Method for manufacturing display device and substrate for manufacturing display device

    公开(公告)号:US11211366B2

    公开(公告)日:2021-12-28

    申请号:US16834315

    申请日:2020-03-30

    Abstract: The present disclosure relates to an assembly substrate used for a display device manufacturing method in which semiconductor light-emitting diodes are placed on the assembly substrate at preset positions using electric field and magnetic field. Specifically, the assembly substrate includes a base portion, a plurality of assembly electrodes extending in one direction and disposed on the base portion, a dielectric layer stacked on the base portion to cover the assembly electrodes, a barrier wall formed on the base portion and having a plurality of recesses for guiding the semiconductor light-emitting diodes to the preset positions, and a metal shielding layer formed on the base portion, wherein the metal shielding layer overlaps the barrier wall so that an electric field formed between the assembly electrodes is shielded.

    Solar cell panel
    3.
    发明授权

    公开(公告)号:US10510908B2

    公开(公告)日:2019-12-17

    申请号:US15465026

    申请日:2017-03-21

    Abstract: A solar cell panel includes a first solar cell and a second solar cell; and a plurality of leads connecting the first solar cell and the second solar cell. Each of the first solar cell and the second solar cell includes: a first electrode including a plurality of finger lines in a first direction and a plurality of first bus bars in a second direction crossing the first direction; and a second electrode including a plurality of second bus bars in the second direction. The plurality of leads have a diameter or width of 100 to 500 μm, and include 6 or more leads arranged at one surface side of the first or second solar cell. The plurality of leads are connected to the plurality of first bus bars of the first solar cell and the plurality of second bus bars of the second solar cell by a solder layer, respectively.

    Solar cell and method for manufacturing the same

    公开(公告)号:US10964827B2

    公开(公告)日:2021-03-30

    申请号:US15903653

    申请日:2018-02-23

    Abstract: A solar cell includes a first conductive type substrate; an emitter layer of a second conductive type opposite the first conductive type, the emitter layer and the substrate forming a p-n junction; an anti-reflection layer positioned on the emitter layer; a plurality of first electrodes passing through the anti-reflection layer and being electrically connected to the emitter layer, at least one of the plurality of first electrodes including: a first electrode layer and a plurality of first electrode auxiliaries separated from the first electrode layer and positioned around the first electrode layer; and a second electrode layer positioned on the first electrode layer and on the plurality of first electrode auxiliaries; and a second electrode electrically connected to the substrate.

    Electronic apparatus including speaker module

    公开(公告)号:US10887683B1

    公开(公告)日:2021-01-05

    申请号:US16732017

    申请日:2019-12-31

    Abstract: Disclosed is an electronic apparatus includes a first frame, a second frame configured to move relative to the first frame, a flexible display having a screen output area viewable on a front surface of the electronic apparatus to be expanded or reduced based on a movement of the second frame, a speaker module disposed at the first frame and having a sound emitting hole and a vent hole on one surface, and a pipe rail disposed at the second frame. The pipe rail may selectively transfer an acoustic signal output through the vent hole to outside through an inner pipeline based on the movement of the second frame. However, embodiments are not limited thereto.

    Method for manufacturing solar cell

    公开(公告)号:US09698300B2

    公开(公告)日:2017-07-04

    申请号:US14733620

    申请日:2015-06-08

    Abstract: A method of manufacturing a solar cell is discussed. The method of manufacturing the solar cell includes: forming a conductive region on a semiconductor substrate; forming an electrode connected to the conductive region; and post-processing the semiconductor substrate to passivate the semiconductor substrate. The post-processing of the semiconductor substrate comprises a main processing process for heat-treating the semiconductor substrate while providing light to the semiconductor substrate. A temperature of the main processing process is about 100° C. to about 800° C., and the temperature and light intensity of the main processing process satisfy Equation of 1750−31.8·T+(0.16)·T2≦I. Here, T is the temperate (° C.) of the main processing process, and I is the light intensity (mW/cm2) of the main processing process.

    Solar cell and method of manufacturing

    公开(公告)号:US10453983B2

    公开(公告)日:2019-10-22

    申请号:US15381529

    申请日:2016-12-16

    Abstract: Disclosed herein are a solar cell and a method of manufacturing the same. The solar cell module includes a semiconductor substrate, a first passivation film located on a front surface of the semiconductor substrate, a second passivation film located on a rear surface of the semiconductor substrate, a front electric field region located on the first passivation film on the front surface of the semiconductor substrate and being of a same conductivity-type as that of the semiconductor substrate, an emitter region located on the second passivation film on the rear surface of the semiconductor substrate and being of a conductivity-type opposite that of the semiconductor substrate, first electrodes conductively connected to the front electric field region, and second electrode conductively connected to the emitter region.

    Post-processing apparatus of solar cell

    公开(公告)号:US10109511B2

    公开(公告)日:2018-10-23

    申请号:US14741286

    申请日:2015-06-16

    Abstract: A post-processing apparatus of a solar cell carries out a post-processing operation including a main period for heat-treating a solar cell including a semiconductor substrate while providing light to the solar cell. The post-processing apparatus includes a main section to carry out the main period. The main section includes a first heat source unit to provide heat to the semiconductor substrate and a light source unit to provide light to the semiconductor substrate. The first heat source unit and the light source unit are positioned in the main section. The light source unit includes a light source constituted by a plasma lighting system (PLS).

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