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公开(公告)号：US09593423B2
公开(公告)日：2017-03-14
申请号：US14218670
申请日：2014-03-18
发明人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shigeru Michiwaki , Manabu Miyawaki
CPC分类号： C23C18/1608 , C23C18/1612 , C23C18/1653 , C23C18/20 , C23C18/204 , C23C18/2086 , C23C18/285 , C23C18/30 , C25D5/56 , C25D11/00 , H05K3/389 , H05K2203/072 , H05K2203/122 , H05K2203/124 , Y10T428/31663 , Y10T428/31678
摘要： The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (α) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (α) by a wet-mode plating technique, wherein the compound (α) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.
摘要翻译： 本发明的目的在于提供一种金属膜不容易脱离的布线基板。 形成金属膜的方法包括在化合物（α）的表面上将含有化合物（α）的试剂涂布在基材表面上的步骤（X）和在化合物（α）的表面上形成金属膜的工序（Y） 湿式电镀技术，其中化合物（α）是每分子具有OH基或OH生成基团，叠氮基和三嗪环的化合物，并且碱包含聚合物。
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公开(公告)号：US20150152124A1
公开(公告)日：2015-06-04
申请号：US14406679
申请日：2012-08-31
申请人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shuukichi Takii , Shigeru Michiwaki , Manabu Miyawaki , Masanori Yanai , Kouichi Kamiyama , Hitomi Chiba , Yasuyuki Masuda
发明人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shuukichi Takii , Shigeru Michiwaki , Manabu Miyawaki , Masanori Yanai , Kouichi Kamiyama , Hitomi Chiba , Yasuyuki Masuda
IPC分类号： C07F7/18
CPC分类号： C07F7/1804 , Y10T428/31678
摘要： Provided is a surface treatment technique whereby excellent adhering function, excellent reacting function and rich diversity can be established. A surface treatment method that comprises applying a solution containing compound (α) to a substrate and thus providing compound (α) thereon, wherein: said compound (α) has at least an M-OH group and/or a group capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; one or more said M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom) are present; said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.
摘要翻译： 提供了一种表面处理技术，其具有优异的粘附功能，优异的反应功能和丰富的多样性。 一种表面处理方法，其特征在于，将含有化合物（α）的溶液涂布在基材上，从而在其上提供化合物（α），其中：所述化合物（α）至少具有M-OH基团和/或能够形成M -OH（其中M表示金属原子），氨基和三嗪环; 存在一个或多个所述M-OH基团和/或能够形成M-OH（其中M表示金属原子）的基团; 所述氨基键合到末端; 存在一个或多个与末端键合的所述氨基; 并且存在一个或多个所述三嗪环。
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公开(公告)号：US09790242B2
公开(公告)日：2017-10-17
申请号：US14406679
申请日：2012-08-31
申请人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shuukichi Takii , Shigeru Michiwaki , Manabu Miyawaki , Masanori Yanai , Kouichi Kamiyama , Hitomi Chiba , Yasuyuki Masuda
发明人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shuukichi Takii , Shigeru Michiwaki , Manabu Miyawaki , Masanori Yanai , Kouichi Kamiyama , Hitomi Chiba , Yasuyuki Masuda
CPC分类号： C07F7/1804 , Y10T428/31678
摘要： A surface treatment technique having excellent adhering function, excellent reacting function and rich diversity is provided. The surface treatment includes applying a solution containing compound (α) to a substrate and thus providing compound (α) thereon, wherein: the compound (α) is at least one of Formula [IV] and Formula [V]: wherein A is —N(Ra)Rb—Si(Rc)n(ORd)3−n, or —N{Rb—Si(Rc)n(ORd)3−n}2, B is ——N(Re)Rf(NH2)m, or —N{Rf(NH2(m}2, C is A, B, or —N(Rg)Rh, D is Ri and wherein each of Ra, Re, and Rg is independently H or a hydrocarbon group, Rb, Rc, Rd, Rf, Rh, and Ri are hydrocarbon groups, n is 0, 1, or 2, and m is 1 or 2.
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4.发明授权Bonding method, bondability improving agent, surface modification method, surface modifying agent, and novel compound 有权粘合方法，粘合性改善剂，表面改性法，表面改性剂，新型化合物公开(公告)号：US09540403B2
公开(公告)日：2017-01-10
申请号：US14954147
申请日：2015-11-30
申请人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo
发明人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo
IPC分类号： C07F7/08 , C08K5/3492 , C08K5/544 , C07D215/54 , C07F7/18 , C07F5/06 , C09J5/00 , C07D251/54
CPC分类号： C07F7/0814 , C07D251/54 , C07F5/068 , C07F7/1804 , C08K5/3492 , C08K5/5442 , C09J5/00 , C09J2205/31 , C09J2483/00 , Y10T428/31536
摘要： To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (α) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (α) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (α) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.
摘要翻译： 为了提供一种可以在材料表面上有效形成-OH基团的技术，其目的在于使材料适合于利用化学反应（化学结合）的结合（例如，用于分子键合）。 [解决方案]接合基板A和基板B的接合方法，其包括：在基板A的表面上涂覆含有下述化合物（α）的试剂的工序; 将基板B配置成与基板A的表面上存在的化合物（α）相对的步骤; 以及通过对基板A和/或基板B施加力将基板A和基板B一体接合的步骤。化合物（α）是具有OH基或OH形成基的化合物，叠氮化物 基团和三嗪环，并且基材A使用聚合物构成。
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公开(公告)号：US10385076B2
公开(公告)日：2019-08-20
申请号：US15672145
申请日：2017-08-08
申请人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shuukichi Takii , Shigeru Michiwaki , Manabu Miyawaki , Masanori Yanai , Kouichi Kamiyama , Hitomi Chiba , Yasuyuki Masuda
发明人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shuukichi Takii , Shigeru Michiwaki , Manabu Miyawaki , Masanori Yanai , Kouichi Kamiyama , Hitomi Chiba , Yasuyuki Masuda
IPC分类号： C07D251/70 , A61K31/53 , C07F7/18
摘要： A surface treatment agent including a compound (α) is provided. The compound (α) has one or more M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; wherein said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.
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公开(公告)号：US08753748B2
公开(公告)日：2014-06-17
申请号：US13823526
申请日：2011-09-30
申请人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shigeru Michiwaki , Manabu Miyawaki
发明人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shigeru Michiwaki , Manabu Miyawaki
CPC分类号： C23C18/1608 , C23C18/1612 , C23C18/1653 , C23C18/20 , C23C18/204 , C23C18/2086 , C23C18/285 , C23C18/30 , C25D5/56 , C25D11/00 , H05K3/389 , H05K2203/072 , H05K2203/122 , H05K2203/124 , Y10T428/31663 , Y10T428/31678
摘要： The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (α) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (α) by a wet-mode plating technique, wherein the compound (α) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.
摘要翻译： 本发明的目的在于提供一种金属膜不容易脱离的布线基板。 形成金属膜的方法包括在化合物（α）的表面上将含有化合物（α）的试剂涂布在基材表面上的步骤（X）和在化合物（α）的表面上形成金属膜的工序（Y） 湿式电镀技术，其中化合物（α）是每分子具有OH基或OH生成基团，叠氮基和三嗪环的化合物，并且碱包含聚合物。
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7.发明授权Bonding method, bondability improving agent, surface modification method, surface modifying agent, and novel compound 有权粘合方法，粘合性改善剂，表面改性法，表面改性剂，新型化合物公开(公告)号：US09238757B2
公开(公告)日：2016-01-19
申请号：US13823759
申请日：2011-09-28
申请人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo
发明人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo
CPC分类号： C07F7/0814 , C07D251/54 , C07F5/068 , C07F7/1804 , C08K5/3492 , C08K5/5442 , C09J5/00 , C09J2205/31 , C09J2483/00 , Y10T428/31536
摘要： To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (α) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (α) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (α) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.
摘要翻译： 为了提供一种可以在材料表面上有效形成-OH基团的技术，其目的在于使材料适合于利用化学反应（化学结合）的结合（例如，用于分子键合）。 [解决方案]接合基板A和基板B的接合方法，其包括：在基板A的表面上涂覆含有下述化合物（α）的试剂的工序; 将基板B配置成与基板A的表面上存在的化合物（α）相对的步骤; 以及通过对基板A和/或基板B施加力将基板A和基板B一体接合的步骤。化合物（α）是具有OH基或OH形成基的化合物，叠氮化物 基团和三嗪环，并且基材A使用聚合物构成。
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8.发明申请BONDING METHOD, BONDABILITY IMPROVING AGENT, SURFACE MODIFICATION METHOD, SURFACE MODIFYING AGENT, AND NOVEL COMPOUND 有权粘合方法，粘合剂改性剂，表面改性方法，表面改性剂和新化合物公开(公告)号：US20130177770A1
公开(公告)日：2013-07-11
申请号：US13823759
申请日：2011-09-28
申请人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo
发明人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo
IPC分类号： C09J5/00
CPC分类号： C07F7/0814 , C07D251/54 , C07F5/068 , C07F7/1804 , C08K5/3492 , C08K5/5442 , C09J5/00 , C09J2205/31 , C09J2483/00 , Y10T428/31536
摘要： To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (α) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (α) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (α) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.
摘要翻译： 为了提供一种可以在材料表面上有效形成-OH基团的技术，其目的在于使材料适合于利用化学反应（化学结合）的结合（例如，用于分子键合）。 [方案]一种用于接合基板A和基板B的接合方法，其包括：在基板A的表面上涂覆含有下述化合物（α）的试剂的步骤; 将基板B布置成面向存在于基板A的表面上的化合物（a）的步骤; 以及通过对基板A和/或基板B施加力使基板A和基板B一体接合的步骤。化合物（α）是具有OH基或OH形成基的化合物，叠氮化物 基团和三嗪环，并且基材A使用聚合物构成。
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