公开(公告)号：US06507394B1

公开(公告)日：2003-01-14

申请号：US09449884

申请日：1999-11-30

申请人： Kun-Pi Cheng ,  I-Chung Chang

发明人： Kun-Pi Cheng ,  I-Chung Chang

IPC分类号： G01N2100

CPC分类号： G01N21/9501

摘要： An optical inspection system for detecting defects on the surface of a semiconductor wafer includes two light sources and two light receivers mounted as a common assembly which is rotated such that two curtains of light and corresponding linear photosensor arrays circularly scan the wafer surface. The reflected light is analyzed to determine the presence of surface defects. Marks applied to the wafer surface provide amplitude and timing references used to adjust and synchronize the analyzed signals.

摘要翻译： 用于检测半导体晶片表面上的缺陷的光学检查系统包括两个光源和两个光接收器，其安装为共同组件，其被旋转使得两个窗帘和相应的线性光电传感器阵列循环扫描晶片表面。 分析反射光以确定表面缺陷的存在。 施加到晶片表面的标记提供用于调整和同步分析的信号的幅度和定时参考。

公开(公告)号：US06396567B1

公开(公告)日：2002-05-28

申请号：US09324129

申请日：1999-06-02

申请人： Tsu-Yu Chu ,  I-Chung Chang ,  Kun-Pi Cheng

发明人： Tsu-Yu Chu ,  I-Chung Chang ,  Kun-Pi Cheng

IPC分类号： G03B2772

CPC分类号： G03F7/70058 ,  G03F7/70066 ,  G03F7/70075 ,  G03F7/70191 ,  G03F7/70358 ,  G03F7/70558

摘要： The two dimensional intensity profile of radiation applied to a semiconductor wafer during photolithography is controlled by passing the radiation beam through an attenuating member before the beam is imaged by a mask onto the wafer. The attenuating member is preferably ring shaped and is formed of a semi-transparent material such as Mo Bi Si O4, or a material that is partially reflective of the radiation.

摘要翻译： 在光刻期间施加到半导体晶片的辐射的二维强度分布通过在通过掩模将光束成像到晶片之前使辐射束通过衰减部件来控制。 衰减构件优选为环形，并且由诸如Mo Bi Si O 4的半透明材料或部分反射辐射的材料形成。

公开(公告)号：US06357131B1

公开(公告)日：2002-03-19

申请号：US09467113

申请日：1999-12-20

申请人： Kun Pi Cheng ,  I-Chung Chang

发明人： Kun Pi Cheng ,  I-Chung Chang

IPC分类号： G01B1126

CPC分类号： G03F7/70633 ,  H01L2223/54453 ,  H01L2223/54493

摘要： A method of overlaying two images and from this overlay observe and measure the accuracy of the alignment of the wafer. Wafer misalignment can be readily corrected based on the results of these observations. Alignment marks are provided on the surface of the wafer that is being validated for accuracy of alignment. The position of this mark relative to a pattern provided on the surface of a control wafer is measured and forms an indication of the alignment of the wafer.

摘要翻译： 覆盖两个图像并从该覆盖物的方法观察并测量晶片对准的精度。 基于这些观察结果可以很容易地校正晶圆偏移。 对准标记提供在正在验证的晶圆表面上以进行对准精度。 该标记相对于设置在控制晶片的表面上的图案的位置被测量并且形成晶片对准的指示。

公开(公告)号：US07011754B2

公开(公告)日：2006-03-14

申请号：US10185216

申请日：2002-06-25

申请人： I-Chung Chang

发明人： I-Chung Chang

IPC分类号： B01D29/35

CPC分类号： B01D29/27 ,  B01D2201/304

摘要： A filtering device includes a container, a cover attached on top of the container having a space communicating with an inlet opening and a chamber of the container, and a filter screen received in the container for filtering the fluid from the inlet opening to the chamber of the container. The filter screen includes an upper peripheral flange having a peripheral wall or a peripheral flap for making an excellent seal between the container and the cover. The space of the cover includes a changing volume for decreasing the flowing speed of the fluid.