公开(公告)号：US20140021482A1

公开(公告)日：2014-01-23

申请号：US14018297

申请日：2013-09-04

Applicant: LG ELECTRONICS INC.

Inventor： Jun Ho JANG ,  Geun Ho KIM

IPC: H01L33/32

CPC classification number: H01L29/167 ,  H01L25/167 ,  H01L29/866 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/32 ,  H01L33/38 ,  H01L33/405 ,  H01L33/44 ,  H01L33/486 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2933/0033 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device having a vertical structure and a package thereof, which are capable of damping impact generated in a substrate separation process, and achieving an improvement in mass productivity. The device and package include a sub-mount, a first-type electrode, a second-type electrode, a light emitting device, a zener diode, and a lens on the sub-mount.

Abstract translation: 一种具有垂直结构和封装的发光器件，其能够抑制在衬底分离过程中产生的冲击，并且实现批量生产率的提高。 该装置和封装包括副安装座，第一型电极，第二类型电极，发光装置，齐纳二极管和子安装座上的透镜。

公开(公告)号：US20170256617A1

公开(公告)日：2017-09-07

申请号：US15598820

申请日：2017-05-18

Applicant: LG Electronics Inc. ,  LG Innotek Co., Ltd.

Inventor： Jun Ho JANG ,  Geun Ho KIM

IPC: H01L29/167 ,  H01L33/62 ,  H01L33/00 ,  H01L33/58 ,  H01L29/866 ,  H01L33/20 ,  H01L33/48 ,  H01L33/40 ,  H01L33/60 ,  H01L33/44 ,  H01L33/38 ,  H01L25/16 ,  H01L33/32

CPC classification number: H01L29/167 ,  H01L25/167 ,  H01L29/866 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/32 ,  H01L33/38 ,  H01L33/405 ,  H01L33/44 ,  H01L33/486 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2933/0033 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device package can include a sub-mount having a first surface, a second surface, a bottom surface and a cavity; a first layer on the first surface; a second layer on the second surface; a third layer on the bottom surface; a light emitting device on the first layer and including a supporting layer including an anti-diffusion layer, a first electrode on the supporting layer, a semiconductor light emitting structure electrically connected to the first electrode, and a second electrode electrically connected to the semiconductor light emitting structure, in which the first and second electrodes electrically connect to the first layer and the second layer, respectively, and the semiconductor light emitting structure includes a light extraction structure; an ESD property improving diode on the second surface, electrically connected to the second layer and arranged a distance apart from the light emitting device, and a lens on the sub-mount.

公开(公告)号：US20160190258A1

公开(公告)日：2016-06-30

申请号：US15059881

申请日：2016-03-03

Applicant: LG ELECTRONICS INC. ,  LG INNOTEK CO., LTD.

Inventor： Jun Ho JANG ,  Geun Ho KIM

IPC: H01L29/167 ,  H01L33/62 ,  H01L33/58 ,  H01L33/20 ,  H01L33/44 ,  H01L33/38 ,  H01L33/40 ,  H01L29/866 ,  H01L33/48

CPC classification number: H01L29/167 ,  H01L25/167 ,  H01L29/866 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/32 ,  H01L33/38 ,  H01L33/405 ,  H01L33/44 ,  H01L33/486 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2933/0033 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device having a vertical structure and a package thereof, which are capable of damping impact generated in a substrate separation process, and achieving an improvement in mass productivity. The device and package include a sub-mount, a first-type electrode, a second-type electrode, a light emitting device, a zener diode, and a lens on the sub-mount.

Abstract translation: 一种具有垂直结构和封装的发光器件，其能够抑制在衬底分离过程中产生的冲击，并且实现批量生产率的提高。 该装置和封装包括副安装座，第一型电极，第二类型电极，发光装置，齐纳二极管和子安装座上的透镜。

公开(公告)号：US20140217452A1

公开(公告)日：2014-08-07

申请号：US14248179

申请日：2014-04-08

Applicant: LG ELECTRONICS INC. ,  LG INNOTEK CO., LTD.

Inventor： Jun Ho JANG ,  Geun Ho KIM

IPC: H01L33/60 ,  H01L33/40

CPC classification number: H01L29/167 ,  H01L25/167 ,  H01L29/866 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/32 ,  H01L33/38 ,  H01L33/405 ,  H01L33/44 ,  H01L33/486 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2933/0033 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device having a vertical structure and a package thereof, which are capable of damping impact generated in a substrate separation process, and achieving an improvement in mass productivity. The device and package include a sub-mount, a first-type electrode, a second-type electrode, a light emitting device, a zener diode, and a lens on the sub-mount.