公开(公告)号：US08500298B2

公开(公告)日：2013-08-06

申请号：US13034948

申请日：2011-02-25

申请人： Kozo Ogawa ,  Kazunari Higuchi ,  Shigetoshi Komiyama ,  Takayoshi Moriyama ,  Shinichi Kumashiro

发明人： Kozo Ogawa ,  Kazunari Higuchi ,  Shigetoshi Komiyama ,  Takayoshi Moriyama ,  Shinichi Kumashiro

IPC分类号： F21V1/00 ,  F21V11/00 ,  F21V21/00

CPC分类号： F21K9/00 ,  F21S8/026 ,  F21V19/0055 ,  F21V21/041 ,  F21Y2105/10 ,  F21Y2115/10

摘要： According to one embodiment, a lighting fixture includes a fixture body and a plurality of light-emitting modules. A plurality of light-emitting module arrangement portions are formed on the surface of the fixture body. The light-emitting modules are arranged on the light-emitting module arrangement portions of the fixture body and annularly arranged so that a space is formed at the center area of the fixture body. Semiconductor light-emitting elements are disposed on the surface of the light-emitting module, and a wiring connector is arranged at the space side of the substrate.

摘要翻译： 根据一个实施例，照明器具包括固定体和多个发光模块。 在固定体的表面上形成有多个发光模块配置部。 发光模块布置在固定体的发光模块布置部分上，并且环形布置成在夹具本体的中心区域形成空间。 半导体发光元件设置在发光模块的表面上，并且布线连接器布置在基板的空间侧。

公开(公告)号：USD656263S1

公开(公告)日：2012-03-20

申请号：US29369103

申请日：2010-09-02

申请人： Kozo Ogawa ,  Kazunari Higuchi ,  Shigetoshi Komiyama ,  Takayoshi Moriyama

设计人： Kozo Ogawa ,  Kazunari Higuchi ,  Shigetoshi Komiyama ,  Takayoshi Moriyama

公开(公告)号：US20080191620A1

公开(公告)日：2008-08-14

申请号：US10599296

申请日：2005-03-23

申请人： Takayoshi Moriyama ,  Akiko Nakanishi ,  Masami Iwamoto ,  Shinji Nogi ,  Kozo Ogawa ,  Keiichi Shimizu ,  Akiko Saitou ,  Seiko Kawashima ,  Tomohiro Sanpei ,  Masahiro Izumi ,  Masahiro Toda

发明人： Takayoshi Moriyama ,  Akiko Nakanishi ,  Masami Iwamoto ,  Shinji Nogi ,  Kozo Ogawa ,  Keiichi Shimizu ,  Akiko Saitou ,  Seiko Kawashima ,  Tomohiro Sanpei ,  Masahiro Izumi ,  Masahiro Toda

IPC分类号： H01L33/00 ,  H01J1/62

CPC分类号： H01L33/56 ,  H01L25/0753 ,  H01L33/507 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting device, with which the luminous efficiency is improved and the color non-uniformity of the emitted light is lessened. Specifically, a light emitting diode element is covered with a diffusing layer, with which a diffusing agent is added to a resin. A phosphor layer, with which a phosphor is added to a resin, is disposed on top of the diffusing layer. The light from the light emitting diode element is diffused by the diffusing layer. By exciting the phosphor layer with the light diffused by the diffusing layer and thereby making the phosphor layer emit light, the luminous efficiency is improved and the color non-uniformity is lessened.

摘要翻译： 发光装置，发光效率提高，发光的颜色不均匀性降低。 具体地，发光二极管元件被扩散层覆盖，扩散剂通过该扩散层向树脂中添加扩散剂。 将荧光体添加到树脂中的磷光体层设置在漫射层的顶部。 来自发光二极管元件的光被扩散层扩散。 通过由扩散层扩散的光激发荧光体层，从而使荧光体层发光，提高了发光效率，降低了颜色不均匀性。

公开(公告)号：USD563595S1

公开(公告)日：2008-03-04

申请号：US29227711

申请日：2005-04-13

申请人： Kazuo Egawa ,  Takayoshi Moriyama ,  Masami Iwamoto ,  Kozo Ogawa

设计人： Kazuo Egawa ,  Takayoshi Moriyama ,  Masami Iwamoto ,  Kozo Ogawa

公开(公告)号：US20080239724A1

公开(公告)日：2008-10-02

申请号：US10599276

申请日：2005-03-23

申请人： Takayoshi Moriyama ,  Akiko Nakanishi ,  Masami Iwamoto ,  Shinji Nogi ,  Kozo Ogawa ,  Keiichi Shimizu ,  Akiko Saitou ,  Seiko Kawashima ,  Tomohiro Sanpei ,  Masahiro Toda

发明人： Takayoshi Moriyama ,  Akiko Nakanishi ,  Masami Iwamoto ,  Shinji Nogi ,  Kozo Ogawa ,  Keiichi Shimizu ,  Akiko Saitou ,  Seiko Kawashima ,  Tomohiro Sanpei ,  Masahiro Toda

IPC分类号： F21V7/00

CPC分类号： H01L33/58 ,  H01L33/54 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/0401

摘要： An illuminating device that is improved in heat radiation property and is suppressed in the occurrence of peeling and warping of a reflector. The reflector having a housing portion that houses a light emitting diode element is disposed on a substrate a visible light converting layer is formed on the housing portion and a lens is disposed on the reflector. A circuit pattern, the light emitting diode element, the reflector, the visible light converting layer, and the lens are disposed on the substrate, and the reflector and the lens are respectively adhered using a same type of adhesive agent. The heat radiation property can thus be improved, the peeling and warping of the reflector, etc., is suppressed, and accordingly, the optical characteristics of the device can be maintained.

摘要翻译： 一种改善了散热性的照明装置，并且在反射器的剥离和翘曲的发生中被抑制。 具有容纳发光二极管元件的壳体部分的反射器设置在基板上，可见光转换层形成在壳体部分上，并且透镜设置在反射器上。 电路图案，发光二极管元件，反射器，可见光转换层和透镜设置在基板上，并且使用相同类型的粘合剂分别粘附反射器和透镜。 因此能够提高散热性，能够抑制反射板的剥离，翘曲等，能够维持该装置的光学特性。

公开(公告)号：US08899795B2

公开(公告)日：2014-12-02

申请号：US13063871

申请日：2010-02-19

申请人： Toshiya Tanaka ,  Keiichi Shimizu ,  Takumi Suwa ,  Makoto Sakai ,  Kozo Ogawa ,  Sigeru Osawa ,  Takeshi Hisayasu ,  Hitoshi Kawano

发明人： Toshiya Tanaka ,  Keiichi Shimizu ,  Takumi Suwa ,  Makoto Sakai ,  Kozo Ogawa ,  Sigeru Osawa ,  Takeshi Hisayasu ,  Hitoshi Kawano

IPC分类号： F21V29/00 ,  F21V17/14 ,  F21V17/12 ,  F21V19/00 ,  F21V15/01 ,  F21K99/00 ,  F21Y101/02 ,  F21Y103/02 ,  F21V11/06 ,  F21S8/04

CPC分类号： F21V19/0005 ,  F21K9/20 ,  F21S8/04 ,  F21V11/06 ,  F21V17/12 ,  F21V17/14 ,  F21V29/507 ,  F21V29/70 ,  F21V29/773 ,  F21Y2103/33 ,  F21Y2115/10

摘要： In a lamp device 12 using a GX53-type cap 31 and also using an LED 56 as a light source, there is regulated an appropriate configuration of a metallic cover 32. A cap 31 and a lighting device 36 are arranged on an upper surface side of the metallic cover 32, and a substrate 33 on which the LED 56 is mounted is arranged on a lower surface side thereof. The metallic cover 32 has an approximately cylindrical shape with a maximum outer diameter D of 80 to 150 mm, a height H of 5 to 25 mm, and 2π (D/2) H/W, that is, an area of the outer peripheral surface per gross input power W to the lamp device 12 being in a range of 200 to 800 mm2/W. The gross input power W is 5 to 20 W.

摘要翻译： 在使用GX53型盖31并且还使用LED56作为光源的灯装置12中，调节金属盖32的适当构造。帽31和照明装置36布置在上表面侧 的金属盖32和其上安装有LED 56的基板33布置在其下表面侧。 金属盖32具有近似圆筒形状，最大外径D为80至150mm，高度H为5至25mm，2＆pgr; （D / 2）H / W，即，对于灯装置12的总输入功率W的外周面的面积在200〜800mm 2 / W的范围内。 总输入功率W为5〜20W。

公开(公告)号：US08632212B2

公开(公告)日：2014-01-21

申请号：US13024384

申请日：2011-02-10

申请人： Soichi Shibusawa ,  Kozo Ogawa ,  Kiyoshi Nishimura ,  Nobuhiko Betsuda

发明人： Soichi Shibusawa ,  Kozo Ogawa ,  Kiyoshi Nishimura ,  Nobuhiko Betsuda

IPC分类号： F21S4/00

CPC分类号： F21V31/04 ,  F21K9/00 ,  F21S4/28 ,  F21S8/04 ,  F21V3/0625 ,  F21V7/22 ,  F21V19/0055 ,  F21V23/00 ,  F21V29/503 ,  F21Y2103/10 ,  F21Y2113/00 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to one embodiment, a light-emitting device comprises a substrate on which a plurality of light-emitting elements are arranged and mounted in two lines; and sealing members of two lines each sealing the plurality of light-emitting elements of each line. A distance between the lines of the sealing members is equal to 0.5 times or more but 2 times or less a width of the sealing member of each line.

摘要翻译： 根据一个实施例，一种发光器件包括其上布置并安装有两条线的多个发光元件的基板; 以及密封各线的多个发光元件的两条线的密封构件。 密封构件的线之间的距离等于每条线的密封构件的宽度的0.5倍以上2倍以下。

公开(公告)号：US08197097B2

公开(公告)日：2012-06-12

申请号：US12467395

申请日：2009-05-18

申请人： Kozo Ogawa ,  Kiyoshi Nishimura ,  Nobuhiko Betsuda ,  Hiroki Tamai ,  Akiko Saito

发明人： Kozo Ogawa ,  Kiyoshi Nishimura ,  Nobuhiko Betsuda ,  Hiroki Tamai ,  Akiko Saito

IPC分类号： F21V29/00

CPC分类号： F21K9/00 ,  F21S2/005 ,  F21V17/12 ,  F21V19/0035 ,  F21V19/0055 ,  F21V23/005 ,  F21V29/505 ,  F21V29/507 ,  F21V29/713 ,  F21V29/74 ,  F21Y2105/10 ,  F21Y2113/00 ,  F21Y2115/10 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： The light source unit is provided with a substrate and a decorative cover having thermal conductivity. The substrate includes a circuit pattern area, in which a plurality of LED chips are disposed, at the middle part thereof, has thermal conductivity, and transmits heat from the circuit pattern area to an area in the outer circumferential direction thereof. The decorative cover encloses the substrate, is electrically insulated from the circuit pattern area, and is thermally coupled to the surface side of the substrate at the periphery of the circuit pattern area by being face-contacted thereto. Heat of the substrate can be radiated by the decorative cover while securing an electric insulation property with respect to the circuit pattern area.

摘要翻译： 光源单元设置有基板和具有导热性的装饰盖。 基板包括在其中间部分设置有多个LED芯片的电路图形区域，具有导热性，并且将热量从电路图案区域传递到其外周方向的区域。 装饰盖包围基板，与电路图形区域电绝缘，并且通过与电路图形区域的周边面接触而与基板的表面侧热耦合。 可以通过装饰盖辐射基板的热量，同时确保相对于电路图案区域的电绝缘性能。

公开(公告)号：USD660467S1

公开(公告)日：2012-05-22

申请号：US29399573

申请日：2011-08-16

申请人： Junichiro Yamamoto ,  Tomohiko Sato ,  Makoto Sakai ,  Kozo Ogawa ,  Kazutoshi Mita

设计人： Junichiro Yamamoto ,  Tomohiko Sato ,  Makoto Sakai ,  Kozo Ogawa ,  Kazutoshi Mita

公开(公告)号：US08057072B2

公开(公告)日：2011-11-15

申请号：US12634710

申请日：2009-12-10

申请人： Erika Takenaka ,  Kozo Ogawa ,  Keiichi Shimizu ,  Hiroaki Watanabe ,  Akimichi Takahashi ,  Shinji Nogi ,  Shinichi Kumashiro

发明人： Erika Takenaka ,  Kozo Ogawa ,  Keiichi Shimizu ,  Hiroaki Watanabe ,  Akimichi Takahashi ,  Shinji Nogi ,  Shinichi Kumashiro

IPC分类号： F21V3/00

CPC分类号： F21K9/00 ,  F21K9/232 ,  F21K9/64 ,  F21V3/00 ,  F21V9/30 ,  F21V29/502 ,  F21V29/70 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light-emitting module includes at least one light-emitting element provided on a mount surface of a substratum. A translucent member is provided so as to face the mount surface of the substratum. The translucent member is separated from the light-emitting element and contains a phosphor material that converts a wavelength of light emitted by the light-emitting element. A frame having heat conducting properties is interposed between the substratum and the translucent member. The frame surrounds the light-emitting element. The frame includes an opening that leads light emitted by the light-emitting element to the translucent member, and a heat conductor thermally connected to the translucent member. The heat conductor includes a heat radiator exposed outside of the translucent member.

摘要翻译： 发光模块包括设置在基底的安装表面上的至少一个发光元件。 提供半透明构件以面对底层的安装表面。 半透明构件与发光元件分离并且包含转换由发光元件发射的光的波长的荧光体材料。 具有导热性的框架插入在基底和半透明构件之间。 框架围绕发光元件。 框架包括将由发光元件发射的光引导到半透明构件的开口，以及热连接到半透明构件的热导体。 热导体包括暴露在半透明构件外部的散热器。