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公开(公告)号：US06395994B1
公开(公告)日：2002-05-28
申请号：US09495242
申请日：2000-01-31
IPC分类号： H05K103
CPC分类号： H01L24/45 , H01L21/4846 , H01L23/49861 , H01L23/5389 , H01L24/31 , H01L24/48 , H01L24/85 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/48699 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H05K3/4092 , H01L2924/013 , H01L2924/00013 , H01L2924/01033 , H01L2224/85399 , H01L2224/05599
摘要： A circuit component secured to a printed circuit board typically uses fine wires for completing the circuit from the printed circuit to the component. The component may be an integrated circuit having one or more pads thereon for receiving the wire. A device and method for making the device has the printed circuit formed on the PCB with one or more wire traces that are etched away from the printed circuit. The etchant removes a portion of the bottom layer and sometimes the middle layer of an etched tri-metal along with any lamination and adhesive. This forms a free end of the wire trace that is bonded to the component. Additional wires are not required.
摘要翻译： 固定到印刷电路板的电路部件通常使用细线来完成从印刷电路到部件的电路。 该部件可以是其上具有一个或多个焊盘以用于接收线的集成电路。 用于制造该器件的器件和方法具有形成在PCB上的印刷电路，其中一个或多个导线沿印刷电路蚀刻。 蚀刻剂除去蚀刻的三金属的底层的一部分以及有时的中间层以及任何层压和粘合剂。 这形成了结合到组件的线迹的自由端。 不需要额外的电线。
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公开(公告)号：US6000597A
公开(公告)日：1999-12-14
申请号：US14878
申请日：1998-01-28
申请人： Marc Alan Straub , Frank Burke DiPiazza , Vivek Amir Jairazbhoy , Lakhi Nandial Goenka , Randy Claude Stevenson
发明人： Marc Alan Straub , Frank Burke DiPiazza , Vivek Amir Jairazbhoy , Lakhi Nandial Goenka , Randy Claude Stevenson
CPC分类号： B23K3/0607 , H05K3/3457
摘要： An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.
摘要翻译： 用于分配焊料的设备包括具有形成在其中的多个流动通道的喷嘴体。 每个流动通道包括用于分配焊料的入口端和分配器端。 喷嘴体形成围绕每个分配器端的乳头，并且喷嘴体还形成与每个分配器端连通的屏蔽室，用于保护相应的乳头，并且可选地提供惰性气体流和/或排除来自焊接区域的环境氧气。 喷嘴体包括微加工硅。 提供了各种流动通道构造以改善流动特性。
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公开(公告)号：US06394369B2
公开(公告)日：2002-05-28
申请号：US09470135
申请日：1999-12-22
IPC分类号： B05B126
摘要： A nozzle 10 having a material outlet aperture 24 which causes received material 28 to be emitted in the form of a streaming sheet 30.
摘要翻译： 具有材料出口孔24的喷嘴10，其使接收的材料28以流动片材30的形式发射。
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公开(公告)号：US06315221B1
公开(公告)日：2001-11-13
申请号：US09470137
申请日：1999-12-22
IPC分类号： B05B100
CPC分类号： B05B7/0416
摘要： A nozzle 10 having an outlet aperture 26, the outlet aperture 26 having at least one injector 40,42 which is disposed within the aperture 26 and which injects a material 17 within the aperture 26, effective to allow the material to be atomized and to be emitted from the aperture 26 at a substantially identical velocity at each point within the aperture 26.
摘要翻译： 具有出口孔26的喷嘴10，出口孔26具有至少一个喷射器40,42，其被设置在孔26内并且在孔26内注入材料17，其有效地允许材料被雾化并成为 在孔26中的每个点处以基本相同的速度从孔26发射。
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公开(公告)号：US06318642B1
公开(公告)日：2001-11-20
申请号：US09470140
申请日：1999-12-22
IPC分类号： B05B1700
CPC分类号： B05B7/08 , B05B7/025 , B05B7/0416 , B05B7/066 , B05B12/18
摘要： A nozzle assembly 12 having shroud members 26, 28 which selectively emit a material 21 along at least one edge of emitted material 25. The selectively emitted material 21 substantially prevents and/or eliminates the turbulent shear layer which is formed within the emitted material 25.
摘要翻译： 具有护罩构件26,28的喷嘴组件12，其沿着发射材料25的至少一个边缘选择性地发射材料21.选择性地发射的材料21基本上防止和/或消除在发射的材料25内形成的湍流剪切层。
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公开(公告)号：US5746368A
公开(公告)日：1998-05-05
申请号：US649750
申请日：1996-05-15
申请人： Marc Alan Straub , Frank Burke DiPiazza , Vivek Amir Jairazbhoy , Lakhi Nandial Goenka , Randy Claude Stevenson
发明人： Marc Alan Straub , Frank Burke DiPiazza , Vivek Amir Jairazbhoy , Lakhi Nandial Goenka , Randy Claude Stevenson
CPC分类号： B23K3/0607 , H05K3/3457
摘要： An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.
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