CONDUCTIVE FILM, CONDUCTIVE PASTE, AND PRODUCTION METHOD THEREOF

    公开(公告)号:US20230207151A1

    公开(公告)日:2023-06-29

    申请号:US17927350

    申请日:2020-05-26

    CPC classification number: H01B1/22 H01B5/14 H01B13/0016

    Abstract: The present invention comprises the steps of: applying, on a substrate, a conductive paste including metal particles that are dispersed in an organic material and have a first particle diameter, and a magnetic heating element that has a second particle diameter; and selectively sintering the applied conductive paste by induction heating to form a conductive film, wherein the magnetic heating element may be contained in an amount of 10-50 wt% with respect to the metal particles. Therefore, a conductive adhesive layer can be selectively formed by performing the sintering through induction heating. In addition, by adding a small amount of the magnetic heating element to conductive metal powder having a low melting point, low-temperature bonding and electric conductivity can be simultaneously attained.

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