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公开(公告)号：US5470549A
公开(公告)日：1995-11-28
申请号：US361415
申请日：1994-12-22
IPC分类号： B22F1/02 , B22F9/22 , C01G41/00 , C04B41/51 , C04B41/88 , C22C1/04 , H01H1/025 , H01L23/498 , C01G3/00
CPC分类号： C01G41/00 , B22F1/025 , B22F9/22 , C04B41/5133 , C04B41/88 , C22C1/045 , H01H1/025 , H01L23/49883 , B22F2998/00 , H01L2924/0002
摘要： A method for making a tungsten-copper composite oxide wherein an amount of an ammonium tungstate and an amount of an oxide or hydroxide of copper are combined without milling to form a mixture. The unmilled mixture is then dehydrated and fired at a temperature and for a time sufficient to form the tungsten-copper composite oxide.
摘要翻译： 一种制备钨 - 铜复合氧化物的方法，其中将钨酸铵和一定量的铜的氧化物或氢氧化物的组合不经研磨以形成混合物。 然后将未磨碎的混合物在足以形成钨 - 铜复合氧化物的温度和时间下脱水和烧制。
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公开(公告)号：US5468457A
公开(公告)日：1995-11-21
申请号：US362024
申请日：1994-12-22
IPC分类号： B22F1/02 , B22F9/22 , C01G41/00 , C04B41/51 , C04B41/88 , C22C1/04 , H01H1/025 , H01L23/498 , C01G3/00
CPC分类号： H01L23/49883 , B22F1/025 , B22F9/22 , C01G41/00 , C04B41/5133 , C04B41/88 , C22C1/045 , H01H1/025 , B22F2998/00 , H01L2924/0002
摘要： A method of making a tungsten-copper composite oxide wherein an amount of an oxide of tungsten and an amount of an oxide of copper are combined to form a mixture, the oxide of tungsten or the oxide of copper, or both, being in a hydrated form. The mixture is then milled, dehydrated and fired at a temperature and for a time sufficient to form the tungsten-copper composite oxide, the time sufficient to form the tungsten-copper composite oxide being at least about one-half the time sufficient to form the tungsten-copper composite oxide from a mixture of tungsten trioxide, WO.sub.3, and cupric oxide, CuO, under substantially similar conditions.
摘要翻译： 一种制造钨 - 铜复合氧化物的方法，其中钨的氧化物和铜的氧化物的量被组合以形成混合物，钨的氧化物或铜的氧化物或两者的水合物 形成。 然后将混合物在足以形成钨 - 铜复合氧化物的温度和时间下研磨，脱水和焙烧，足以形成钨 - 铜复合氧化物的时间至少足以形成钨 - 铜复合氧化物的一半 来自三氧化钨WO 3和氧化铜CuO的混合物的钨 - 铜复合氧化物在基本相似的条件下。
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公开(公告)号：US07122069B2
公开(公告)日：2006-10-17
申请号：US09804876
申请日：2001-03-13
申请人： Leonid P Dorfman , Michael J. Scheithauer , David L. Houck , Anna T. Spitsberg , Jeffrey N. Dann
发明人： Leonid P Dorfman , Michael J. Scheithauer , David L. Houck , Anna T. Spitsberg , Jeffrey N. Dann
CPC分类号： C01G39/00 , B22F1/025 , B22F3/001 , B22F2998/10 , C01P2002/72 , C01P2002/74 , C01P2004/03 , C01P2004/51 , C01P2004/61 , C01P2004/62 , C01P2004/84 , C01P2006/10 , C01P2006/12 , C01P2006/80 , C22C1/045 , Y10T428/12181 , B22F9/04 , B22F3/10
摘要： A Mo—Cu composite powder is provided which is comprised of individual finite particles each having a copper phase and a molybdenum phase wherein the molybdenum phase substantially encapsulates the copper phase. The composite powder may be consolidated by conventional P/M techniques and sintered without copper bleedout according to the method described herein to produce Mo—Cu pseudoalloy articles having very good shape retention, a high sintered density, and a fine microstructure.
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公开(公告)号：US5956560A
公开(公告)日：1999-09-21
申请号：US784159
申请日：1997-01-15
申请人： Leonid P. Dorfman , David L. Houck , Michael J. Scheithauer , Muktesh Paliwal , Gail T. Meyers , Frank J. Venskytis
发明人： Leonid P. Dorfman , David L. Houck , Michael J. Scheithauer , Muktesh Paliwal , Gail T. Meyers , Frank J. Venskytis
IPC分类号： B22F1/00 , B22F1/02 , B22F9/22 , C01G41/00 , C04B41/51 , C04B41/88 , C22C1/04 , H01H1/025 , H01L23/498 , H05K1/09
CPC分类号： C04B41/009 , B22F1/025 , B22F9/22 , C01G41/00 , C04B41/5133 , C04B41/88 , C22C1/045 , H01H1/025 , H01L23/49883 , B22F2998/00 , C04B2111/00844 , H01L2924/0002 , H05K1/092 , Y10T428/12181 , Y10T428/2993
摘要： A high performance W--Cu composite powder which is composed of individual particles having a tungsten phase and a copper phase wherein the tungsten phase substantially encapsulates the copper phase. The tungsten-coated copper composite powder may be pressed and sintered into W--Cu pseudoalloy articles having a homogeneous distribution of W and Cu phases without experiencing copper bleedout or it may be used in ceramic metallization for the electronics industry.
摘要翻译： 一种高性能的W-Cu复合粉末，其由具有钨相和铜相的单个颗粒组成，其中钨相基本上封装铜相。 可以将钨涂覆的铜复合粉末压制并烧结成具有均匀分布的W相和Cu相的W-Cu假合金制品，而不会经历铜渗出，或者可以用于电子工业的陶瓷金属化。
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公开(公告)号：US07045113B2
公开(公告)日：2006-05-16
申请号：US10247890
申请日：2002-09-20
申请人： Leonid P Dorfman , Michael J. Scheithauer , David L. Houck , Anna T. Spitsberg , Jeffrey N. Dann
发明人： Leonid P Dorfman , Michael J. Scheithauer , David L. Houck , Anna T. Spitsberg , Jeffrey N. Dann
CPC分类号： C01G39/00 , B22F1/025 , B22F3/001 , B22F2998/10 , C01P2002/72 , C01P2002/74 , C01P2004/03 , C01P2004/51 , C01P2004/61 , C01P2004/62 , C01P2004/84 , C01P2006/10 , C01P2006/12 , C01P2006/80 , C22C1/045 , Y10T428/12181 , B22F9/04 , B22F3/10
摘要： A Mo—Cu composite powder is provided which is comprised of individual finite particles each having a copper phase and a molybdenum phase wherein the molybdenum phase substantially encapsulates the copper phase. The composite powder may be consolidated by conventional P/M techniques and sintered without copper bleedout according to the method described herein to produce Mo—Cu pseudoalloy articles having very good shape retention, a high sintered density, and a fine microstructure.
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公开(公告)号：US06375708B1
公开(公告)日：2002-04-23
申请号：US09652175
申请日：2000-08-31
申请人： Leonid P. Dorfman , Michael J. Scheithauer , Muktesh Paliwal , David L. Houck , James R. Spencer
发明人： Leonid P. Dorfman , Michael J. Scheithauer , Muktesh Paliwal , David L. Houck , James R. Spencer
IPC分类号： C22C2704
CPC分类号： B22F1/025 , B22F1/0003 , B22F9/22 , B22F2998/00 , C01G41/00 , C04B41/5133 , C04B41/88 , C22C1/045 , H01H1/025 , H01H11/048 , H01L23/49883 , H01L2924/0002 , H05K1/092 , B22F3/1035 , H01L2924/00
摘要： A W—Cu—Ni alloy having thermophysical properties suitable for use in electrical contacts and electrodes is described. The alloy is formed by direct sintering of a powder blend comprising a tungsten-copper composite powder and a nickel powder. The tungsten-copper composite powder component of the blend comprises individual dual phase particles having a copper phase and a tungsten phase wherein the tungsten phase substantially encapsulates the copper phase. The method for direct sintering the W—Cu—Ni alloy substantially eliminates the formation of brittle intermetallics and slumping during sintering.
摘要翻译： 描述了具有适用于电触点和电极的热物性的W-Cu-Ni合金。 通过直接烧结包含钨 - 铜复合粉末和镍粉末的粉末混合物形成合金。 共混物的钨 - 铜复合粉末组分包括具有铜相和钨相的单独的双相颗粒，其中钨相基本上封装铜相。 直接烧结W-Cu-Ni合金的方法基本上消除了脆性金属间化合物的形成和烧结期间的塌陷。
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公开(公告)号：US6103392A
公开(公告)日：2000-08-15
申请号：US559903
申请日：1995-11-17
申请人： Leonid P. Dorfman , David L. Houck , Michael J. Scheithauer , Gail T. Meyers , Frank J. Venskytis
发明人： Leonid P. Dorfman , David L. Houck , Michael J. Scheithauer , Gail T. Meyers , Frank J. Venskytis
IPC分类号： B22F1/00 , B22F1/02 , B22F9/22 , C01G41/00 , C04B41/51 , C04B41/88 , C22C1/04 , H01H1/025 , H01L23/498 , H05K1/09 , B22F9/20
CPC分类号： C04B41/009 , B22F1/025 , B22F9/22 , C01G41/00 , C04B41/5133 , C04B41/88 , C22C1/045 , H01H1/025 , H01L23/49883 , B22F2998/00 , C04B2111/00844 , H01L2924/0002 , H05K1/092 , Y10T428/12181 , Y10T428/2993
摘要： A high performance W--Cu composite powder is provided which is composed of individual particles having a tungsten phase and a copper phase wherein the tungsten phase substantially encapsulates the copper phase. The tungsten-coated copper composite powder may be pressed and sintered into W--Cu pseudoalloy articles having a homogeneous distribution of W and Cu phases without experiencing copper bleedout or it may be used in ceramic metallization for the electronics industry.
摘要翻译： 提供一种高性能的W-Cu复合粉末，其由具有钨相和铜相的单个颗粒组成，其中钨相基本上封装铜相。 可以将钨涂覆的铜复合粉末压制并烧结成具有均匀分布的W相和Cu相的W-Cu假合金制品，而不会经历铜渗出，或者可以用于电子工业的陶瓷金属化。
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公开(公告)号：US06780219B2
公开(公告)日：2004-08-24
申请号：US10189620
申请日：2002-07-03
IPC分类号： B22F100
摘要： A method for spheridizing silicon metal particles is described. The method involves injecting irregular silicon metal particles into a high-temperature plasma reactor to melt at least 50 weight percent of the particles. The molten droplets are solidified to form substantially spherical silicon particles having a thin SiO coating which may be removed by treating with a weak hydroxide solution.
摘要翻译： 描述了硅化金属颗粒的球化方法。 该方法包括将不规则的硅金属颗粒注入到高温等离子体反应器中以熔化至少50重量％的颗粒。 熔融的液滴固化形成具有薄的SiO涂层的基本上球形的硅颗粒，其可以用弱氢氧化物溶液处理除去。
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公开(公告)号：US06793907B1
公开(公告)日：2004-09-21
申请号：US10207503
申请日：2002-07-29
申请人： Raj P. Singh , Thomas A. Wolfe , David L. Houck
发明人： Raj P. Singh , Thomas A. Wolfe , David L. Houck
IPC分类号： C01G3902
CPC分类号： C01G39/00 , C01P2002/72 , C01P2002/74 , C01P2002/86
摘要： A novel molybdenum compound, ammonium dodecamolybdomolybdate (AMM), is described which may be used in the manufacture of molybdenum metal and molybdenum carbide powders. The molybdenum compound is a dodecaheteropoly acid salt having a Keggin-type structure wherein molybdenum resides in both the hetero as well as peripheral atomic positions. The novel compound has the general formula (NH4)2Mo12MoO40.6H2O. Because of its low solubility, the compound can be crystallized efficiently and at a high purity from ammonium molybdate solutions.
摘要翻译： 描述了一种新的钼化合物，十二烷基多钼酸铵（AMM），其可用于制造钼金属和碳化钼粉末。 钼化合物是具有Keggin型结构的十二杂多酸盐，其中钼位于杂原子和外周原子位置。 该新化合物具有通式（NH 4）2 Mo 12 MoO 40·6H 2 O。 由于溶解度低，化合物可以有效地从钼酸铵溶液中高纯度地结晶出来。
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10.发明授权
公开(公告)号：US5173108A
公开(公告)日：1992-12-22
申请号：US790120
申请日：1991-11-12
申请人： David L. Houck
发明人： David L. Houck
IPC分类号： C22B34/34
CPC分类号： C22B34/34
摘要： A method is disclosed for producing an agglomerated molybdenum plasma spray powder with a controlled level of oxygen which comprises forming a relatively uniform mixture of agglomerated powders containing molybdenum dioxide and one or more ammonium-containing compounds of molybdenum wherein the mixture has an oxygen content of greater than about 25% by weight and reducing the mixture in a moving bed furnace at a temperature of from about 700.degree. C. to about 1000.degree. C. for a sufficient time to remove a portion of the oxygen therefrom and form reduced molybdenum powder agglomerates having an oxygen content of no greater than about 25% by weight. The reduction takes place in the direction from the outside surface of the agglometates to the inside surface.
摘要翻译： 公开了一种用于生产具有受控的氧含量的聚集的钼等离子喷涂粉末的方法，其包括形成包含二氧化钼和一种或多种含钼化合物的钼的附聚粉末的相对均匀的混合物，其中所述混合物的氧含量更大 约25重量％，并且在移动床炉中将混合物在约700℃至约1000℃的温度下还原足够的时间以从其中除去一部分氧，并形成还原的钼粉附聚物，其具有 氧含量不大于约25重量％。 还原发生在从聚集体的外表面到内表面的方向上。
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