公开(公告)号：US12044487B2

公开(公告)日：2024-07-23

申请号：US16979768

申请日：2019-03-27

申请人： LG ELECTRONICS INC.

发明人： Eungyul Lee ,  Juhyok Kim ,  Jiwon Choi ,  Sanghoon Yoo ,  Hanchoon Lee

IPC分类号： F28F3/10 ,  C08J5/12 ,  C09J1/00 ,  C09J1/02 ,  C09J5/06 ,  F28D9/00 ,  F28F3/04

CPC分类号： F28F3/10 ,  C08J5/12 ,  C09J1/00 ,  C09J1/02 ,  C09J5/06 ,  F28D9/005 ,  F28F3/046 ,  F28F2275/025

摘要： A plate-type heat exchanger and a method for manufacturing same are provided. A plate-type heat exchanger includes a first plate and a second plate which have flange parts vertically adhered by an adhesive, respectively. The flange parts are formed in a stepped shape and may thus increase an area adhered to the first plate and the second plate.

公开(公告)号：US20180265418A1

公开(公告)日：2018-09-20

申请号：US15984667

申请日：2018-05-21

申请人： The Boeing Company

发明人： Tab Hunter Crooks ,  MaryAnn S. Muench

IPC分类号： C04B37/00 ,  C09J1/00 ,  B32B18/00 ,  C04B35/638 ,  C04B37/02 ,  C04B37/04 ,  B32B7/02 ,  B32B7/12 ,  C04B35/636

CPC分类号： C04B37/005 ,  B32B7/02 ,  B32B7/12 ,  B32B18/00 ,  B32B2307/30 ,  C04B35/6365 ,  C04B35/638 ,  C04B37/008 ,  C04B37/025 ,  C04B37/028 ,  C04B37/04 ,  C04B2235/5436 ,  C04B2235/656 ,  C04B2235/9607 ,  C04B2237/06 ,  C04B2237/10 ,  C04B2237/343 ,  C04B2237/38 ,  C04B2237/385 ,  C04B2237/401 ,  C04B2237/52 ,  C04B2237/58 ,  C04B2237/60 ,  C04B2237/708 ,  C04B2237/72 ,  C09J1/00

摘要： Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.

公开(公告)号：US20180213898A1

公开(公告)日：2018-08-02

申请号：US15884025

申请日：2018-01-30

申请人： Chi Huynh

发明人： Chi Huynh

IPC分类号： A44C17/02 ,  C09J1/00 ,  C09J5/06

CPC分类号： A44C17/02 ,  A44C17/007 ,  A44C17/04 ,  A44C27/002 ,  C09J1/00 ,  C09J5/06 ,  C09J2400/14 ,  C09J2400/16

摘要： A method of manufacturing an article of jewelry with a druzy or geode effect, the method including: forming an adhesion mixture by mixing metal particles with a silica, shell, and/or clay with polymer, optionally in a liquid to form an adhesion paste; applying the adhesion mixture to an article of jewelry; applying a plurality of gemstones to the applied adhesion mixture to form a gemstone layer; melting the adhesion mixture without significantly melting the article of jewelry; and cooling the adhesion mixture to bond the gemstone layer to the article of jewelry.

公开(公告)号：US20170369747A1

公开(公告)日：2017-12-28

申请号：US15231723

申请日：2016-08-08

申请人： Zhen Ding Technology Co., Ltd.

发明人： SZU-HSIANG SU ,  KUO-SHENG LIANG ,  SHOU-JUI HSIANG ,  HONG-PING LIN

IPC分类号： C09J109/06 ,  B32B27/30 ,  B32B27/18 ,  C09J1/00 ,  C09J7/02 ,  H05K1/03 ,  C08L9/06

CPC分类号： C09J109/06 ,  B32B27/18 ,  B32B27/302 ,  B32B2264/102 ,  B32B2405/00 ,  B32B2457/08 ,  C08L9/06 ,  C08L53/02 ,  C08L2201/02 ,  C08L2203/162 ,  C08L2203/206 ,  C08L2207/324 ,  C09J1/00 ,  C09J153/02 ,  C09J2203/326 ,  C09J2205/114 ,  H05K1/0373 ,  H05K3/386 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0209 ,  C08L9/00 ,  C08K5/541

摘要： A resin composition for a PCB includes a styrene-butadiene-styrene block copolymer in an amount from 95 to 100 parts by weight, a modified porous spheres of silicon oxide in an amount from 1 to 50 parts by weight, and a liquid polybutadiene in an amount from 5 to 50 parts by weight. The styrene-butadiene-styrene block copolymer and the liquid polybutadiene both include vinyl groups on the molecular side chains. The modified porous spheres of silicon oxide also include vinyl groups. An adhesive film and a circuit board using the resin composition are also provided.

公开(公告)号：US20170158904A1

公开(公告)日：2017-06-08

申请号：US15376142

申请日：2016-12-12

申请人： JOHNS MANVILLE

发明人： Kiarash Alavi ,  Jawed Asrar

IPC分类号： C09D135/06 ,  C09D125/08

CPC分类号： C09D135/06 ,  C04B37/005 ,  C08G63/02 ,  C08G67/04 ,  C08K3/20 ,  C08K5/17 ,  C08L33/08 ,  C08L67/06 ,  C09D125/08 ,  C09J1/00 ,  C09J5/02 ,  C09J129/00 ,  C09J135/00

摘要： Compositions for binding organic or inorganic fibers is described. The compositions may include an aqueous solution having a pH of about 4.5 or more. The aqueous solution may include a polycarboxy polymer that is about 10%, by wt., to 100%, by wt., of a butenedioic acid or butenedioic anhydride; and a polyol. The compositions can maintain a pH of about 5 or more after being cured into a thermoset plastic with the fibers. Processes for preparing a binder composition for organic or inorganic fibers are also described. The processes may include providing an aqueous solution of polycarboxylic acid polymers, where the polymers comprise about 10%, by wt., to 100%, by wt., of a butenedioic acid or butenedioic anhydride; adding a polyol to the aqueous solution; and maintaining the pH of the aqueous solution at about 5 or more.

公开(公告)号：US20170028477A1

公开(公告)日：2017-02-02

申请号：US15302712

申请日：2015-04-10

申请人： Alpha Metals, Inc.

发明人： Rohan P. Setna ,  Nirmalya Kumar Chaki ,  Poulami Sengupta Roy ,  Siuli Sarkar ,  Sutapa Mukherjee

IPC分类号： B22F9/24 ,  B22F1/02 ,  B22F9/04 ,  H01L23/00 ,  C09J9/02 ,  C09J11/04 ,  C09C1/62 ,  B22F1/00 ,  C09J1/00

CPC分类号： B22F9/24 ,  B22F1/0014 ,  B22F1/0074 ,  B22F1/025 ,  B22F9/04 ,  B22F2009/043 ,  B22F2301/10 ,  B22F2301/255 ,  C01P2004/20 ,  C01P2004/32 ,  C01P2004/51 ,  C01P2004/61 ,  C01P2006/11 ,  C01P2006/12 ,  C01P2006/80 ,  C09C1/62 ,  C09C1/622 ,  C09C1/627 ,  C09J1/00 ,  C09J9/02 ,  C09J11/04 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/111 ,  H01L2224/1111 ,  H01L2224/1131 ,  H01L2224/11312 ,  H01L2224/1132 ,  H01L2224/11438 ,  H01L2224/1144 ,  H01L2224/11505 ,  H01L2224/13294 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13387 ,  H01L2224/1339 ,  H01L2224/13439 ,  H01L2224/1349 ,  H01L2224/13499 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/271 ,  H01L2224/2711 ,  H01L2224/2731 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27438 ,  H01L2224/2744 ,  H01L2224/27505 ,  H01L2224/29011 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/8184 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/8384 ,  H01L2224/94 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/00012 ,  H01L2224/27 ,  H01L2224/11 ,  H01L2224/83 ,  H01L2224/81

摘要： A method for manufacturing metal powder comprising: providing a basic metal salt solution; contacting the basic metal salt solution with a reducing agent to precipitate metal powder therefrom; and recovering precipitated metal powder from the solvent.

摘要翻译： 一种制造金属粉末的方法，包括：提供碱金属盐溶液; 使碱金属盐溶液与还原剂接触以从其中沉淀金属粉末; 并从溶剂中回收沉淀的金属粉末。

公开(公告)号：US20160347972A1

公开(公告)日：2016-12-01

申请号：US14725780

申请日：2015-05-29

申请人： Palo Alto Research Center Incorporated

发明人： Scott Eugene SOLBERG

IPC分类号： C09J1/00 ,  B65B51/02 ,  B65D53/06

CPC分类号： C09J1/00 ,  B65B51/02 ,  B65D53/06 ,  C03C8/24 ,  C04B37/00 ,  C09K3/1003

摘要： The disclosure relates to sealant compositions for forming hermetic seals, methods of use, and hermetically sealed products. The sealant compositions comprise a first inorganic oxide chosen from at least one of MgSiO3, MgO, MgTiO3, CaO, and CaSiO3, a second inorganic oxide chosen from SiO2, at least one solvent, and optionally at least one organic resin binder.

摘要翻译： 本公开涉及用于形成气密密封的密封剂组合物，使用方法和密封产品。 密封剂组合物包含选自MgSiO 3，MgO，MgTiO 3，CaO和CaSiO 3中的至少一种的第一无机氧化物，选自SiO 2，至少一种溶剂和任选的至少一种有机树脂粘合剂的第二无机氧化物。

公开(公告)号：US20150093080A1

公开(公告)日：2015-04-02

申请号：US14041506

申请日：2013-09-30

申请人： Corning Cable Systems LLC

发明人： Michael Edward DeRosa ,  Shawn Michael O'Malley ,  Vitor Marino Schneider

IPC分类号： G02B6/38 ,  C09J5/00 ,  C09J1/00 ,  B32B37/14

CPC分类号： G02B6/3861 ,  B32B37/142 ,  C09J1/00 ,  C09J5/00 ,  C09J2400/12 ,  G02B6/3854 ,  G02B6/3863 ,  G02B6/3865 ,  G02B6/3885 ,  G02B6/3887

摘要： One embodiment of the disclosure relates to an optical connector. The optical connector may include a ferrule, a waveguide, and an inorganic adhesive composition. The ferrule may include a fiber-receiving passage defining an inner surface. The inorganic adhesive composition may be disposed within the ferrule and in contact with the inner surface of the ferrule and the waveguide. The inorganic adhesive composition may include at least about 50% by weight of metal oxide.

摘要翻译： 本公开的一个实施例涉及光学连接器。 光学连接器可以包括套圈，波导和无机粘合剂组合物。 套圈可以包括限定内表面的光纤接收通道。 无机粘合剂组合物可以设置在套圈内并与套圈和波导的内表面接触。 无机粘合剂组合物可以包含至少约50重量％的金属氧化物。

公开(公告)号：US08871661B2

公开(公告)日：2014-10-28

申请号：US13806868

申请日：2010-09-07

申请人： Minoru Yamada

发明人： Minoru Yamada

IPC分类号： C03C8/24 ,  C03C8/14 ,  C03C8/18 ,  C03C8/02 ,  C09J1/00 ,  C03C8/04 ,  C03C27/10

CPC分类号： C03C8/18 ,  C03C3/066 ,  C03C8/04 ,  C03C8/24 ,  C03C27/10 ,  C09J1/00 ,  Y10T428/2982

摘要： Provided is a bonding material which can bond base materials or substrates having different linear thermal expansion coefficients, and can have heat resistance against temperatures of 300° C. or higher, vacuum airtightness and bonding strength, further which has excellent handleability and workability. The bonding material is produced by mixing, in a content ratio of 0.01 to 60 mass % (to the whole), a metal Ga, and/or at least one metal or alloy powder selected from the group consisting of a metal powder mixture of a combination of Bi and Sn or an alloy powder thereof, and a metal powder mixture of a combination of Bi, Sn and Mg or an alloy powder thereof with a Bi2O3-based glass frit powder having an average particle diameter of 200 μm or less. The bonding material may be formed in a paste form by adding a solvent thereto. This feature makes it possible to bond together substrates having different thermal expansion coefficients without causing a crack or unsticking.

摘要翻译： 本发明提供一种接合材料，其能够接合具有不同线膨胀系数的基材或基材，并且可以具有300℃以上的温度，真空气密性和接合强度的耐热性，进一步具有优异的可操作性和可加工性。 接合材料通过以0.01〜60质量％（总体）的比例混合金属Ga，和/或至少一种选自由以下组成的组的金属或合金粉末： Bi和Sn或其合金粉末的组合以及Bi，Sn和Mg的组合的金属粉末混合物或其合金粉末与平均粒径为200μm以下的Bi 2 O 3系玻璃粉末。 接合材料可以通过向其中加入溶剂而形成糊状。 该特征使得可以将不同热膨胀系数的基板结合在一起而不会产生裂纹或不粘结。

公开(公告)号：US20130207323A1

公开(公告)日：2013-08-15

申请号：US13881297

申请日：2011-10-14

申请人： Kousuke Uoe

发明人： Kousuke Uoe

IPC分类号： C09J1/00

CPC分类号： C09J1/00 ,  B01D39/00 ,  C04B28/24 ,  C04B35/478 ,  C04B38/0012 ,  C04B2235/3217 ,  C04B2235/3234 ,  C04B2235/3236 ,  C04B2235/3418 ,  C04B2235/36 ,  C04B2235/5436 ,  C08K3/11 ,  C09J11/04 ,  F01N3/0222 ,  C04B14/305

摘要： To provide a plugging material that is hardened at low temperature (e.g., 100 to 300° C.), can obtain excellent adhesion to partition walls of a ceramic honeycomb sintered body, and can obtain excellent heat resistance. A plugging material comprising a water-based inorganic adhesive and aluminum titanate-based ceramic particles.

摘要翻译： 为了提供在低温（例如100〜300℃）下硬化的封孔材料，可以获得对陶瓷蜂窝烧结体的隔壁的优异的粘附性，并且可以获得优异的耐热性。 一种封装材料，包括水基无机粘合剂和钛酸铝基陶瓷颗粒。