公开(公告)号：US20160215172A1

公开(公告)日：2016-07-28

申请号：US15021094

申请日：2014-09-24

Applicant: LINTEC CORPORATION

Inventor： Wataru MORITA ,  Kunihisa KATO ,  Tsuyoshi MUTOU

IPC: C09J7/00 ,  H01L35/32 ,  C09J9/02

CPC classification number: C09J7/00 ,  C08G18/6229 ,  C08G18/6254 ,  C08G18/8116 ,  C08K3/08 ,  C08K3/22 ,  C08K3/28 ,  C08K2003/385 ,  C08K2201/001 ,  C09J7/10 ,  C09J9/00 ,  C09J9/02 ,  C09J11/04 ,  C09J175/04 ,  C09J183/04 ,  C09J201/00 ,  C09J2201/40 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2475/00 ,  C09J2483/00 ,  H01L35/30 ,  H01L35/32 ,  H01L35/34

Abstract: The present invention provides a thermally conductive adhesive sheet that can be easily laminated on an electronic device without an adhesive layer therebetween and can further selectively dissipate heat in a particular direction to provide a sufficient temperature difference to the inside of the electronic device, a method for producing the same, and an electronic device using the same. The present invention includes a thermally conductive adhesive sheet comprising a high thermally conductive portion and a low thermally conductive portion, wherein the high thermally conductive portion and the low thermally conductive portion have adhesiveness, and the high thermally conductive portion and the low thermally conductive portion each independently constitute an entire thickness of the thermally conductive adhesive sheet, or at least either the high thermally conductive portion or the low thermally conductive portion constitutes a portion of a thickness of the thermally conductive adhesive sheet, and a method for producing the thermally conductive adhesive sheet, and an electronic device using the thermally conductive adhesive sheet.

Abstract translation: 本发明提供一种导热粘合片，其可以容易地层叠在电子设备上，而不会在其间具有粘合剂层，并且可以进一步选择性地在特定方向上散热，以向电子设备的内部提供足够的温差， 制造它们以及使用该装置的电子装置。 本发明包括一种导热粘合片，其包括导热部分和导热性较差的部分，其中高导热部分和低导热部分具有粘合性，并且高导热部分和低导热部分各自 独立地构成导热性粘合片的整个厚度，或者导热性高的导热部或低导热性部中的至少一方构成导热性粘合片的厚度的一部分，以及导热性粘合片的制造方法 ，以及使用导热性粘合片的电子装置。

公开(公告)号：US20160222256A1

公开(公告)日：2016-08-04

申请号：US15021854

申请日：2014-09-24

Applicant: LINTEC CORPORATION

Inventor： Kunihisa KATO ,  Wataru MORITA ,  Tsuyoshi MUTOU

IPC: C09J9/02 ,  C09J7/02 ,  H01L35/02

CPC classification number: C09J9/02 ,  C08K3/04 ,  C08K3/041 ,  C08K3/042 ,  C08K3/046 ,  C08K3/22 ,  C08K3/28 ,  C08K2003/2227 ,  C08K2003/385 ,  C08K2201/001 ,  C09J7/22 ,  C09J2201/122 ,  C09J2203/326 ,  C09J2205/106 ,  C09J2483/00 ,  H01L35/02 ,  H01L35/32

Abstract: The present invention provides a thermally conductive adhesive sheet that can be laminated on an electronic device to efficiently dissipate heat and to selectively dissipate heat in a particular direction to provide a sufficient temperature difference to the inside of the electronic device, a method for producing the same, and an electronic device using the same. The present invention includes a thermally conductive adhesive sheet comprising a base material comprising a high thermally conductive portion and a low thermally conductive portion; and an adhesive layer, wherein the adhesive layer is laminated on one face of the base material, and the other face of the base material is composed of a face of the low thermally conductive portion opposite to a face in contact with the adhesive layer and a face of the high thermally conductive portion opposite to a face in contact with the adhesive layer, or at least either the high thermally conductive portion or the low thermally conductive portion constitutes a portion of a thickness of the base material, and a method for producing the thermally conductive adhesive sheet, and an electronic device using the thermally conductive adhesive sheet.

Abstract translation: 本发明提供一种可以层压在电子设备上以有效散热并选择性地在特定方向上散热以向电子设备内部提供足够的温度差的导热粘合片，其制造方法 ，以及使用该装置的电子装置。 本发明包括一种导热粘合片，其包括包含高导热部分和低导热部分的基底材料; 以及粘合剂层，其中所述粘合剂层层压在所述基材的一个面上，并且所述基材的另一个面由与所述粘合剂层接触的面相对的所述低导热部分的面和 高导热部分与与粘合剂层接触的面相反的表面，或至少高导热部分或低导热部分中的至少一个构成基材厚度的一部分，以及制造 导热性粘合片，以及使用导热性粘合片的电子装置。

公开(公告)号：US20200066960A1

公开(公告)日：2020-02-27

申请号：US16467745

申请日：2017-12-07

Applicant: LINTEC CORPORATION

Inventor： Kunihisa KATO ,  Wataru MORITA ,  Tsuyoshi MUTOU ,  Yuma KATSUTA ,  Takeshi KONDO

IPC: H01L35/34 ,  H01L35/16 ,  H01L35/26 ,  H01L35/24 ,  B32B27/18 ,  B32B7/02

Abstract: The present invention provides: a thermoelectric conversion material capable of being produced in a simplified manner and at a lower cost and excellent in thermoelectric performance and flexibility, and a method for producing the material. The thermoelectric conversion material has, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound. The method for producing a thermoelectric conversion material having, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound includes a step of applying a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound onto a support and drying it to form a thin film thereon, and a step of annealing the thin film.

公开(公告)号：US20170373240A1

公开(公告)日：2017-12-28

申请号：US15538337

申请日：2015-12-24

Applicant: LINTEC CORPORATION

Inventor： Kunihisa KATO ,  Tsuyoshi MUTOU ,  Wataru MORITA ,  Yuma KATSUTA ,  Takeshi KONDO

IPC: H01L35/26 ,  H01L35/32 ,  H01L35/16 ,  H01L35/34 ,  F25B21/02

CPC classification number: H01L35/26 ,  F25B21/02 ,  H01L35/16 ,  H01L35/24 ,  H01L35/32 ,  H01L35/34

Abstract: To provide a Peltier cooling element that is excellent in thermoelectric performance and flexibility and can be manufactured easily at low cost. A Peltier cooling element containing a thermoelectric conversion material containing a support having thereon a thin film containing a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, and a method for manufacturing a Peltier cooling element containing a thermoelectric conversion material containing a support having thereon a thin film containing a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, the method containing: coating a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, on a support, and drying, so as to form a thin film; and subjecting the thin film to an annealing treatment.

公开(公告)号：US20170069933A1

公开(公告)日：2017-03-09

申请号：US15123089

申请日：2015-02-27

Applicant: LINTEC Corporation

Inventor： Takashi MORIOKA ,  Tsuyoshi MUTOU

IPC: H01M10/0565 ,  H01B1/10 ,  H01M10/0525 ,  H01B1/08

CPC classification number: H01M10/0565 ,  G01B7/30 ,  G01D5/24485 ,  H01B1/06 ,  H01B1/08 ,  H01B1/10 ,  H01M10/052 ,  H01M10/0525 ,  H01M2300/0082 ,  H02P6/16 ,  H02P6/182 ,  H02P21/06 ,  Y02T10/7011

Abstract: A film-attached solid electrolyte membrane includes: a film having a surface that has a contact angle with respect to acetonitrile in a range from 35 to 75 degrees and a contact angle with respect to chloroform in a range from 15 to 40 degrees; and a solid electrolyte membrane in contact with the surface of the film. A manufacturing method of a film-attached solid electrolyte membrane includes: coating a solid-electrolyte-membrane-forming composition on a surface of a film that has a contact angle with respect to acetonitrile in a range from 35 to 75 degrees and a contact angle with respect to chloroform in a range from 15 to 40 degrees; and curing the coated solid-electrolyte-membrane-forming composition to form a solid electrolyte membrane.

Abstract translation: 膜附着固体电解质膜包括：具有相对于乙腈的接触角为35〜75度的表面和相对于氯仿的接触角为15〜40度的膜的膜; 以及与膜的表面接触的固体电解质膜。 膜固定电解质膜的制造方法包括：在与乙腈的接触角为35〜75度的膜的表面上涂布固体电解质成膜组合物，接触角 相对于15至40度范围内的氯仿; 并固化涂覆的固体电解质膜形成组合物以形成固体电解质膜。

公开(公告)号：US20160284963A1

公开(公告)日：2016-09-29

申请号：US14777870

申请日：2014-03-18

Applicant: NATIONAL UNIVERSITY CORPORATION NAGAOKA UNIVERSITY OF TECHNOLOGY ,  LINTEC CORPORATION

Inventor： Masatoshi TAKEDA ,  Tsuyoshi MUTOU ,  Takeshi KONDO

IPC: H01L35/32 ,  H01L35/18 ,  H01L35/16

CPC classification number: H01L35/32 ,  H01L35/16 ,  H01L35/18 ,  H01L35/30

Abstract: A thermoelectric conversion element that can efficiently make a temperature difference across a thermoelectric conversion material is provided. In the thermoelectric conversion element, on a first surface of a thermoelectric conversion module comprising a P-type thermoelectric element, an N-type thermoelectric element, and an electrode, a thermally conductive resin layer A and a thermally conductive resin layer B having a lower thermal conductivity than the thermally conductive resin layer A are provided in an alternating manner so as to be in direct contact with the first surface, and on a second surface on the opposite side of the first surface of the thermoelectric conversion module, a thermally conductive resin layer a and a thermally conductive resin layer b having a lower thermal conductivity than the thermally conductive resin layer a are provided in an alternating manner so as to be in direct contact with the second surface.

Abstract translation: 可以提供能够有效地在热电转换材料上形成温度差的热电转换元件。 在热电转换元件中，在包含P型热电元件，N型热电元件和电极的热电转换模块的第一表面上，导热树脂层A和导热性树脂层B具有较低的 交替地设置与导热性树脂层A的导热性，以便与第一表面直接接触，并且在热电转换模块的第一表面的相反侧的第二表面上设置导热树脂 以交替的方式设置具有比导热树脂层a低的热导率的导热树脂层b，以便与第二表面直接接触。

公开(公告)号：US20160013391A1

公开(公告)日：2016-01-14

申请号：US14770573

申请日：2014-02-18

Applicant: LINTEC CORPORATION ,  KYUSHU INSTITUTE OF TECHNOLOGY

Inventor： Kunihisa KATO ,  Tsuyoshi MUTOU ,  Koji MIYAZAKI ,  Aiko HARADA

IPC: H01L35/32 ,  H01L35/34 ,  H01L35/14

CPC classification number: H01L35/32 ,  H01L35/14 ,  H01L35/16 ,  H01L35/18 ,  H01L35/24 ,  H01L35/34

Abstract: The invention provides a thermoelectric conversion material having a low thermal conductivity and an improved figure of merit and a production method for the material, and also provides a thermoelectric conversion module. The thermoelectric conversion material has, on a porous substrate having microscopic pores, a thermoelectric semiconductor layer formed of a thermoelectric semiconductor material, wherein the porous substrate has a polymer layer (B) on a plastic film (A) and the microscopic pores are formed in the polymer layer (B) and in a part of the plastic film (A). The production method for the thermoelectric conversion material comprises a substrate formation step of forming a porous substrate including a step 1, a step 2 and a step 3, and comprises a film formation step of forming a thermoelectric semiconductor layer through film formation of a thermoelectric semiconductor material on the porous substrate. The thermoelectric conversion module uses the thermoelectric conversion material.

Abstract translation: 本发明提供一种具有低热导率和改善的品质因数的热电转换材料和该材料的制造方法，并且还提供一种热电转换模块。 热电转换材料在具有微细孔的多孔基材上具有由热电半导体材料形成的热电半导体层，其中多孔基材在塑料膜（A）上具有聚合物层（B），微细孔形成在 聚合物层（B）和塑料膜（A）的一部分。 热电转换材料的制造方法包括：形成包括步骤1，工序2和工序3的多孔质基材的基板形成工序，并且具有通过成膜热电半导体形成热电半导体层的成膜工序 多孔基材上的材料。 热电转换模块使用热电转换材料。