公开(公告)号：US09431319B2

公开(公告)日：2016-08-30

申请号：US14630239

申请日：2015-02-24

申请人： LINEAR TECHNOLOGY CORPORATION

发明人： Edward William Olsen ,  Leonard Shtargot ,  David Roy Ng ,  Jeffrey Kingan Witt

IPC分类号： H01L23/10 ,  H01L23/367 ,  H01L23/31 ,  H01L23/48 ,  H01L23/433 ,  H01L23/498 ,  H01L21/48 ,  H01L23/538 ,  H01L23/00

CPC分类号： H01L23/3675 ,  H01L21/268 ,  H01L21/2855 ,  H01L21/2885 ,  H01L21/3105 ,  H01L21/486 ,  H01L21/56 ,  H01L21/76802 ,  H01L21/76879 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/49861 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/04105 ,  H01L2224/16245 ,  H01L2224/19 ,  H01L2224/29111 ,  H01L2224/2912 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/83005 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/14

摘要： An integrated circuit package may include a semiconductor die, a heat spreader, and encapsulation material. The semiconductor die may contain an electronic circuit and exposed electrical connections to the electronic circuit. The heat spreader may be thermally-conductive and may have a first outer surface and a second outer surface substantially parallel to the first outer surface. The first outer surface may be affixed to all portions of a silicon side of the semiconductor die in a thermally-conductive manner. The encapsulation material may be non-electrically conductive and may completely encapsulate the semiconductor die and the heat spreader, except for the second surface of the heat spreader. The second surface of the heat spreader may be solderable and may form part of an exterior surface of the integrated circuit package.

摘要翻译： 集成电路封装可以包括半导体管芯，散热器和封装材料。 半导体管芯可以包含电子电路和暴露的电连接到电子电路。 散热器可以是导热的并且可以具有基本上平行于第一外表面的第一外表面和第二外表面。 第一外表面可以以导热方式固定到半导体管芯的硅侧的所有部分。 除了散热器的第二表面之外，封装材料可以是不导电的，并且可以完全封装半导体管芯和散热器。 散热器的第二表面可以是可焊接的并且可以形成集成电路封装的外表面的一部分。

公开(公告)号：US20160035645A1

公开(公告)日：2016-02-04

申请号：US14630302

申请日：2015-02-24

申请人： LINEAR TECHNOLOGY CORPORATION

发明人： Edward William Olsen ,  David A. Pruitt ,  Gregory S. Peck ,  Leonard Shtargot

IPC分类号： H01L23/367 ,  H01L23/48 ,  H01L23/00 ,  H01L25/065 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L24/73 ,  H01L21/486 ,  H01L21/568 ,  H01L23/4334 ,  H01L23/49827 ,  H01L23/49861 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/16245 ,  H01L2224/16265 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/82005 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/19104 ,  H01L2924/00014 ,  H01L2924/01051 ,  H01L2924/014

摘要： A flipchip package may include a semiconductor die, a heat spreader, and encapsulation material. The semiconductor die may contain an electronic circuit and exposed electrical connections to the electronic circuit. The heat spreader may be thermally-conductive and may have a first outer surface and a second outer surface substantially parallel to the first outer surface. The first outer surface may be affixed to all portions of a silicon side of the semiconductor die in a thermally-conductive manner. The encapsulation material may be non-electrically conductive and may completely encapsulate the semiconductor die and the heat spreader, except for the second surface of the heat spreader. The second surface of the heat spreader may be solderable and may form part of an exterior surface of the flipchip package.

摘要翻译： 倒装芯片封装可以包括半导体管芯，散热器和封装材料。 半导体管芯可以包含电子电路和暴露的电连接到电子电路。 散热器可以是导热的并且可以具有基本上平行于第一外表面的第一外表面和第二外表面。 第一外表面可以以导热方式固定到半导体管芯的硅侧的所有部分。 除了散热器的第二表面之外，封装材料可以是不导电的，并且可以完全封装半导体管芯和散热器。 散热器的第二表面可以是可焊接的并且可以形成倒装芯片封装的外表面的一部分。

公开(公告)号：US10586757B2

公开(公告)日：2020-03-10

申请号：US15167345

申请日：2016-05-27

申请人： LINEAR TECHNOLOGY CORPORATION

发明人： Edward William Olsen

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L23/00

摘要： A flipchip may include: a silicon die having a circuit side with solder bumps and a non-circuit side; a leadframe attached to the solder bumps on the circuit side of the silicon die; a heat spreader attached to the non-circuit side of the silicon die; and encapsulation material encapsulating the silicon die, a portion of the leadframe, and all but one exterior surface of the heat spreader. The leadframe may have NiPdAu plating on the portion that is not encapsulated by the encapsulation material and no plating on the portion that is attached to the solder bumps.

公开(公告)号：US20160260652A1

公开(公告)日：2016-09-08

申请号：US15154489

申请日：2016-05-13

申请人： LINEAR TECHNOLOGY CORPORATION

发明人： Edward William Olsen

IPC分类号： H01L23/367 ,  H01L21/268 ,  H01L21/3105 ,  H01L23/373 ,  H01L21/288 ,  H01L21/285 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/768

CPC分类号： H01L23/3675 ,  H01L21/268 ,  H01L21/2855 ,  H01L21/2885 ,  H01L21/3105 ,  H01L21/486 ,  H01L21/56 ,  H01L21/76802 ,  H01L21/76879 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/49861 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/04105 ,  H01L2224/16245 ,  H01L2224/19 ,  H01L2224/29111 ,  H01L2224/2912 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/83005 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/14

摘要： A method of making an integrated circuit package that contains a semiconductor die having one or more electrical connections to an electronic circuit within the semiconductor die. The method may include: encapsulating the semiconductor die and its electrical connections in non-electrically conductive, encapsulation material; laser drilling the encapsulation material to expose one of the electrical connections within the integrated circuit package, thereby creating a via opening in an external surface of the encapsulation material to the electrical connection; and electroplating or sputtering over the via opening in the encapsulation material to create a conductive routing layer from the exterior surface of the encapsulation material to the electrical connection.

摘要翻译： 一种制造集成电路封装的方法，该集成电路封装包含具有与半导体管芯内的电子电路的一个或多个电连接的半导体管芯。 该方法可以包括：将半导体管芯及其电连接封装在非导电的封装材料中; 激光钻探封装材料以暴露集成电路封装内的电连接之一，由此在封装材料的外表面上形成通孔以连接到电连接; 以及在封装材料中的通孔开口上进行电镀或溅射以从封装材料的外表面到电连接产生导电布线层。

公开(公告)号：US20170345744A1

公开(公告)日：2017-11-30

申请号：US15167345

申请日：2016-05-27

申请人： LINEAR TECHNOLOGY CORPORATION

发明人： Edward William Olsen

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L23/00

摘要： A flipchip may include: a silicon die having a circuit side with solder bumps and a non-circuit side; a leadframe attached to the solder bumps on the circuit side of the silicon die; a heat spreader attached to the non-circuit side of the silicon die; and encapsulation material encapsulating the silicon die, a portion of the leadframe, and all but one exterior surface of the heat spreader. The leadframe may have NiPdAu plating on the portion that is not encapsulated by the encapsulation material and no plating on the portion that is attached to the solder bumps.

公开(公告)号：US09691681B2

公开(公告)日：2017-06-27

申请号：US15154489

申请日：2016-05-13

申请人： LINEAR TECHNOLOGY CORPORATION

发明人： Edward William Olsen

IPC分类号： H01L21/44 ,  H01L23/367 ,  H01L23/31 ,  H01L23/48 ,  H01L23/433 ,  H01L23/498 ,  H01L21/48 ,  H01L23/538 ,  H01L23/00 ,  H01L21/268 ,  H01L21/285 ,  H01L21/288 ,  H01L21/3105 ,  H01L21/56 ,  H01L21/768 ,  H01L23/373 ,  H01L23/36

CPC分类号： H01L23/3675 ,  H01L21/268 ,  H01L21/2855 ,  H01L21/2885 ,  H01L21/3105 ,  H01L21/486 ,  H01L21/56 ,  H01L21/76802 ,  H01L21/76879 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/49861 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/04105 ,  H01L2224/16245 ,  H01L2224/19 ,  H01L2224/29111 ,  H01L2224/2912 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/83005 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/14

摘要： A method of making an integrated circuit package that contains a semiconductor die having one or more electrical connections to an electronic circuit within the semiconductor die. The method may include: encapsulating the semiconductor die and its electrical connections in non-electrically conductive, encapsulation material; laser drilling the encapsulation material to expose one of the electrical connections within the integrated circuit package, thereby creating a via opening in an external surface of the encapsulation material to the electrical connection; and electroplating or sputtering over the via opening in the encapsulation material to create a conductive routing layer from the exterior surface of the encapsulation material to the electrical connection.

公开(公告)号：US20160035644A1

公开(公告)日：2016-02-04

申请号：US14630239

申请日：2015-02-24

申请人： LINEAR TECHNOLOGY CORPORATION

发明人： Edward William Olsen ,  Leonard Shtargot ,  David Roy Ng ,  Jeffrey Kingan Witt

IPC分类号： H01L23/367 ,  H01L23/48 ,  H01L25/065 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/3675 ,  H01L21/268 ,  H01L21/2855 ,  H01L21/2885 ,  H01L21/3105 ,  H01L21/486 ,  H01L21/56 ,  H01L21/76802 ,  H01L21/76879 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/49861 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/04105 ,  H01L2224/16245 ,  H01L2224/19 ,  H01L2224/29111 ,  H01L2224/2912 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/83005 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/14

摘要： An integrated circuit package may include a semiconductor die, a heat spreader, and encapsulation material. The semiconductor die may contain an electronic circuit and exposed electrical connections to the electronic circuit. The heat spreader may be thermally-conductive and may have a first outer surface and a second outer surface substantially parallel to the first outer surface. The first outer surface may be affixed to all portions of a silicon side of the semiconductor die in a thermally-conductive manner. The encapsulation material may be non-electrically conductive and may completely encapsulate the semiconductor die and the heat spreader, except for the second surface of the heat spreader. The second surface of the heat spreader may be solderable and may form part of an exterior surface of the integrated circuit package.

摘要翻译： 集成电路封装可以包括半导体管芯，散热器和封装材料。 半导体管芯可以包含电子电路和暴露的电连接到电子电路。 散热器可以是导热的并且可以具有基本上平行于第一外表面的第一外表面和第二外表面。 第一外表面可以以导热方式固定到半导体管芯的硅侧的所有部分。 除了散热器的第二表面之外，封装材料可以是不导电的，并且可以完全封装半导体管芯和散热器。 散热器的第二表面可以是可焊接的并且可以形成集成电路封装的外表面的一部分。