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1.发明授权Rotary signal coupling for chemical mechanical polishing endpoint detection with a westech tool 失效用于西化工具的化学机械抛光终点检测的旋转信号耦合
公开(公告)号：US5663637A
公开(公告)日：1997-09-02
申请号：US620720
申请日：1996-03-19
申请人： Leping Li , Steven George Barbee , Gary Richard Doyle , Arnold Halperin , Kevin L. Holland , Francis Walter Kazak , Robert B. Lipori , Anne Elizabeth McGuire , Rock Nadeau , William Joseph Surovic
发明人： Leping Li , Steven George Barbee , Gary Richard Doyle , Arnold Halperin , Kevin L. Holland , Francis Walter Kazak , Robert B. Lipori , Anne Elizabeth McGuire , Rock Nadeau , William Joseph Surovic
CPC分类号： B24B37/013 , B24B37/04 , B24B49/00 , H01L22/26 , H01L2924/0002
摘要： Rotary signal coupling in in-situ monitoring of a chemical-mechanical polishing process. A sensor fixed to a rotatable wafer carrier for creating a signal responsive to the chemical mechanical polishing process is coupled to a bottom half of a rotary transformer fixed to a rotating portion of the polisher. A top half of the rotary transformer, coupled to the bottom half of the rotary transformer, is fixed to a stationary portion of the polisher. The signal from the sensor is thus coupled through the rotary transformer to a process monitor.
摘要翻译： 旋转信号耦合在原位监测化学机械抛光过程。 固定到可旋转晶片载体上的用于产生响应于化学机械抛光工艺的信号的传感器耦合到固定到抛光机旋转部分的旋转变压器的下半部分。 旋转变压器的上半部分，连接到旋转变压器的下半部分，固定在抛光机的静止部分。 因此，来自传感器的信号通过旋转变压器耦合到过程监视器。
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2.发明授权In-situ monitoring and control of conductive films by detecting changes in induced eddy currents 失效通过检测诱导涡流的变化来原位监测和控制导电膜
公开(公告)号：US6072313A
公开(公告)日：2000-06-06
申请号：US876774
申请日：1997-06-17
IPC分类号： G01B7/00 , G01B7/06 , H01L21/20 , H01L21/302 , H01L21/66
摘要： The change in thickness of a film on an underlying body such as a semiconductor substrate is monitored in situ by inducing a current in the film, and as the thickness of the film changes (either increase or decrease), the changes in the current are detected. With a conductive film, eddy currents are induced in the film by a generating an alternating electromagnetic field with a sensor which includes a capacitor and an inductor.
摘要翻译： 通过在膜中感应电流来原位监测半导体衬底等底层上的膜的厚度变化，随着膜的厚度变化（增加或减小），检测电流的变化 。 利用导电膜，通过与包括电容器和电感器的传感器产生交变电磁场，在膜中引起涡流。
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公开(公告)号：US5731697A
公开(公告)日：1998-03-24
申请号：US641470
申请日：1996-05-01
IPC分类号： G01B7/00 , G01B7/06 , H01L21/20 , H01L21/302 , H01L21/66
摘要： The change in thickness of a film on an underlying body such as a semiconductor substrate is monitored in situ by inducing a current in the film, and as the thickness of the film changes (either increase or decrease), the changes in the current are detected. With a conductive film, eddy currents are induced in the film by a generating an alternating electromagnetic field with a sensor which includes a capacitor and an inductor.
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公开(公告)号：US5659492A
公开(公告)日：1997-08-19
申请号：US620721
申请日：1996-03-19
申请人： Leping Li , Steven George Barbee , Arnold Halperin
发明人： Leping Li , Steven George Barbee , Arnold Halperin
IPC分类号： B24B37/013 , B24B49/03 , H01L21/66 , B24B49/16
CPC分类号： B24B37/013 , B24B49/03 , H01L22/26
摘要： A method and apparatus are provided for determining the endpoint for chemical mechanical polishing a film on a wafer. First, a reference point polishing time indicating when a breakthrough of the film has occurred is determined, then an overpolishing time indicating an interval between the reference point polishing time and when the film has been completely polished is determined. To get the total polishing time to the endpoint, the reference point polishing time and the overpolishing time are added.
摘要翻译： 提供了一种用于确定化学机械抛光晶片上的薄膜的终点的方法和装置。 首先，确定指示膜的突破何时发生的参考点抛光时间，然后确定指示参考点研磨时间与膜完全抛光之间的间隔的过度抛光时间。 为了得到终点的总抛光时间，添加了参考点抛光时间和过度抛光时间。
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5.发明授权Endpoint detection for chemical mechanical polishing using frequency or amplitude mode 失效使用频率或振幅模式进行化学机械抛光的端点检测
公开(公告)号：US5644221A
公开(公告)日：1997-07-01
申请号：US620722
申请日：1996-03-19
申请人： Leping Li , Steven George Barbee , Arnold Halperin
发明人： Leping Li , Steven George Barbee , Arnold Halperin
CPC分类号： G01B7/105
摘要： A method and apparatus for endpoint detection in removal of a film from a semiconductor wafer is provided, with a sensor for creating a signal responsive to the film removal process, a positive feedback amplifier coupled to the sensor, the positive feedback amplifier having a mode selector, and an analyzer coupled to the positive feedback amplifier.
摘要翻译： 提供了一种用于从半导体晶片去除膜的端点检测的方法和装置，具有响应于膜去除处理产生信号的传感器，耦合到传感器的正反馈放大器，正反馈放大器具有模式选择器 以及耦合到正反馈放大器的分析器。
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6.发明授权Rotary signal coupling for chemical mechanical polishing endpoint detection with a strasbaugh tool 失效旋转信号耦合用于化学机械抛光终点检测与strasbaugh工具
公开(公告)号：US5770948A
公开(公告)日：1998-06-23
申请号：US620723
申请日：1996-03-19
申请人： Leping Li , Steven George Barbee , Arnold Halperin , Richard Mars Ruggiero , William Joseph Surovie
发明人： Leping Li , Steven George Barbee , Arnold Halperin , Richard Mars Ruggiero , William Joseph Surovie
IPC分类号： B24B37/013 , B24B37/24 , B24B37/26 , G01B7/06 , H01L21/302
CPC分类号： B24B37/013 , B24B37/245 , B24B37/26 , B24B49/12 , G01B7/06
摘要： An apparatus for rotary signal coupling in in-situ monitoring of a chemical-mechanical polishing process by a polisher is provided with a sensor fixed to a rotatable wafer carrier for creating a signal responsive to the chemical mechanical polishing process, a conductor coupled to the sensor for receiving the signal, the conductor fixed to the rotatable wafer carrier, a contact coupled to the conductor, the contact fixed to a stationary drive arm, and signal transfer means coupled to the contact for transferring the signal to a monitoring means.
摘要翻译： 用于通过抛光机原位监测化学机械抛光工艺的旋转信号耦合装置设置有固定到可旋转晶片载体的传感器，用于产生响应于化学机械抛光工艺的信号，耦合到传感器的导体 为了接收信号，固定到可旋转晶片载体的导体，耦合到导体的触点，固定到固定驱动臂的触点和耦合到触点的信号传送装置，用于将信号传送到监视装置。
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公开(公告)号：US5660672A
公开(公告)日：1997-08-26
申请号：US419208
申请日：1995-04-10
IPC分类号： G01B7/00 , G01B7/06 , G01R31/26 , H01L21/302 , H01L21/3205 , H01L21/66
CPC分类号： G01B7/105
摘要： The change in thickness of a film on an underlying body such as a semiconductor substrate is monitored in situ by inducing a current in the film, and as the thickness of the film changes (either increase or decrease), the changes in the current are detected. With a conductive film, eddy currents are induced in the film by a generating an alternating electromagnetic field with a sensor which includes a capacitor and an inductor.
摘要翻译： 通过在膜中感应电流来原位监测半导体衬底等底层上的膜的厚度变化，随着膜的厚度变化（增加或减小），检测电流的变化 。 利用导电膜，通过与包括电容器和电感器的传感器产生交变电磁场，在膜中引起涡流。
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8.发明授权公开(公告)号：US06440263B1
公开(公告)日：2002-08-27
申请号：US09641175
申请日：2000-08-17
申请人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan, III , William Joseph Surovic , Cong Wei
发明人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan, III , William Joseph Surovic , Cong Wei
IPC分类号： B24B100
CPC分类号： B24B37/013 , B24B49/12 , G01N21/766 , H01L21/30625 , Y10T436/175383
摘要： Detection of the endpoint for removal of a target film overlying a stopping film by removing the target film with a process that selectively generates a chemical reaction product (for example ammonia when polishing a wafer with a nitride film in a slurry containing KOH) with one of the stopping film and the target film, converting the chemical reaction product to a separate product, producing excited molecules from the separate product, and monitoring the level of light emitted from the excited molecules as the target film is removed.
摘要翻译： 通过用选择性地产生化学反应产物（例如在含有KOH的浆料中用氮化物膜研磨晶片）的方法除去目标膜时，通过以下步骤之一来检测用于去除覆盖停止膜的目标膜的终点： 停止膜和靶膜，将化学反应产物转化成单独的产物，从分离的产物产生激发的分子，并监测当去除靶膜时从激发的分子发射的光的水平。
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公开(公告)号：US06176765B1
公开(公告)日：2001-01-23
申请号：US09250308
申请日：1999-02-16
申请人： Leping Li , James A. Gilhooly , Robert B. Lipori , Clifford O. Morgan, III , William J. Surovic , Cong Wei
发明人： Leping Li , James A. Gilhooly , Robert B. Lipori , Clifford O. Morgan, III , William J. Surovic , Cong Wei
IPC分类号： B24B2900
摘要： A fluid collection apparatus having an accumulator for contacting a polishing surface of a polishing pad and collecting fluid from the polishing pad, a reservoir for receiving fluid from the accumulator, and a volume maintainer for maintaining a set volume of fluid in the reservoir.
摘要翻译： 一种流体收集装置，其具有用于接触抛光垫的抛光表面并从抛光垫收集流体的储存器，用于从储存器接收流体的储存器以及用于在储存器中保持一定体积的流体的体积维持器。
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公开(公告)号：US6126848A
公开(公告)日：2000-10-03
申请号：US073604
申请日：1998-05-06
申请人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan, III , William Joseph Surovic , Cong Wei
发明人： Leping Li , James Albert Gilhooly , Clifford Owen Morgan, III , William Joseph Surovic , Cong Wei
IPC分类号： B24B37/013 , B24B49/12 , G01N21/76 , H01L21/306 , G01N21/00
CPC分类号： B24B37/013 , B24B49/12 , G01N21/766 , H01L21/30625 , Y10T436/175383
摘要： Detection of the endpoint for removal of a target film overlying a stopping film by removing the target film with a process that selectively generates a chemical reaction product (for example ammonia when polishing a wafer with a nitride film in a slurry containing KOH) with one of the stopping film and the target film, converting the chemical reaction product to a separate product, producing excited molecules from the separate product, and monitoring the level of light emitted from the excited molecules as the target film is removed.
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