Display apparatus using oxide diode
    1.
    发明申请
    Display apparatus using oxide diode 有权
    使用氧化二极管的显示装置

    公开(公告)号:US20090321738A1

    公开(公告)日:2009-12-31

    申请号:US12285448

    申请日:2008-10-06

    IPC分类号: H01L33/00

    摘要: Provided may be a display apparatus that uses oxide diodes having a nano rod structure, for example, nano-rod diodes formed of a ZnO group material. The display apparatus may include a substrate, a thin film transistor layer on the substrate, and a light emitting layer on the thin film transistor layer, wherein the light emitting layer may include a plug metal layer on the thin film transistor layer, a plurality of nano-rod diodes vertically formed on the plug metal layer, and a transparent electrode on the nano-rod diodes.

    摘要翻译: 可以使用具有纳米棒结构的氧化物二极管的显示装置,例如由ZnO基材料形成的纳米棒状二极管。 显示装置可以包括衬底,衬底上的薄膜晶体管层和薄膜晶体管层上的发光层,其中发光层可以在薄膜晶体管层上包括插入金属层,多个 垂直形成在插塞金属层上的纳米棒二极管和纳米棒二极管上的透明电极。

    Display apparatus using oxide diode
    2.
    发明授权
    Display apparatus using oxide diode 有权
    使用氧化二极管的显示装置

    公开(公告)号:US08895955B2

    公开(公告)日:2014-11-25

    申请号:US12285448

    申请日:2008-10-06

    摘要: Provided may be a display apparatus that uses oxide diodes having a nano rod structure, for example, nano-rod diodes formed of a ZnO group material. The display apparatus may include a substrate, a thin film transistor layer on the substrate, and a light emitting layer on the thin film transistor layer, wherein the light emitting layer may include a plug metal layer on the thin film transistor layer, a plurality of nano-rod diodes vertically formed on the plug metal layer, and a transparent electrode on the nano-rod diodes.

    摘要翻译: 可以使用具有纳米棒结构的氧化物二极管的显示装置,例如由ZnO基材料形成的纳米棒状二极管。 显示装置可以包括衬底,衬底上的薄膜晶体管层和薄膜晶体管层上的发光层,其中发光层可以在薄膜晶体管层上包括插入金属层,多个 垂直形成在插塞金属层上的纳米棒二极管和纳米棒二极管上的透明电极。

    Multi-chip package for LED chip and multi-chip package LED device including the multi-chip package
    3.
    发明授权
    Multi-chip package for LED chip and multi-chip package LED device including the multi-chip package 有权
    多芯片封装的LED芯片和多芯片封装的LED器件包括多芯片封装

    公开(公告)号:US08030670B2

    公开(公告)日:2011-10-04

    申请号:US12314738

    申请日:2008-12-16

    IPC分类号: H01L33/00

    摘要: Provided is a multi-chip package light emitting diode (LED) device including a plurality of LED chips within a single package. The LED device may include a base substrate, a multi-chip package for a LED on the base substrate, and a light radiator surrounding the multi-chip package and radiating light emitted by the multi-chip package for a LED, wherein the multi-chip package for a LED may include a plurality of LED chips on a single wafer substrate.

    摘要翻译: 提供了在单个封装内包括多个LED芯片的多芯片封装发光二极管(LED)装置。 LED装置可以包括基底基板,用于基底基板上的LED的多芯片封装,以及围绕多芯片封装的散热器,以及辐射由用于LED的多芯片封装发射的光,其中, 用于LED的芯片封装可以在单个晶片衬底上包括多个LED芯片。

    Multi-chip package for LED chip and multi-chip package LED device including the multi-chip package
    4.
    发明申请
    Multi-chip package for LED chip and multi-chip package LED device including the multi-chip package 有权
    多芯片封装的LED芯片和多芯片封装的LED器件包括多芯片封装

    公开(公告)号:US20090321776A1

    公开(公告)日:2009-12-31

    申请号:US12314738

    申请日:2008-12-16

    IPC分类号: H01L33/00

    摘要: Provided is a multi-chip package light emitting diode (LED) device including a plurality of LED chips within a single package. The LED device may include a base substrate, a multi-chip package for a LED on the base substrate, and a light radiator surrounding the multi-chip package and radiating light emitted by the multi-chip package for a LED, wherein the multi-chip package for a LED may include a plurality of LED chips on a single wafer substrate.

    摘要翻译: 提供了在单个封装内包括多个LED芯片的多芯片封装发光二极管(LED)装置。 LED装置可以包括基底基板,用于基底基板上的LED的多芯片封装,以及围绕多芯片封装的散热器,以及辐射由用于LED的多芯片封装发射的光,其中, 用于LED的芯片封装可以在单个晶片衬底上包括多个LED芯片。