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公开(公告)号：US20160035644A1
公开(公告)日：2016-02-04
申请号：US14630239
申请日：2015-02-24
IPC分类号： H01L23/367 , H01L23/48 , H01L25/065 , H01L23/31 , H01L23/00
CPC分类号： H01L23/3675 , H01L21/268 , H01L21/2855 , H01L21/2885 , H01L21/3105 , H01L21/486 , H01L21/56 , H01L21/76802 , H01L21/76879 , H01L23/3107 , H01L23/36 , H01L23/3736 , H01L23/4334 , H01L23/481 , H01L23/49827 , H01L23/49861 , H01L23/5384 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/32 , H01L24/82 , H01L24/83 , H01L2224/04105 , H01L2224/16245 , H01L2224/19 , H01L2224/29111 , H01L2224/2912 , H01L2224/2919 , H01L2224/32245 , H01L2224/73253 , H01L2224/73267 , H01L2224/83005 , H01L2224/83801 , H01L2224/8385 , H01L2924/01029 , H01L2924/10253 , H01L2924/14
摘要： An integrated circuit package may include a semiconductor die, a heat spreader, and encapsulation material. The semiconductor die may contain an electronic circuit and exposed electrical connections to the electronic circuit. The heat spreader may be thermally-conductive and may have a first outer surface and a second outer surface substantially parallel to the first outer surface. The first outer surface may be affixed to all portions of a silicon side of the semiconductor die in a thermally-conductive manner. The encapsulation material may be non-electrically conductive and may completely encapsulate the semiconductor die and the heat spreader, except for the second surface of the heat spreader. The second surface of the heat spreader may be solderable and may form part of an exterior surface of the integrated circuit package.
摘要翻译： 集成电路封装可以包括半导体管芯，散热器和封装材料。 半导体管芯可以包含电子电路和暴露的电连接到电子电路。 散热器可以是导热的并且可以具有基本上平行于第一外表面的第一外表面和第二外表面。 第一外表面可以以导热方式固定到半导体管芯的硅侧的所有部分。 除了散热器的第二表面之外，封装材料可以是不导电的，并且可以完全封装半导体管芯和散热器。 散热器的第二表面可以是可焊接的并且可以形成集成电路封装的外表面的一部分。
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公开(公告)号：US09431319B2
公开(公告)日：2016-08-30
申请号：US14630239
申请日：2015-02-24
IPC分类号： H01L23/10 , H01L23/367 , H01L23/31 , H01L23/48 , H01L23/433 , H01L23/498 , H01L21/48 , H01L23/538 , H01L23/00
CPC分类号： H01L23/3675 , H01L21/268 , H01L21/2855 , H01L21/2885 , H01L21/3105 , H01L21/486 , H01L21/56 , H01L21/76802 , H01L21/76879 , H01L23/3107 , H01L23/36 , H01L23/3736 , H01L23/4334 , H01L23/481 , H01L23/49827 , H01L23/49861 , H01L23/5384 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/32 , H01L24/82 , H01L24/83 , H01L2224/04105 , H01L2224/16245 , H01L2224/19 , H01L2224/29111 , H01L2224/2912 , H01L2224/2919 , H01L2224/32245 , H01L2224/73253 , H01L2224/73267 , H01L2224/83005 , H01L2224/83801 , H01L2224/8385 , H01L2924/01029 , H01L2924/10253 , H01L2924/14
摘要： An integrated circuit package may include a semiconductor die, a heat spreader, and encapsulation material. The semiconductor die may contain an electronic circuit and exposed electrical connections to the electronic circuit. The heat spreader may be thermally-conductive and may have a first outer surface and a second outer surface substantially parallel to the first outer surface. The first outer surface may be affixed to all portions of a silicon side of the semiconductor die in a thermally-conductive manner. The encapsulation material may be non-electrically conductive and may completely encapsulate the semiconductor die and the heat spreader, except for the second surface of the heat spreader. The second surface of the heat spreader may be solderable and may form part of an exterior surface of the integrated circuit package.
摘要翻译： 集成电路封装可以包括半导体管芯，散热器和封装材料。 半导体管芯可以包含电子电路和暴露的电连接到电子电路。 散热器可以是导热的并且可以具有基本上平行于第一外表面的第一外表面和第二外表面。 第一外表面可以以导热方式固定到半导体管芯的硅侧的所有部分。 除了散热器的第二表面之外，封装材料可以是不导电的，并且可以完全封装半导体管芯和散热器。 散热器的第二表面可以是可焊接的并且可以形成集成电路封装的外表面的一部分。
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