抗蚀剂层，以及蚀刻 将抗蚀剂层背回以形成由第二无机膜构成的片上透镜。 构成平坦化膜的第一无机膜和构成片上透镜的第二无机膜优选透射紫外光。

    Solid-state imaging device and method of fabricating the same
    2.
    发明授权
    Solid-state imaging device and method of fabricating the same 失效
    固态成像装置及其制造方法

    公开(公告)号：US08253142B1

    公开(公告)日：2012-08-28

    申请号：US09649570

    申请日：2000-08-28

    申请人： Kouichi Harada ,  Yasuhiro Ueda ,  Nobuhiko Umezu ,  Kazushi Wada ,  Yoshinori Toumiya ,  Takeshi Matsuda

    发明人： Kouichi Harada ,  Yasuhiro Ueda ,  Nobuhiko Umezu ,  Kazushi Wada ,  Yoshinori Toumiya ,  Takeshi Matsuda

    IPC分类号： H01L27/14

    CPC分类号： H01L27/1462 ,  H01L27/14627

    摘要： A solid-state imaging device includes a layer including an on-chip lens above a sensor section, and the layer including the on-chip lens is composed of an inorganic film which transmits ultraviolet light. The layer including the on-chip lens may further include a planarizing film located below the on-chip lens. A method of fabricating a solid-state imaging device includes the steps of forming a planarizing film composed of a first inorganic film, forming a second inorganic film on the planarizing film, forming a lens-shaped resist layer on the second inorganic film, and etching back the resist layer to form an on-chip lens composed of the second inorganic film. The first inorganic film constituting the planarizing film and the second inorganic film constituting the on-chip lens preferably transmit ultraviolet light.

    摘要翻译： 固态成像装置包括在传感器部分上方具有片上透镜的层，并且包括片上透镜的层由透射紫外光的无机膜构成。 包括片上透镜的层还可以包括位于片上透镜下方的平坦化膜。 制造固态成像装置的方法包括以下步骤：形成由第一无机膜构成的平坦化膜，在平坦化膜上形成第二无机膜，在第二无机膜上形成透镜形状的抗蚀剂层，以及蚀刻 将抗蚀剂层背回以形成由第二无机膜构成的片上透镜。 构成平坦化膜的第一无机膜和构成片上透镜的第二无机膜优选透射紫外光。

    Solid-state imaging device and method of fabricating the same
    3.
    发明授权
    Solid-state imaging device and method of fabricating the same 有权
    固态成像装置及其制造方法

    公开(公告)号：US08729650B2

    公开(公告)日：2014-05-20

    申请号：US12102328

    申请日：2008-04-14

    申请人： Kouichi Harada ,  Yasuhiro Ueda ,  Nobuhiko Umezu ,  Kazushi Wada ,  Yoshinori Toumiya ,  Takeshi Matsuda

    发明人： Kouichi Harada ,  Yasuhiro Ueda ,  Nobuhiko Umezu ,  Kazushi Wada ,  Yoshinori Toumiya ,  Takeshi Matsuda

    IPC分类号： H01L27/14

    CPC分类号： H01L27/1462 ,  H01L27/14627

    摘要： A solid-state imaging device includes a layer including an on-chip lens above a sensor section, and the layer including the on-chip lens is composed of an inorganic film which transmits ultraviolet light. The layer including the on-chip lens may further include a planarizing film located below the on-chip lens. A method of fabricating a solid-state imaging device includes the steps of forming a planarizing film composed of a first inorganic film, forming a second inorganic film on the planarizing film, forming a lens-shaped resist layer on the second inorganic film, and etching back the resist layer to form an on-chip lens composed of the second inorganic film. The first inorganic film constituting the planarizing film and the second inorganic film constituting the on-chip lens preferably transmit ultraviolet light.

    摘要翻译： 固态成像装置包括在传感器部分上方具有片上透镜的层，并且包括片上透镜的层由透射紫外光的无机膜构成。 包括片上透镜的层还可以包括位于片上透镜下方的平坦化膜。 制造固态成像装置的方法包括以下步骤：形成由第一无机膜构成的平坦化膜，在平坦化膜上形成第二无机膜，在第二无机膜上形成透镜状抗蚀剂层， 将抗蚀剂层背回以形成由第二无机膜构成的片上透镜。 构成平坦化膜的第一无机膜和构成片上透镜的第二无机膜优选透射紫外光。

    Connector
    4.
    发明授权
    Connector 有权

    公开(公告)号：US10046157B2

    公开(公告)日：2018-08-14

    申请号：US13876747

    申请日：2011-09-27

    申请人： Yasuhiro Ueda ,  Yasunobu Zushi

    发明人： Yasuhiro Ueda ,  Yasunobu Zushi

    IPC分类号： A61M39/22 ,  A61M39/04 ,  A61M39/26 ,  A61M39/00 ,  A61M39/10 ,  A61M39/24

    摘要： A connector of the present invention includes a housing and a valve, wherein the housing has a flow path and a pipe connecting port, and the valve is formed of an elastic material and is adapted to block the pipe connecting port. The valve has a substantially columnar deformable portion. The deformable portion has a top surface exposed from the pipe connecting port, a bottom surface opposite to the top surface, and a slit that extends from the top surface to the bottom surface. When the top surface is pressed by the pipe, the deformable portion of the valve will be displaced toward the flow path while elastically deforming, so that inner surfaces that define the slit will face the flow path, and the top surface will form an opening that communicates with the flow path.

    Solar cell module, arrangement structure of the same, and method for arranging the same
    5.
    发明授权
    Solar cell module, arrangement structure of the same, and method for arranging the same 有权
    太阳能电池模块，其配置结构及其布置方法

    公开(公告)号：US08853520B2

    公开(公告)日：2014-10-07

    申请号：US13063195

    申请日：2009-09-02

    申请人： Yasuhiro Ueda ,  Takeharu Yamawaki ,  Kensuke Ishida ,  Takeharu Nakajima ,  Tadashi Obayashi

    发明人： Yasuhiro Ueda ,  Takeharu Yamawaki ,  Kensuke Ishida ,  Takeharu Nakajima ,  Tadashi Obayashi

    IPC分类号： H01L31/042 ,  H01L31/048 ,  H01L31/05

    CPC分类号： H01L31/0504 ,  H01L31/05 ,  H02S20/23 ,  H02S40/34 ,  H02S40/36 ,  Y02B10/12 ,  Y02E10/50

    摘要： It is an object to provide a solar cell module achieving reduced improper wiring and improved working efficiency.The present invention provides a solar cell module 10 including a solar cell panel 12, a terminal box 14 housing a plus electrode-connecting terminal in electrical connection with a positive electrode of the panel 12 and a minus electrode-connecting terminal in electrical connection with a negative electrode of the panel 12, a first cable 16 consisting of one of two positive inner wires 24, 24 connected to the plus electrode-connecting terminal and one of two negative inner wires 26, 26 connected to the minus electrode-connecting terminal, in which the wires 24 and 26 are brought together, a second connector 18 consisting of the other of the two positive inner wires 24, 24 and the other of the two negative inner wires 26, 26, in which the wires 24 and 26 are brought together, a first connector 20 connected to the first cable 16, and a second connector 22 connected to the second cable 18, and being characterized in that the first cable 16 is shorter than the second cable 18.

    摘要翻译： 本发明的目的是提供一种太阳能电池模块，其实现了不恰当的布线减少和工作效率的提高。 本发明提供一种太阳能电池模块10，其包括太阳能电池板12，容纳与面板12的正电极电连接的正电极连接端子的端子盒14和与电极连接的负电极连接端子 面板12的负极，连接到正电极连接端子的两个正内部线24,24和连接到负电极连接端子的两个负的内部电线26,26中的一个组成的第一电缆16， 电线24和26组合在一起的第二连接器18由两根正内线24,24中的另一个和两条负内线26,26中的另一个组成的第二连接器18，其中电线24和26组合在一起 连接到第一电缆16的第一连接器20和连接到第二电缆18的第二连接器22，其特征在于第一电缆16比第二电缆18短。

    ELECTROLYTIC SOLUTION FOR ALUMINUM ELECTROLYTIC CAPACITOR, AND ALUMINUM ELECTROLYTIC CAPACITOR USING SAME
    6.
    发明申请
    ELECTROLYTIC SOLUTION FOR ALUMINUM ELECTROLYTIC CAPACITOR, AND ALUMINUM ELECTROLYTIC CAPACITOR USING SAME 有权
    用于铝电解电容器的电解液和使用其的铝电解电容器

    公开(公告)号：US20120235072A1

    公开(公告)日：2012-09-20

    申请号：US13511274

    申请日：2010-10-22

    申请人： Satoshi Nishitani ,  Yuichiro Tsubaki ,  Satoshi Yamashita ,  Yasuhiro Ueda

    发明人： Satoshi Nishitani ,  Yuichiro Tsubaki ,  Satoshi Yamashita ,  Yasuhiro Ueda

    IPC分类号： H01G9/035

    CPC分类号： H01G9/035 ,  H01G9/045 ,  Y02T10/7022

    摘要： Provided is an electrolytic solution for an aluminum electrolytic capacitor, which shows a specific conductivity, a high sparking voltage, and a characteristic of causing only a slight expansion of the capacitor in the reflow process, each being comparable with conventional alkyl phosphate anions, and which has high reliability without causing a short circuit. Also provided is an aluminum electrolytic capacitor. The present invention is directed to an electrolytic solution for an aluminum electrolytic capacitor, comprising an electrolyte (C) comprising an alkyl phosphate anion (a) represented by the general formula (1)/(2) and an amidinium cation (b); a borate ester (H) which is obtained by reacting boric acid (d) with diethylne glycol (e) and a polyalkylene glycol (f) having a molecular weight of 130-350 and/or a polyalkylene glycol monoalkyl ether (g) having a molecular weight of 130-350, and which has a boron content of 5-14 wt %; and an organic solvent (J).

    摘要翻译： 本发明提供一种铝电解电容器的电解液，其显示比电导率高，火花电压高，并且在回流工艺中仅引起电容器略微膨胀的特性，其均与常规的磷酸烷基酯阴离子相当，并且其中 具有高可靠性而不引起短路。 还提供铝电解电容器。 本发明涉及一种铝电解电容器用电解液，其包含由通式（1）/（2）表示的磷酸烷基酯阴离子（a）和脒阳离子（b）构成的电解质（C）。 通过使硼酸（d）与二乙二醇（e）和分子量为130-350的聚亚烷基二醇（f）和/或聚亚烷基二醇单烷基醚（g）反应获得的硼酸酯（H），其具有 分子量为130-350，硼含量为5〜14重量％。 和有机溶剂（J）。