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    HERMETIC SEAL AND RELIABLE BONDING STRUCTURES FOR 3D APPLICATIONS
    8.
    发明申请
    HERMETIC SEAL AND RELIABLE BONDING STRUCTURES FOR 3D APPLICATIONS 审中-公开
    用于3D应用的HERMETIC SEAL和可靠的结合结构

    公开(公告)号：US20080268574A1

    公开(公告)日：2008-10-30

    申请号：US12035053

    申请日：2008-02-21

    申请人： Kuan-Neng Chen ,  Bruce K. Furman ,  Edmund J. Sprogis ,  Anna W. Topol ,  Cornelia K. Tsang ,  Matthew R. Wordeman ,  Albert M. Young

    发明人： Kuan-Neng Chen ,  Bruce K. Furman ,  Edmund J. Sprogis ,  Anna W. Topol ,  Cornelia K. Tsang ,  Matthew R. Wordeman ,  Albert M. Young

    IPC分类号： H01L21/58

    CPC分类号： H01L25/50 ,  H01L2224/80895 ,  H01L2225/06513 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A sealed microelectronic structure which provides mechanical stress endurance and includes at least two chips being electrically connected to a semiconductor structure at a plurality of locations. Each chip includes a continuous bonding material along it's perimeter and at least one support column connected to each of the chips positioned within the perimeter of each chip. Each support column extends outwardly such that when the at least two chips are positioned over one another the support columns are in mating relation to each other. A seal between the at least two chips results from the overlapping relation of the chip to one another such that the bonding material and support columns are in mating relation to each other. Thus, the seal is formed when the at least two chips are mated together, and results in a bonded chip structure.

    摘要翻译： 一种密封的微电子结构，其提供机械应力耐久性并且包括在多个位置处电连接到半导体结构的至少两个芯片。 每个芯片沿着其周边包括连续的接合材料，以及连接到位于每个芯片的周边内的每个芯片的至少一个支撑柱。 每个支撑柱向外延伸，使得当至少两个芯片彼此定位时，支撑柱彼此配合。 至少两个芯片之间的密封由芯片彼此的重叠关系产生，使得接合材料和支撑柱彼此配合。 因此，当至少两个芯片配合在一起时形成密封，并且导致粘合芯片结构。

    Method and apparatus for providing parallel optoelectronic communication with an electronic device
    9.
    发明授权
    Method and apparatus for providing parallel optoelectronic communication with an electronic device 有权
    用于提供与电子设备的平行光电通信的方法和设备

    公开(公告)号：US06955481B2

    公开(公告)日：2005-10-18

    申请号：US10667234

    申请日：2003-09-17

    申请人： Evan G. Colgan ,  Bruce K. Furman ,  Daniel J. Stigliani, Jr.

    发明人： Evan G. Colgan ,  Bruce K. Furman ,  Daniel J. Stigliani, Jr.

    IPC分类号： G02B6/42 ,  G02B6/36

    CPC分类号： G02B6/4214 ,  G02B6/4246 ,  G02B6/4249

    摘要： An optoelectronic assembly for an electronic system includes a support electronic chip set configured for at least one of providing multiplexing, demultiplexing, coding, decoding and optoelectronic transducer driving and receive functions. A first substrate having a first surface and an opposite second surface is in communication with the support electronic chip set via the first surface while a second substrate is in communication with the second surface of the first substrate. The second substrate is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support electronic chip set and an optical fiber array is aligned at a first end with the optoelectronic transducer and with an optical signaling medium at a second end. An electrical signal from the support electronic chip set is communicated to the optoelectronic transducer via an electrical signaling medium, and the support electronic chip set and the optoelectronic transducer share a common thermal path for cooling.

    摘要翻译： 一种用于电子系统的光电组件，包括配置用于提供多路复用，解复用，编码，解码和光电换能器驱动和接收功能中的至少一个的支持电子芯片组。 具有第一表面和相对的第二表面的第一基板经由第一表面与支撑电子芯片组连通，而第二基板与第一基板的第二表面连通。 第二基板被配置用于安装数据处理，数据交换和数据存储芯片中的至少一个。 光电子传感器与支撑电子芯片组进行信号通信，光纤阵列在第一端与光电转换器对准，并在第二端与光信号介质对准。 来自支持电子芯片组的电信号通过电信号介质传送到光电转换器，并且支持电子芯片组和光电转换器共享用于冷却的公共热路径。

    Methods of fabrication of deaggregated electrically conductive polymers and precursors thereof
    10.
    发明授权
    Methods of fabrication of deaggregated electrically conductive polymers and precursors thereof 失效
    解聚集的导电聚合物及其前体的制备方法

    公开(公告)号：US6005070A

    公开(公告)日：1999-12-21

    申请号：US783805

    申请日：1997-01-16

    申请人： Marie Angelopoulos ,  Bruce K. Furman

    发明人： Marie Angelopoulos ,  Bruce K. Furman

    IPC分类号： C08F283/00 ,  C08G61/12 ,  C08G73/00 ,  H01B1/12

    CPC分类号： C08F283/00 ,  C08G61/12

    摘要： Deaggregated substituted and unsubstitued polyparaphenylenes, polyparaphenylevevinyles, polyanilines, polyazines, polythiophenes, poly-p-phenylene sulfides, polyfuranes, polypyrroles, polyselenophene, polyacetylenes formed from soluble precursors and combinations thereof and copolymers thereof and methods of fabrication are described. The deaggregated polymer molecules when subsequently doped show higher electrical conductivity. Agents such as lithium chloride, m-cresol and nonylphenol are used to deaggregate the polymer molecules. The deaggregating agents can be added prior to or during doping the molecules.

    摘要翻译： 描述了聚集的取代和未取代的聚对苯二酚，聚对苯乙烯基乙烯基，聚苯胺，聚嗪，聚噻吩，聚对苯硫醚，聚呋喃，聚吡咯，聚硒吩，由可溶性前体及其组合形成的聚乙炔及其共聚物及其制备方法。 随后掺杂时的解聚聚合物分子显示更高的导电性。 诸如氯化锂，间甲酚和壬基苯酚的试剂用于解聚聚合物分子。 解聚剂可以在掺杂分子之前或期间加入。