公开(公告)号：US20160218077A1

公开(公告)日：2016-07-28

申请号：US15023702

申请日：2014-09-29

Applicant: LINTEC CORPORATION

Inventor： Yuichiro Azuma ,  Sayaka Tsuchiyama ,  Akio Kabuto

IPC: H01L23/00 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L24/29 ,  B32B7/12 ,  B32B27/08 ,  B32B27/16 ,  B32B27/20 ,  B32B27/22 ,  B32B27/308 ,  B32B2250/44 ,  B32B2457/14 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/31 ,  H01L21/6836 ,  H01L23/295 ,  H01L23/3142 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2223/54486 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2924/0002 ,  H01L2924/0635 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/20643

Abstract: The present invention relates to a composite sheet for resin film formation composed of a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer on a base and a heat curable film for resin film formation provided on the pressure-sensitive adhesive layer. The film for resin film formation includes a binder component having a reactive double bond group. The pressure-sensitive adhesive layer includes a non-energy ray curable pressure-sensitive adhesive composition or a cured product of an energy ray curable pressure-sensitive adhesive composition.

Abstract translation: 本发明涉及一种用于树脂膜形成的复合片材，其由在基底上具有压敏粘合剂层的压敏粘合片和用于树脂膜形成的热固化膜组成，该粘合片材设置在压敏粘合剂层上。 用于树脂膜形成的膜包括具有反应性双键基团的粘合剂组分。 压敏粘合剂层包括非能量射线固化型压敏粘合剂组合物或能量射线固化型压敏粘合剂组合物的固化产物。

公开(公告)号：US10131824B2

公开(公告)日：2018-11-20

申请号：US14906284

申请日：2014-08-01

Applicant: Lintec Corporation

Inventor： Sayaka Tsuchiyama ,  Isao Ichikawa

IPC: C09J133/00 ,  C09J163/00 ,  C09J175/04 ,  H01L21/683 ,  C09J133/06 ,  H01L23/00 ,  C08G18/80 ,  C08L33/06 ,  C09J7/22 ,  C09J7/30 ,  C08F220/20

Abstract: An adhesive composition includes an acrylic polymer (A) having a weight-average molecular weight (Mw) of 350,000 or higher obtained by polymerizing an acrylic monomer by living radical polymerization using an organotellurium-containing compound as the polymerization initiator, an epoxy thermosetting resin (B), and a thermosetting agent (C). The adhesive composition is capable of joining with sufficient adhesive strength and capable of achieving high package reliability in a semiconductor device.

公开(公告)号：US09434865B2

公开(公告)日：2016-09-06

申请号：US13832170

申请日：2013-03-15

Applicant: LINTEC Corporation

Inventor： Sayaka Tsuchiyama ,  Isao Ichikawa

IPC: C09J5/00 ,  C09J7/02 ,  C09J133/08 ,  C09J133/10 ,  C09J133/12 ,  C09J133/14 ,  C09J133/24 ,  H01L21/78 ,  H01L21/58 ,  C09J133/00 ,  H01L21/683 ,  C09J133/06 ,  C09J143/04 ,  H01L23/00 ,  H01L25/00 ,  H01L23/29 ,  H01L25/065

CPC classification number: C09J133/00 ,  C09J5/00 ,  C09J7/35 ,  C09J133/06 ,  C09J133/066 ,  C09J133/14 ,  C09J133/24 ,  C09J143/04 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/293 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/83 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  Y10T428/2826 ,  H01L2224/27 ,  H01L2924/0635 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having unsaturated hydrocarbon group, and a coupling agent (C) having reactive a double bond group.

Abstract translation: 粘合剂组合物包括丙烯酸类聚合物（A），具有不饱和烃基的热固性树脂（B）和具有双键基团的反应性的偶联剂（C）。

公开(公告)号：US20130244402A1

公开(公告)日：2013-09-19

申请号：US13832210

申请日：2013-03-15

Applicant: LINTEC CORPORATION

Inventor： Sayaka Tsuchiyama ,  Isao Ichikawa

IPC: C09J133/00 ,  H01L21/683 ,  H01L21/78

CPC classification number: C09J133/00 ,  B32B17/10697 ,  B32B17/10733 ,  B32B17/10743 ,  C09J133/066 ,  C09J133/08 ,  C09J133/10 ,  C09J163/00 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/293 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/2949 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/83 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  Y10T428/2826 ,  H01L2224/27 ,  H01L2924/0635 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having unsaturated hydrocarbon group, and a filler (C) having reactive double bond on a surface.

Abstract translation: 粘合剂组合物包括丙烯酸类聚合物（A），具有不饱和烃基的热固性树脂（B）和表面具有反应性双键的填料（C）。

公开(公告)号：US09382455B2

公开(公告)日：2016-07-05

申请号：US13832210

申请日：2013-03-15

Applicant: LINTEC Corporation

Inventor： Sayaka Tsuchiyama ,  Isao Ichikawa

IPC: B32B27/30 ,  B32B27/38 ,  C09J133/08 ,  C09J133/10 ,  C09J133/14 ,  H01L21/784 ,  H01L23/14 ,  C09J133/00 ,  H01L21/78 ,  H01L21/683 ,  B32B17/10 ,  C09J163/00 ,  C09J133/06 ,  H01L23/00 ,  H01L23/29

CPC classification number: C09J133/00 ,  B32B17/10697 ,  B32B17/10733 ,  B32B17/10743 ,  C09J133/066 ,  C09J133/08 ,  C09J133/10 ,  C09J163/00 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/293 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/2949 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/83 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  Y10T428/2826 ,  H01L2224/27 ,  H01L2924/0635 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having unsaturated hydrocarbon group, and a filler (C) having reactive double bond on a surface.

Abstract translation: 粘合剂组合物包括丙烯酸类聚合物（A），具有不饱和烃基的热固性树脂（B）和表面具有反应性双键的填料（C）。

公开(公告)号：US20160160094A1

公开(公告)日：2016-06-09

申请号：US14906284

申请日：2014-08-01

Applicant: LINTEC CORPORATION

Inventor： Sayaka Tsuchiyama ,  Isao IChikawa

IPC: C09J133/00 ,  C09J7/02

CPC classification number: C09J133/00 ,  C08F220/20 ,  C08G18/8022 ,  C08G2170/40 ,  C08L33/06 ,  C09J7/22 ,  C09J7/30 ,  C09J133/066 ,  C09J163/00 ,  C09J175/04 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2224/2919

Abstract: An adhesive composition includes an acrylic polymer (A) having a weight-average molecular weight (Mw) of 350,000 or higher obtained by polymerizing an acrylic monomer by living radical polymerization using an organotellurium-containing compound as the polymerization initiator, an epoxy thermosetting resin (B), and a thermosetting agent (C). The adhesive composition is capable of joining with sufficient adhesive strength and capable of achieving high package reliability in a semiconductor device.

Abstract translation: 粘合剂组合物包括通过使用含有有机碲的化合物作为聚合引发剂的活性自由基聚合使丙烯酸类单体聚合而获得的重均分子量（Mw）为35万以上的丙烯酸类聚合物（A），环氧性热固性树脂 B）和热固性剂（C）。 粘合剂组合物能够以足够的粘合强度接合并且能够在半导体器件中实现高封装可靠性。

公开(公告)号：US20160086908A1

公开(公告)日：2016-03-24

申请号：US14888509

申请日：2014-05-27

Applicant: LINTEC CORPORATION

Inventor： Sayaka Tsuchiyama ,  Naoya Saiki ,  Yuichiro Azuma ,  Hideaki Suzuki

IPC: H01L23/00 ,  C09J133/10 ,  H01L25/00 ,  H01L21/78 ,  H01L21/683

CPC classification number: H01L24/29 ,  C08J3/242 ,  C08J2333/12 ,  C08K3/36 ,  C08K9/04 ,  C08L33/066 ,  C08L63/00 ,  C09J7/22 ,  C09J7/30 ,  C09J133/066 ,  C09J133/10 ,  C09J163/00 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/0635 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/27 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having a reactive double bond group, and a filler (C) having a reactive double bond group on a surface thereof. The acrylic polymer (A) has a weight average molecular weight of 500,000 or more, and the heat curable resin (B) comprises an epoxy resin and a heat curing agent, in which at least one of the epoxy resin and the heat curing agent has the reactive double bond group.

Abstract translation: 粘合剂组合物包括丙烯酸类聚合物（A），具有反应性双键基团的热固性树脂（B）和其表面具有反应性双键基团的填料（C）。 丙烯酸类聚合物（A）的重均分子量为50万以上，热固性树脂（B）包含环氧树脂和热固化剂，其中环氧树脂和热固化剂中的至少一种具有 反应性双键组。

公开(公告)号：US20130244401A1

公开(公告)日：2013-09-19

申请号：US13832170

申请日：2013-03-15

Applicant: LINTEC CORPORATION

Inventor： Sayaka Tsuchiyama ,  Isao Ichikawa

IPC: C09J133/00 ,  H01L21/683 ,  H01L21/78

CPC classification number: C09J133/00 ,  C09J5/00 ,  C09J7/35 ,  C09J133/06 ,  C09J133/066 ,  C09J133/14 ,  C09J133/24 ,  C09J143/04 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/293 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/83 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  Y10T428/2826 ,  H01L2224/27 ,  H01L2924/0635 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having unsaturated hydrocarbon group, and a coupling agent (C) having reactive a double bond group.

Abstract translation: 粘合剂组合物包括丙烯酸类聚合物（A），具有不饱和烃基的热固性树脂（B）和具有双键基团的反应性的偶联剂（C）。