公开(公告)号：US20220189745A1

公开(公告)日：2022-06-16

申请号：US17681633

申请日：2022-02-25

Applicant: Lam Research Corporation

Inventor： Hiran Rajitha RATHNASINGHE ,  Shawn TOKAIRIN ,  Jon MCCHESNEY

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/687

Abstract: A bottom ring is configured to support a moveable edge ring that is configured to be raised and lowered relative to a substrate support. The bottom ring includes an upper surface that is stepped, an annular inner diameter, an annular outer diameter, a lower surface, a plurality of vertical guide channels provided through the bottom ring from the lower surface to the upper surface of the bottom ring, each of the guide channels including a first region having a smaller diameter than the guide channel and being configured to receive respective lift pins for raising and lowering the edge ring, and a guide feature extending upward from the upper surface of the bottom ring.

公开(公告)号：US20210050188A1

公开(公告)日：2021-02-18

申请号：US17084103

申请日：2020-10-29

Applicant: Lam Research Corporation

Inventor： Jon MCCHESNEY ,  Saravanapriyan SRIRAMAN ,  Richard A. MARSH ,  Alexander Miller PATERSON ,  John HOLLAND

IPC: H01J37/32

Abstract: In one embodiment, a plasma processing device may include a dielectric window, a vacuum chamber, an energy source, and at least one air amplifier. The dielectric window may include a plasma exposed surface and an air exposed surface. The vacuum chamber and the plasma exposed surface of the dielectric window can cooperate to enclose a plasma processing gas. The energy source can transmit electromagnetic energy through the dielectric window and form an elevated temperature region in the dielectric window. The at least one air amplifier can be in fluid communication with the dielectric window. The at least one air amplifier can operate at a back pressure of at least about 1 in-H2O and can provide at least about 30 cfm of air.

公开(公告)号：US20200312633A1

公开(公告)日：2020-10-01

申请号：US16487703

申请日：2017-11-21

Applicant: LAM RESEARCH CORPORATION

Inventor： Hiran Rajitha RATHNASINGHE ,  Shawn E S TOKAIRIN ,  Jon MCCHESNEY

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/687

Abstract: A bottom ring is configured to support a moveable edge ring. The edge ring is configured to be raised and lowered relative to a substrate support. The bottom ring includes an upper surface that is stepped, an annular inner diameter, an annular outer diameter, a lower surface, and a plurality of vertical guide channels provided through the bottom ring from the lower surface to the upper surface of the bottom ring. Each of the guide channels includes a first region having a smaller diameter than the guide channel, and the guide channels are configured to receive respective lift pins for raising and lowering the edge ring.

公开(公告)号：US20190013232A1

公开(公告)日：2019-01-10

申请号：US16131822

申请日：2018-09-14

Applicant: LAM RESEARCH CORPORATION

Inventor： Haoquan YAN ,  Robert Griffith O'NEILL ,  Raphael CASAES ,  Jon MCCHESNEY ,  Alex PATERSON

IPC: H01L21/687 ,  H01J37/32 ,  H01J37/02 ,  H01L21/67 ,  H01J37/20

Abstract: An edge ring is configured to be raised and lowered relative to a pedestal, via one or more lift pins, in a processing chamber of a substrate processing system. The edge ring includes an upper surface, an annular inner diameter, an annular outer diameter, a lower surface, and at least one feature arranged in the lower surface of the edge ring. At least one inner surface of the at least one feature is sloped.

公开(公告)号：US20230039721A1

公开(公告)日：2023-02-09

申请号：US17960576

申请日：2022-10-05

Applicant: Lam Research Corporation

Inventor： Jon MCCHESNEY ,  Saravanapriyan SRIRAMAN ,  Richard A. MARSH ,  Alexander Miller PATERSON ,  John HOLLAND

IPC: H01J37/32

Abstract: In one embodiment, a plasma processing device may include a dielectric window, a vacuum chamber, an energy source, and at least one air amplifier. The dielectric window may include a plasma exposed surface and an air exposed surface. The vacuum chamber and the plasma exposed surface of the dielectric window can cooperate to enclose a plasma processing gas. The energy source can transmit electromagnetic energy through the dielectric window and form an elevated temperature region in the dielectric window. The at least one air amplifier can be in fluid communication with the dielectric window. The at least one air amplifier can operate at a back pressure of at least about 1 in-H2O and can provide at least about 30 cfm of air.

公开(公告)号：US20180247796A1

公开(公告)日：2018-08-30

申请号：US15969583

申请日：2018-05-02

Applicant: Lam Research Corporation

Inventor： Jon MCCHESNEY ,  Saravanapriyan SRIRAMAN ,  Richard A. MARSH ,  Alexander Miller PATERSON ,  John HOLLAND

IPC: H01J37/32

CPC classification number: H01J37/32522 ,  H01J37/32082 ,  H01J37/32119 ,  H01J37/32238

Abstract: In one embodiment, a plasma processing device may include a dielectric window, a vacuum chamber, an energy source, and at least one air amplifier. The dielectric window may include a plasma exposed surface and an air exposed surface. The vacuum chamber and the plasma exposed surface of the dielectric window can cooperate to enclose a plasma processing gas. The energy source can transmit electromagnetic energy through the dielectric window and form an elevated temperature region in the dielectric window. The at least one air amplifier can be in fluid communication with the dielectric window. The at least one air amplifier can operate at a back pressure of at least about 1 in-H2O and can provide at least about 30 cfm of air.

公开(公告)号：US20240355667A1

公开(公告)日：2024-10-24

申请号：US18758576

申请日：2024-06-28

Applicant: LAM RESEARCH CORPORATION

Inventor： Haoquan YAN ,  Robert Griffith O'NEILL ,  Raphael CASAES ,  Jon MCCHESNEY ,  Alex PATERSON

IPC: H01L21/687 ,  H01J37/02 ,  H01J37/20 ,  H01J37/32 ,  H01L21/67

CPC classification number: H01L21/68742 ,  H01J37/023 ,  H01J37/20 ,  H01J37/32623 ,  H01J37/32642 ,  H01J37/32715 ,  H01L21/67069 ,  H01L21/68735

Abstract: An edge ring arrangement for a processing chamber includes a first ring configured to surround and overlap a radially outer edge of an upper plate of a pedestal arranged in the processing chamber, a second ring arranged below the first moveable ring, wherein a portion of the first ring overlaps the second ring, a first actuator configured to actuate a first pillar to selectively move the first ring to a raised position and a lowered position relative to the pedestal, and a second actuator configured to actuate a second pillar to selectively move the second ring to a raised position and a lowered position relative to the pedestal.

公开(公告)号：US20220189744A1

公开(公告)日：2022-06-16

申请号：US17681606

申请日：2022-02-25

Applicant: Lam Research Corporation

Inventor： Hiran Rajitha RATHNASINGHE ,  Shawn TOKAIRIN ,  Jon MCCHESNEY

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/687

Abstract: A middle ring configured to be arranged on a bottom ring and to support a moveable edge ring and further configured to be raised and lowered relative to a substrate support includes an upper surface that is stepped, an annular inner diameter, an annular outer diameter, a lower surface, a guide feature in the upper surface defining the annular outer diameter, an inner annular rim in the upper surface defining the annular inner diameter, and a groove defined in the upper surface between the guide feature and the inner annular rim.

公开(公告)号：US20200020565A1

公开(公告)日：2020-01-16

申请号：US16497091

申请日：2017-07-24

Applicant: LAM RESEARCH CORPORATION

Inventor： Hiran Rajitha RATHNASINGHE ,  Jon MCCHESNEY

IPC: H01L21/687 ,  H01L21/683

Abstract: An edge ring is configured to be raised and lowered relative to a substrate support, via one or more lift pins, in a substrate processing system. The edge ring is further configured to interface with a guide feature extending upward from a bottom ring and/or a middle ring of the substrate support during tuning of the edge ring. The edge ring includes an upper surface, an annular inner diameter, an annular outer diameter, a lower surface, and an annular groove arranged in the lower surface of the edge ring to interface with the guide feature. Walls of the annular groove are substantially vertical.