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    LIQUID COOLING APPARATUS AND METHOD FOR FACILITATING COOLING OF AN ELECTRONICS SYSTEM
    4.
    发明申请
    LIQUID COOLING APPARATUS AND METHOD FOR FACILITATING COOLING OF AN ELECTRONICS SYSTEM 失效
    液体冷却装置和方法，用于促进电子系统的冷却

    公开(公告)号：US20100002393A1

    公开(公告)日：2010-01-07

    申请号：US12168259

    申请日：2008-07-07

    申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Martin J. CRIPPEN ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Jason A. MATTESON ,  Roger R. SCHMIDT ,  Robert E. SIMONS

    发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Martin J. CRIPPEN ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Jason A. MATTESON ,  Roger R. SCHMIDT ,  Robert E. SIMONS

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20772

    摘要： Apparatus and method are provided for facilitating liquid cooling one or more components of an electronic subsystem chassis disposed within an electronics rack. The apparatus includes a rack-level coolant manifold assembly and at least one movable chassis-level manifold subassembly. The rack-level coolant manifold assembly includes a rack-level inlet manifold and a rack-level outlet manifold, and each movable chassis-level manifold subassembly includes a chassis-level coolant inlet manifold coupled in fluid communication with the rack-level inlet manifold, and a chassis-level coolant outlet manifold coupled in fluid communication with the rack-level outlet manifold. The chassis-level manifold subassembly is slidably coupled to the electronics rack to facilitate access to one or more removable components of the electronic subsystem chassis. In one embodiment, the electronics subsystem chassis is a multi-blade center system having multiple removable blades, each blade being an electronics subsystem.

    摘要翻译： 提供了设备和方法，以便于液体冷却设置在电子机架内的电子子系统机架的一个或多个部件。 该设备包括机架级冷却剂歧管组件和至少一个可移动底盘级歧管组件。 机架级冷却剂歧管组件包括机架级入口歧管和机架级出口歧管，并且每个可移动底盘级歧管组件包括与机架级入口歧管流体连通地联接的底盘级冷却剂入口歧管， 以及与所述齿条级出口歧管流体连通地联接的底盘级冷却剂出口歧管。 底盘级歧管子组件可滑动地联接到电子机架，以便于接近电子子系统底盘的一个或多个可拆卸部件。 在一个实施例中，电子系统底盘是具有多个可移除刀片的多刀片中心系统，每个刀片是电子子系统。

    COOLANT DRIP FACILITATING PARTIAL IMMERSION-COOLING OF ELECTRONIC COMPONENTS
    5.
    发明申请
    COOLANT DRIP FACILITATING PARTIAL IMMERSION-COOLING OF ELECTRONIC COMPONENTS 有权
    冷却液推动电子部件的部分冷却冷却

    公开(公告)号：US20140071627A1

    公开(公告)日：2014-03-13

    申请号：US13613873

    申请日：2012-09-13

    申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

    发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

    IPC分类号： F28D15/02 ,  H05K7/20

    CPC分类号： H05K7/20809 ,  F28D15/02 ,  F28D15/046 ,  F28F3/048 ,  H05K7/203

    摘要： Cooling apparatus and methods are provided for partial immersion-cooling of multiple electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and a fluid disposed within the compartment. First and second electronic components are at least partially non-immersed within the fluid, with the first component being a different type of electronic component with different configuration than the second component. A vapor condenser is provided with a vapor-condensing surface disposed within the compartment for condensing fluid vapor, and a condensate redirect structure is disposed within the compartment between the vapor condenser and the first and second components. The redirect structure is differently configured over the first electronic component compared with over the second electronic component, and provides a different pattern of condensate drip over the first component compared with over the second component.

    摘要翻译： 提供冷却装置和方法用于多个电子部件的部分浸没冷却。 冷却装置包括至少部分围绕部件周围并形成隔室的壳体以及设置在隔间内的流体。 第一和第二电子部件至少部分地不浸在流体内，其中第一部件是与第二部件不同的构造的不同类型的电子部件。 蒸汽冷凝器设置有设置在隔间内的蒸汽冷凝表面，用于冷凝流体蒸气，并且冷凝物重新导向结构设置在蒸气冷凝器和第一和第二部件之间的隔间内。 与第二电子部件相比，重定向结构在第一电子部件上被不同地配置，并且与第二部件相比，在第一部件上提供了不同的冷凝物滴落模式。

    METHOD AND AIR-COOLING UNIT WITH DYNAMIC AIRFLOW AND HEAT REMOVAL ADJUSTABILITY
    6.
    发明申请
    METHOD AND AIR-COOLING UNIT WITH DYNAMIC AIRFLOW AND HEAT REMOVAL ADJUSTABILITY 有权
    方法和空气冷却单元与动态气流和热移除可调性

    公开(公告)号：US20090207567A1

    公开(公告)日：2009-08-20

    申请号：US12031961

    申请日：2008-02-15

    申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

    发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

    IPC分类号： H05K7/20 ,  F24F7/007 ,  F28D15/00

    CPC分类号： F28D15/00 ,  F28F27/00 ,  F28F2250/08 ,  H05K7/20745 ,  H05K7/2079 ,  H05K7/20836

    摘要： Method and air-cooling unit are provided for dynamically adjusting airflow rate through and heat removal rate of the air-cooling unit to facilitate cooling of one or more electronics racks of a data center. The air-cooling unit includes a housing, an air-moving device, and an air-to-liquid heat exchanger. The air-moving device moves air through the housing from the air inlet side to the air outlet side thereof, and the heat exchanger cools the air passing through the housing. A control unit controls the air-moving device and the flow of liquid coolant through the heat exchanger to automatically, dynamically adjust airflow rate and heat removal rate of the air-cooling unit to achieve a current airflow rate target and current heat removal rate target therefore. The current targets are based on airflow rate through and heat load generated by one or more associated electronics racks of the data center.

    摘要翻译： 提供了一种方法和空气冷却装置，用于动态地调节空气冷却装置的气流速率和散热率，以便于冷却数据中心的一个或多个电子机架。 空气冷却单元包括壳体，空气移动装置和空气对液体热交换器。 空气移动装置将空气从空气入口侧移动到其空气出口侧，并且热交换器冷却通过壳体的空气。 控制单元通过热交换器控制空气移动装置和液体冷却剂的流动，自动地动态地调节空气冷却装置的气流速率和排热速率，从而实现目前的气流速度目标和目前的除热率目标 。 目前的目标是基于数据中心的一个或多个相关的电子机架产生的气流速率和热负荷。

    MULTI-FLUID COOLING OF AN ELECTRONIC DEVICE
    7.
    发明申请
    MULTI-FLUID COOLING OF AN ELECTRONIC DEVICE 失效
    电子设备的多流体冷却

    公开(公告)号：US20100306994A1

    公开(公告)日：2010-12-09

    申请号：US12850099

    申请日：2010-08-04

    申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

    发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

    IPC分类号： H05K13/00

    CPC分类号： H01L23/4735 ,  H01L23/427 ,  H01L2924/0002 ,  Y10S165/908 ,  Y10T29/49002 ,  H01L2924/00

    摘要： A method of fabricating a multi-fluid cooling system is provided for removing heat from one or more electronic devices. The cooling system includes a multi-fluid manifold structure with at least one first fluid inlet orifice and at least one second fluid inlet orifice for concurrently, separately injecting a first fluid and a second fluid onto a surface to be cooled when the cooling system is employed to cool one or more electronic devices, wherein the first fluid and the second fluid are immiscible, and the first fluid has a lower boiling point temperature than the second fluid. When the cooling system is employed to cool one or more electronic devices and the first fluid boils, evolving first fluid vapor condenses in situ by direct contact with the second fluid of higher boiling point temperature.

    摘要翻译： 提供了一种制造多流体冷却系统的方法，用于从一个或多个电子设备去除热量。 冷却系统包括具有至少一个第一流体入口孔口和至少一个第二流体入口孔口的多流体歧管结构，用于在采用冷却系统时同时单独地将第一流体和第二流体注入待冷却的表面上 以冷却一个或多个电子设备，其中所述第一流体和所述第二流体是不混溶的，并且所述第一流体具有比所述第二流体低的沸点温度。 当冷却系统用于冷却一个或多个电子装置和第一流体沸腾时，放出的第一流体蒸汽通过与较高沸点温度的第二流体直接接触而原位冷凝。

    SYSTEM OF FACILITATING COOLING OF ELECTRONICS RACKS OF A DATA CENTER EMPLOYING MULTIPLE COOLING STATIONS
    8.
    发明申请
    SYSTEM OF FACILITATING COOLING OF ELECTRONICS RACKS OF A DATA CENTER EMPLOYING MULTIPLE COOLING STATIONS 有权
    使用多个冷却站的数据中心电子机架的冷却系统

    公开(公告)号：US20090122487A1

    公开(公告)日：2009-05-14

    申请号：US12274459

    申请日：2008-11-20

    申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

    发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20745

    摘要： A cooling system and method are provided for cooling air exiting one or more electronics racks of a data center. The cooling system includes at least one cooling station separate and freestanding from at least one respective electronics rack of the data center, and configured for disposition of an air outlet side of electronics rack adjacent thereto for cooling egressing air from the electronics rack. The cooling station includes a frame structure separate and freestanding from the respective electronics rack, and an air-to-liquid heat exchange assembly supported by the frame structure. The heat exchange assembly includes an inlet and an outlet configured to respectively couple to coolant supply and coolant return lines for facilitating passage of coolant therethrough. The air-to-liquid heat exchange assembly is sized to cool egressing air from the air outlet side of the respective electronics rack before being expelled into the data center.

    摘要翻译： 提供冷却系统和方法来冷却离开数据中心的一个或多个电子机架的空气。 冷却系统包括与数据中心的至少一个相应的电子机架分离和独立的至少一个冷却站，并且被配置为用于设置与其相邻的电子机柜的空气出口侧，用于冷却从电子机架排出空气。 冷却站包括从相应的电子机架分离和独立的框架结构，以及由框架结构支撑的空气对液体热交换组件。 热交换组件包括入口和出口，其构造成分别耦合到冷却剂供应源和冷却剂返回管线，以便于冷却剂通过其中。 空气 - 液体热交换组件的尺寸设定为在排出到数据中心之前冷却从相应的电子机架的空气出口侧排出的空气。

    THERMOELECTRIC-ENHANCED AIR AND LIQUID COOLING OF AN ELECTRONIC SYSTEM
    9.
    发明申请
    THERMOELECTRIC-ENHANCED AIR AND LIQUID COOLING OF AN ELECTRONIC SYSTEM 有权
    电子系统的热电加强空气和液体冷却

    公开(公告)号：US20140069111A1

    公开(公告)日：2014-03-13

    申请号：US13613832

    申请日：2012-09-13

    申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

    发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

    IPC分类号： F25B21/02 ,  B23P15/26

    CPC分类号： B21D53/02 ,  F25B21/02 ,  F25B2321/0252 ,  H05K7/2079 ,  Y10T29/49359

    摘要： Thermoelectric-enhanced air and liquid cooling of an electronic system is provided by a cooling apparatus which includes a liquid-cooled structure in thermal communication with an electronic component(s), and liquid-to-liquid and air-to-liquid heat exchangers coupled in series fluid communication via a coolant loop, which includes first and second loop portions coupled in parallel. The liquid-cooled structure is supplied coolant via the first loop portion, and a thermoelectric array is disposed with the first and second loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the series-coupled heat exchangers, one of which functions as heat sink.

    摘要翻译： 电子系统的热电增强空气和液体冷却由包括与电子部件热连通的液冷结构的冷却装置提供，液 - 液和空 - 液热交换器 经由冷却剂回路串联流体连通，其包括并联连接的第一和第二回路部分。 液冷结构经由第一回路部分供应冷却剂，热电阵列设置有第一和第二回路部分与阵列的第一和第二侧热接触。 热电阵列用于将热量从穿过第一环路部分的冷却剂传递到穿过第二环路部分的冷却剂，并且在冷却剂通过液冷结构之前冷却通过第一环部分的冷却剂。 通过第一和第二回路部分的冷却剂通过串联耦合的热交换器，其中一个用作散热器。

    THERMALLY CONDUCTIVE COMPOSITE INTERFACE, COOLED ELECTRONIC ASSEMBLIES EMPLOYING THE SAME, AND METHODS OF FABRICATION THEREOF
    10.
    发明申请
    THERMALLY CONDUCTIVE COMPOSITE INTERFACE, COOLED ELECTRONIC ASSEMBLIES EMPLOYING THE SAME, AND METHODS OF FABRICATION THEREOF 失效
    导热组合物接口，使用其的冷却电子组件及其制造方法

    公开(公告)号：US20110192027A1

    公开(公告)日：2011-08-11

    申请号：US13087678

    申请日：2011-04-15

    申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Keith E. FOGEL ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

    发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Keith E. FOGEL ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

    IPC分类号： B21D53/02

    CPC分类号： H01L23/3677 ,  H01L2224/78301 ,  Y10T29/49128 ,  Y10T29/4935 ,  H01L2924/00014

    摘要： A composite interface and methods of fabrication are provided for coupling a cooling assembly to an electronic device. The interface includes a plurality of thermally conductive wires formed of a first material having a first thermal conductivity, and a thermal interface material at least partially surrounding the wires. The interface material, which thermally interfaces the cooling assembly to a surface to be cooled of the electronic device, is a second material having a second thermal conductivity, wherein the first thermal conductivity is greater than the second thermal conductivity. At least some wires reside partially over a first region of higher heat flux and extend partially over a second region of lower heat flux, wherein the first and second regions are different regions of the surface to he cooled. These wires function as thermal spreaders facilitating heat transfer from the surface to be cooled to the cooling assembly.

    摘要翻译： 提供了复合界面和制造方法，用于将冷却组件连接到电子设备。 界面包括由具有第一导热性的第一材料形成的多个导热丝，以及至少部分地围绕线的热界面材料。 将冷却组件与待冷却的电子设备的表面热接合的界面材料是具有第二导热性的第二材料，其中第一热导率大于第二导热系数。 至少一些线部分地位于较高热通量的第一区域上，并且部分地延伸在较低热通量的第二区域上，其中第一和第二区域是要冷却的表面的不同区域。 这些电线作为热扩散器起促进从待冷却表面到冷却组件的热传递。