公开(公告)号：US07683478B2

公开(公告)日：2010-03-23

申请号：US12026776

申请日：2008-02-06

申请人： Kuan-Neng Chen ,  Bruce K. Furman ,  Edmund J. Sprogis ,  Anna W. Topol ,  Cornelia K. Tsang ,  Matthew R. Wordeman ,  Albert M. Young

发明人： Kuan-Neng Chen ,  Bruce K. Furman ,  Edmund J. Sprogis ,  Anna W. Topol ,  Cornelia K. Tsang ,  Matthew R. Wordeman ,  Albert M. Young

IPC分类号： H01L23/34

CPC分类号： H01L25/50 ,  H01L2225/06513 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/00

摘要： A sealed microelectronic structure which provides mechanical stress endurance and includes at least two chips being electrically connected to a semiconductor structure at a plurality of locations. Each chip includes a continuous bonding material along it's perimeter and at least one support column connected to each of the chips positioned within the perimeter of each chip. Each support column extends outwardly such that when the at least two chips are positioned over one another the support columns are in mating relation to each other. A seal between the at least two chips results from the overlapping relation of the chip to one another such that the bonding material and support columns are in mating relation to each other. Thus, the seal is formed when the at least two chips are mated together, and results in a bonded chip structure.

摘要翻译： 一种密封的微电子结构，其提供机械应力耐久性并且包括在多个位置处电连接到半导体结构的至少两个芯片。 每个芯片沿着其周边包括连续的接合材料，以及连接到位于每个芯片的周边内的每个芯片的至少一个支撑柱。 每个支撑柱向外延伸，使得当至少两个芯片彼此定位时，支撑柱彼此配合。 至少两个芯片之间的密封由芯片彼此的重叠关系产生，使得接合材料和支撑柱彼此配合。 因此，当至少两个芯片配合在一起时形成密封，并且导致粘合芯片结构。

公开(公告)号：US20080124835A1

公开(公告)日：2008-05-29

申请号：US11534366

申请日：2006-11-03

申请人： Kuan-Neng Chen ,  Bruce K. Furman ,  Edmund J. Sprogis ,  Anna W. Topol ,  Cornelia K. Tsang ,  Matthew R. Wordeman ,  Albert M. Young

发明人： Kuan-Neng Chen ,  Bruce K. Furman ,  Edmund J. Sprogis ,  Anna W. Topol ,  Cornelia K. Tsang ,  Matthew R. Wordeman ,  Albert M. Young

IPC分类号： H01L21/50

CPC分类号： H01L25/50 ,  H01L2224/80895 ,  H01L2225/06513 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/00

摘要： A sealed microelectronic structure which provides mechanical stress endurance and includes at least two chips being electrically connected to a semiconductor structure at a plurality of locations. Each chip includes a continuous bonding material along it's perimeter and at least one support column connected to each of the chips positioned within the perimeter of each chip. Each support column extends outwardly such that when the at least two chips are positioned over one another the support columns are in mating relation to each other. A seal between the at least two chips results from the overlapping relation of the chip to one another such that the bonding material and support columns are in mating relation to each other. Thus, the seal is formed when the at least two chips are mated together, and results in a bonded chip structure.

公开(公告)号：US20080268574A1

公开(公告)日：2008-10-30

申请号：US12035053

申请日：2008-02-21

申请人： Kuan-Neng Chen ,  Bruce K. Furman ,  Edmund J. Sprogis ,  Anna W. Topol ,  Cornelia K. Tsang ,  Matthew R. Wordeman ,  Albert M. Young

发明人： Kuan-Neng Chen ,  Bruce K. Furman ,  Edmund J. Sprogis ,  Anna W. Topol ,  Cornelia K. Tsang ,  Matthew R. Wordeman ,  Albert M. Young

IPC分类号： H01L21/58

CPC分类号： H01L25/50 ,  H01L2224/80895 ,  H01L2225/06513 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/00

摘要： A sealed microelectronic structure which provides mechanical stress endurance and includes at least two chips being electrically connected to a semiconductor structure at a plurality of locations. Each chip includes a continuous bonding material along it's perimeter and at least one support column connected to each of the chips positioned within the perimeter of each chip. Each support column extends outwardly such that when the at least two chips are positioned over one another the support columns are in mating relation to each other. A seal between the at least two chips results from the overlapping relation of the chip to one another such that the bonding material and support columns are in mating relation to each other. Thus, the seal is formed when the at least two chips are mated together, and results in a bonded chip structure.

摘要翻译： 一种密封的微电子结构，其提供机械应力耐久性并且包括在多个位置处电连接到半导体结构的至少两个芯片。 每个芯片沿着其周边包括连续的接合材料，以及连接到位于每个芯片的周边内的每个芯片的至少一个支撑柱。 每个支撑柱向外延伸，使得当至少两个芯片彼此定位时，支撑柱彼此配合。 至少两个芯片之间的密封由芯片彼此的重叠关系产生，使得接合材料和支撑柱彼此配合。 因此，当至少两个芯片配合在一起时形成密封，并且导致粘合芯片结构。

公开(公告)号：US07786596B2

公开(公告)日：2010-08-31

申请号：US12038501

申请日：2008-02-27

申请人： Kuan-Neng Chen ,  Bruce K. Furman ,  Edmund J. Sprogis ,  Anna W. Topol ,  Cornelia K. Tsang ,  Matthew R. Wordeman ,  Albert M. Young

发明人： Kuan-Neng Chen ,  Bruce K. Furman ,  Edmund J. Sprogis ,  Anna W. Topol ,  Cornelia K. Tsang ,  Matthew R. Wordeman ,  Albert M. Young

IPC分类号： H01L23/48

CPC分类号： H01L25/50 ,  H01L2225/06513 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/00

摘要： A sealed microelectronic structure which provides mechanical stress endurance and includes at least two chips being electrically connected to a semiconductor structure at a plurality of locations. Each chip includes a continuous bonding material along it's perimeter and at least one support column connected to each of the chips positioned within the perimeter of each chip. Each support column extends outwardly such that when the at least two chips are positioned over one another the support columns are in mating relation to each other. A seal between the at least two chips results from the overlapping relation of the chip to one another such that the bonding material and support columns are in mating relation to each other. Thus, the seal is formed when the at least two chips are mated together, and results in a bonded chip structure.

公开(公告)号：US20090140404A1

公开(公告)日：2009-06-04

申请号：US12038501

申请日：2008-02-27

申请人： Kuan-Neng Chen ,  Bruce K. Furman ,  Edmund J. Sprogis ,  Anna W. Topol ,  Cornelia K. Tsang ,  Matthew R. Wordeman ,  Albert M. Young

发明人： Kuan-Neng Chen ,  Bruce K. Furman ,  Edmund J. Sprogis ,  Anna W. Topol ,  Cornelia K. Tsang ,  Matthew R. Wordeman ,  Albert M. Young

IPC分类号： H01L23/10

CPC分类号： H01L25/50 ,  H01L2225/06513 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/00

摘要： A sealed microelectronic structure which provides mechanical stress endurance and includes at least two chips being electrically connected to a semiconductor structure at a plurality of locations. Each chip includes a continuous bonding material along it's perimeter and at least one support column connected to each of the chips positioned within the perimeter of each chip. Each support column extends outwardly such that when the at least two chips are positioned over one another the support columns are in mating relation to each other. A seal between the at least two chips results from the overlapping relation of the chip to one another such that the bonding material and support columns are in mating relation to each other. Thus, the seal is formed when the at least two chips are mated together, and results in a bonded chip structure.

摘要翻译： 一种密封的微电子结构，其提供机械应力耐久性并且包括在多个位置处电连接到半导体结构的至少两个芯片。 每个芯片沿着其周边包括连续的接合材料，以及连接到位于每个芯片的周边内的每个芯片的至少一个支撑柱。 每个支撑柱向外延伸，使得当至少两个芯片彼此定位时，支撑柱彼此配合。 至少两个芯片之间的密封由芯片彼此的重叠关系产生，使得接合材料和支撑柱彼此配合。 因此，当至少两个芯片配合在一起时形成密封，并且导致粘合芯片结构。

公开(公告)号：US20080142958A1

公开(公告)日：2008-06-19

申请号：US12026776

申请日：2008-02-06

申请人： Kuan-Neng Chen ,  Bruce K. Furman ,  Edmund J. Sprogis ,  Anna W. Topol ,  Cornella K. Tsang ,  Matthew R. Wordeman ,  Albert M. Young

发明人： Kuan-Neng Chen ,  Bruce K. Furman ,  Edmund J. Sprogis ,  Anna W. Topol ,  Cornella K. Tsang ,  Matthew R. Wordeman ,  Albert M. Young

IPC分类号： H01L23/02

CPC分类号： H01L25/50 ,  H01L2225/06513 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/00

摘要： A sealed microelectronic structure which provides mechanical stress endurance and includes at least two chips being electrically connected to a semiconductor structure at a plurality of locations. Each chip includes a continuous bonding material along it's perimeter and at least one support column connected to each of the chips positioned within the perimeter of each chip. Each support column extends outwardly such that when the at least two chips are positioned over one another the support columns are in mating relation to each other. A seal between the at least two chips results from the overlapping relation of the chip to one another such that the bonding material and support columns are in mating relation to each other. Thus, the seal is formed when the at least two chips are mated together, and results in a bonded chip structure.

公开(公告)号：US20120171819A1

公开(公告)日：2012-07-05

申请号：US13417444

申请日：2012-03-12

申请人： Leland Chang ,  Matthew R. Wordeman ,  Albert M. Young

发明人： Leland Chang ,  Matthew R. Wordeman ,  Albert M. Young

IPC分类号： H01L21/50

CPC分类号： H01L25/0657 ,  H01L23/5252 ,  H01L23/5256 ,  H01L24/06 ,  H01L24/14 ,  H01L24/16 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05684 ,  H01L2224/13099 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/00014

摘要： An array of contact pads on a semiconductor structure has a pitch less than twice an overlay tolerance of a bonding process employed to vertically stack semiconductor structures. A set of contact pads within the area of overlay variation for a matching contact pin may be electrically connected to an array of programmable contacts such that one programmable contact is connected to each contact pad within the area of overlay variation. One contact pad may be provided with a plurality of programmable contacts. The variability of contacts between contact pins and contact pads is accommodated by connecting or disconnecting programmable contacts after the stacking of semiconductor structures. Since the pitch of the array of contact pins may be less than twice the overlay variation of the bonding process, a high density of interconnections is provided in the vertically stacked structure.

摘要翻译： 半导体结构上的接触焊盘阵列的间距小于用于垂直堆叠半导体结构的接合工艺的覆盖公差的两倍。 用于匹配接触针的覆盖变化区域内的一组接触焊盘可以电连接到可编程触点阵列，使得一个可编程触点连接到覆盖变化区域内的每个接触焊盘。 一个接触垫可以设置有多个可编程触点。 在半导体结构堆叠之后，通过连接或断开可编程触点来容纳接触引脚和接触焊盘之间的接触的可变性。 由于接触引脚阵列的间距可能小于接合过程的覆盖变化的两倍，所以垂直堆叠结构中提供了高密度的互连。

公开(公告)号：US07545667B2

公开(公告)日：2009-06-09

申请号：US11393270

申请日：2006-03-30

申请人： Bruce G. Elmegreen ,  Lia Krusin-Elbaum ,  Chung Hon Lam ,  Dennis M. Newns ,  Matthew R. Wordeman ,  Albert M. Young

发明人： Bruce G. Elmegreen ,  Lia Krusin-Elbaum ,  Chung Hon Lam ,  Dennis M. Newns ,  Matthew R. Wordeman ,  Albert M. Young

IPC分类号： G11C11/00

CPC分类号： H01L45/144 ,  H01L23/5226 ,  H01L23/5252 ,  H01L23/5256 ,  H01L45/06 ,  H01L45/1206 ,  H01L45/122 ,  H01L45/1226 ,  H01L45/1286 ,  H01L2924/0002 ,  H01L2924/00

摘要： A programmable link structure for use in three dimensional integration (3DI) semiconductor devices includes a via filled at least in part with a phase change material (PCM) and a heating device proximate the PCM. The heating device is configured to switch the conductivity of a transformable portion of the PCM between a lower resistance crystalline state and a higher resistance amorphous state. Thereby, the via defines a programmable link between an input connection located at one end thereof and an output connection located at another end thereof.

摘要翻译： 用于三维积分（3DI）半导体器件的可编程链路结构包括至少部分地填充有相变材料（PCM）和靠近PCM的加热装置的通孔。 加热装置被配置为将PCM的可变形部分的电导率切换到较低电阻结晶状态和较高电阻无定形状态。 因此，通路限定位于其一端的输入连接与位于其另一端的输出连接之间的可编程连接。

公开(公告)号：US20100270676A1

公开(公告)日：2010-10-28

申请号：US12430416

申请日：2009-04-27

申请人： Leland Chang ,  Matthew R. Wordeman ,  Albert M. Young

发明人： Leland Chang ,  Matthew R. Wordeman ,  Albert M. Young

IPC分类号： H01L23/528 ,  H01L21/768

CPC分类号： H01L25/0657 ,  H01L23/5252 ,  H01L23/5256 ,  H01L24/06 ,  H01L24/14 ,  H01L24/16 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05684 ,  H01L2224/13099 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/00014

摘要： An array of contact pads on a semiconductor structure has a pitch less than twice an overlay tolerance of a bonding process employed to vertically stack semiconductor structures. A set of contact pads within the area of overlay variation for a matching contact pin may be electrically connected to an array of programmable contacts such that one programmable contact is connected to each contact pad within the area of overlay variation. One contact pad may be provided with a plurality of programmable contacts. The variability of contacts between contact pins and contact pads is accommodated by connecting or disconnecting programmable contacts after the stacking of semiconductor structures. Since the pitch of the array of contact pins may be less than twice the overlay variation of the bonding process, a high density of interconnections is provided in the vertically stacked structure.

摘要翻译： 半导体结构上的接触焊盘阵列的间距小于用于垂直堆叠半导体结构的接合工艺的覆盖公差的两倍。 用于匹配接触针的覆盖变化区域内的一组接触焊盘可以电连接到可编程触点阵列，使得一个可编程触点连接到覆盖变化区域内的每个接触焊盘。 一个接触垫可以设置有多个可编程触点。 在半导体结构堆叠之后，通过连接或断开可编程触点来容纳接触引脚和接触焊盘之间的接触的可变性。 由于接触引脚阵列的间距可能小于接合过程的覆盖变化的两倍，所以垂直堆叠结构中提供了高密度的互连。

公开(公告)号：US08174841B2

公开(公告)日：2012-05-08

申请号：US12430416

申请日：2009-04-27

申请人： Leland Chang ,  Matthew R. Wordeman ,  Albert M. Young

发明人： Leland Chang ,  Matthew R. Wordeman ,  Albert M. Young

IPC分类号： H01R43/00

CPC分类号： H01L25/0657 ,  H01L23/5252 ,  H01L23/5256 ,  H01L24/06 ,  H01L24/14 ,  H01L24/16 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05684 ,  H01L2224/13099 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/00014

摘要： An array of contact pads on a semiconductor structure has a pitch less than twice an overlay tolerance of a bonding process employed to vertically stack semiconductor structures. A set of contact pads within the area of overlay variation for a matching contact pin may be electrically connected to an array of programmable contacts such that one programmable contact is connected to each contact pad within the area of overlay variation. One contact pad may be provided with a plurality of programmable contacts. The variability of contacts between contact pins and contact pads is accommodated by connecting or disconnecting programmable contacts after the stacking of semiconductor structures. Since the pitch of the array of contact pins may be less than twice the overlay variation of the bonding process, a high density of interconnections is provided in the vertically stacked structure.

摘要翻译： 半导体结构上的接触焊盘阵列的间距小于用于垂直堆叠半导体结构的接合工艺的覆盖公差的两倍。 用于匹配接触针的覆盖变化区域内的一组接触焊盘可以电连接到可编程触点阵列，使得一个可编程触点连接到覆盖变化区域内的每个接触焊盘。 一个接触垫可以设置有多个可编程触点。 在半导体结构堆叠之后，通过连接或断开可编程触点来容纳接触引脚和接触焊盘之间的接触的可变性。 由于接触引脚阵列的间距可能小于接合过程的覆盖变化的两倍，所以垂直堆叠结构中提供了高密度的互连。