-
公开(公告)号：US07066659B2
公开(公告)日：2006-06-27
申请号：US10629253
申请日：2003-07-28
IPC分类号： G02B6/36
CPC分类号： H01S5/02212 , H01L23/055 , H01L23/10 , H01L2924/0002 , H01L2924/19107 , H01S5/02268 , H01S5/02415 , H01L2924/00
摘要： A small form factor transceiver module that incorporates an externally modulated laser (EML). The transceiver module has a transmitter optical subassembly with a header assembly having a base with a platform extending through. The platform has a plurality of conductive traces extending through the platform for making connections on both sides of the base. A thermoelectric cooler (TEC) is used to dissipate heat from a laser within the header assembly. The TEC dissipates heat sufficiently to allow the EML to be used in the header assembly. In this manner, EMLs can be used in relatively small optical devices, including small form factor transceivers that comply with the XFP standard. The XFP modules with EMLs can be used for longer links than XFPs without EMLs. In addition, EMLs can be stabilized using TECs so that XFP modules can be used for DWDM-type applications.
摘要翻译： 采用外部调制激光器（EML）的小尺寸收发模块。 收发器模块具有发射器光学子组件，其具有头部组件，该头部组件具有带有延伸穿过的平台的底座。 平台具有延伸穿过平台的多个导电迹线，用于在基底的两侧进行连接。 热电冷却器（TEC）用于从头部组件内的激光器散热。 TEC充分散热，使EML能够用于头部组件。 以这种方式，EML可用于相对较小的光学装置，包括符合XFP标准的小尺寸收发器。 具有EML的XFP模块可用于比没有EML的XFP更长的链路。 此外，EML可以使用TEC进行稳定，以便XFP模块可用于DWDM型应用。
-
公开(公告)号：US06996304B2
公开(公告)日：2006-02-07
申请号：US11029067
申请日：2005-01-03
CPC分类号： H01S5/02212 , H01L23/055 , H01L23/10 , H01L2924/0002 , H01S5/02415 , H01L2924/00
摘要： This disclosure is concerned with transceiver modules. In one example, a transceiver module includes a receiver optical subassembly, as well as a transmitter optical subassembly having a header assembly and an externally modulated laser (EML). The header assembly includes a base with first and second sides, as well as a platform attached to the base and having an inside portion near the first side of the base and an outside portion near the second side of the base. The platform of the header assembly further includes a conductive pathway extending through part of the platform. The EML is supported by the platform and electrically communicates with the conductive pathway of the platform. The EML can be passively or actively cooled.
摘要翻译： 本公开涉及收发器模块。 在一个示例中，收发器模块包括接收器光学子组件以及具有头部组件和外部调制激光器（EML）的发射器光学子组件。 头部组件包括具有第一和第二侧面的基部，以及附接到基部并且具有靠近基部的第一侧的内部部分和靠近基部的第二侧的外侧部分的平台。 头部组件的平台还包括延伸穿过平台的一部分的导电通路。 EML由平台支撑并与平台的导电通路电连通。 EML可被动或主动冷却。
-
公开(公告)号：US06878875B2
公开(公告)日：2005-04-12
申请号：US10748051
申请日：2003-12-30
IPC分类号： H01L23/055 , H01L23/10 , H01S5/022 , H01S5/024 , H05K5/00
CPC分类号： H01S5/02212 , H01L23/055 , H01L23/10 , H01L2924/0002 , H01S5/02415 , H01L2924/00
摘要： A small form factor transceiver module that incorporates an externally modulated laser (EML). The transceiver module has a transmitter optical subassembly with a header assembly having a base with a platform extending through. The platform has a plurality of conductive traces extending through the platform for making connections on both sides of the base. A thermoelectric cooler (TEC) is used to dissipate heat from a laser within the header assembly. The TEC dissipates heat sufficiently to allow the EML to be used in the header assembly. In this manner, EMLs can be used in relatively small optical devices, including small form factor transceivers that comply with the XFP standard. The XFP modules with EMLs can be used for longer links than XFPs without EMLs. In addition, EMLs can be stabilized using TECs so that XFP modules can be used for DWDM-type applications.
摘要翻译： 采用外部调制激光器（EML）的小尺寸收发模块。 收发器模块具有发射器光学子组件，其具有头部组件，该头部组件具有带有延伸穿过的平台的底座。 平台具有延伸穿过平台的多个导电迹线，用于在基底的两侧进行连接。 热电冷却器（TEC）用于从头部组件内的激光器散热。 TEC充分散热，使EML能够用于头部组件。 以这种方式，EML可用于相对较小的光学装置，包括符合XFP标准的小尺寸收发器。 具有EML的XFP模块可用于比没有EML的XFP更长的链路。 此外，EML可以使用TEC进行稳定，以便XFP模块可用于DWDM型应用。
-
公开(公告)号：US07194012B2
公开(公告)日：2007-03-20
申请号：US10995684
申请日：2004-11-23
申请人： T. G. Beck Mason , Dev E. Kumar , Giorgio Giaretta
发明人： T. G. Beck Mason , Dev E. Kumar , Giorgio Giaretta
IPC分类号： H01S3/00
CPC分类号： H01S5/042 , H01S5/0427
摘要： Systems and methods for biasing an externally modulated laser. An inductorless bias T network is provided that includes a terminating resistor in series with a capacitor. The capacitor is an open circuit for a bias signal and a virtual ground for an RF signal. Thus, the RF signal is terminated by the terminating resistor without dissipating the bias signal through a ground return path of the RF signal. Using a charge pump inverter, a positive supply can be used to positively bias a laser and negatively bias the external modulator through the terminating resistor. A negative power supply is not required. A swing voltage provided by the RF signal causes the external modulator to modulate the light emitted by the laser.
摘要翻译： 用于偏置外部调制激光器的系统和方法。 提供无电感偏置T网络，其包括与电容器串联的终端电阻器。 电容器是用于偏置信号的开路和用于RF信号的虚拟接地。 因此，RF信号由终端电阻终止，而不通过RF信号的接地返回路径消散偏置信号。 使用电荷泵逆变器，可以使用正电源来对激光器进行正偏置，并通过端接电阻对外部调制器进行负偏置。 不需要负电源。 由RF信号提供的摆幅电压使外部调制器调制由激光发射的光。
-
5.发明授权公开(公告)号：US06867368B2
公开(公告)日：2005-03-15
申请号：US10625022
申请日：2003-07-23
IPC分类号： H01L23/055 , H01L23/10 , H01S5/022 , H01S5/024 , H01L23/02
CPC分类号： H01S5/02212 , H01L23/055 , H01L23/10 , H01L2924/0002 , H01S5/02248 , H01S5/02268 , H01S5/02292 , H01S5/02415 , H01S5/06804 , H01S5/0683 , H01S5/06837 , H01S5/183 , H01L2924/00
摘要： A multi-layer feedthrough structure for use in optoelectronic equipment. The feedthrough structure is composed of multiple stacked ceramic layers that together form a multi-layer platform. The multi-layer platform bisects the base portion of a header assembly that is located within the transmitter optical subassembly such that an interior portion of the multi-layer platform is located within the header assembly and an exterior portion is disposed outside. Each layer contains at least a portion of a plurality of conductive pathways that extend from the exterior to the interior portion of the multi-layer platform. A top insulating layer enables the conductive pathways to pass from the exterior to the interior portion of the platform without electrically contacting the header assembly base. The conductive pathways serve as electrical interconnects between components located within the header assembly and structures outside thereof.
摘要翻译： 一种用于光电设备的多层馈通结构。 馈通结构由多个堆叠的陶瓷层组成，它们一起形成多层平台。 多层平台将位于发射机光学子组件内的集管组件的基部部分平分，使得多层平台的内部位于集管组件内部，外部部分设置在外部。 每个层包含从多层平台的外部延伸到内部的多个导电路径的至少一部分。 顶部绝缘层使得导电路径能够从平台的外部传递到内部，而不会电接触头部组件基座。 导电路径用作位于集管组件内部和在其外部的结构之间的部件之间的电互连。
-
6.发明授权公开(公告)号：US06852928B2
公开(公告)日：2005-02-08
申请号：US10629724
申请日：2003-07-28
IPC分类号： H01L23/055 , H01L23/10 , H01S5/022 , H01S5/024 , H01L23/02
CPC分类号： H01S5/02212 , H01L23/055 , H01L23/10 , H01L2924/0002 , H01L2924/19107 , H01S5/02268 , H01S5/02292 , H01S5/02415 , H01S5/0683 , H01L2924/00
摘要： A transistor header assembly for use in transmitter optical subassemblies of optical transceivers. The header assembly has a base with a platform extending through. The platform has a conductive trace extending through the platform for making connections on both sides of the base. A thermoelectric cooler (TEC) is used to dissipate heat from a laser within the header assembly. The TEC dissipates heat sufficiently to allow an externally modulated laser (EML) to be used in the header assembly. In this manner, EMLs can be used in relatively small optical devices, including small form factor transceivers that comply with the XFP standard. The XFP modules with EMLs can be used for longer links than XFPs without EMLs. In addition, EMLs can be stabilized using TECs so that XFP modules can be used for DWDM-type applications.
摘要翻译： 一种用于光收发器的发射机光学组件的晶体管头组件。 头部组件具有一个平台延伸穿过的底座。 该平台具有延伸穿过平台的导电迹线，用于在基座的两侧进行连接。 热电冷却器（TEC）用于从头部组件内的激光器散热。 TEC充分散热，以允许外部调制的激光（EML）在头部组件中使用。 以这种方式，EML可用于相对较小的光学装置，包括符合XFP标准的小尺寸收发器。 具有EML的XFP模块可用于比没有EML的XFP更长的链路。 此外，EML可以使用TEC进行稳定，以便XFP模块可用于DWDM型应用。
-
7.发明授权Flexible circuit for establishing electrical connectivity with optical subassembly 有权用于与光学组件建立电连接的柔性电路公开(公告)号：US07439449B1
公开(公告)日：2008-10-21
申请号：US10409837
申请日：2003-04-09
IPC分类号： H05K1/00
CPC分类号： H05K1/0253 , G02B6/4292 , H01L23/055 , H01L23/10 , H01L2924/0002 , H01S5/02212 , H01S5/02415 , H05K1/0203 , H05K1/0219 , H05K1/0393 , H05K1/141 , H05K1/147 , H05K3/3447 , H05K2201/10121 , H05K2201/10219 , H05K2201/10446 , H01L2924/00
摘要： Flexible printed circuit boards interconnect to adjacent electronic devices through one or more of high speed data, low speed data, high current, and ground lines and pads. The design of the high speed data pads and traces and adjacent ground pads and traces maintains a desired impedance in the flexible circuit and at the transition from the flexible circuit to a printed circuit board, a ceramic header, or other device to ensure high speed operation. The pads are preferably arranged in a two dimensional geometry such that a connecting area of the flexible circuit is narrower than it would preferably be if the pads were arranged linearly. The two dimensional array also allows the use of the high current thermoelectric cooler pads, which require large surface areas that may otherwise not fit in a conventional linear array.
摘要翻译： 柔性印刷电路板通过高速数据，低速数据，高电流和接地线和焊盘中的一个或多个互连到相邻电子器件。 高速数据焊盘和迹线以及相邻接地焊盘和迹线的设计在柔性电路中保持所需的阻抗，并且在柔性电路到印刷电路板，陶瓷集管或其他器件的过渡期间保持高速运行 。 垫优选地布置成二维几何形状，使得柔性电路的连接区域比优选地如果衬垫线性排列的那样较窄。 二维阵列还允许使用大电流热电冷却器垫，其需要大的表面积，否则其不适合常规线性阵列。
-
公开(公告)号：US07210859B2
公开(公告)日：2007-05-01
申请号：US10979466
申请日：2004-11-02
IPC分类号： G02B6/36
CPC分类号： H01S5/02212 , H01L23/055 , H01L23/10 , H01L2924/0002 , H01S5/02248 , H01S5/02268 , H01S5/02292 , H01S5/02415 , H01S5/06804 , H01S5/0683 , H01S5/06837 , H01S5/183 , H01L2924/00
摘要： This disclosure concerns a platform suitable for use in connection with optoelectronic components and devices. In one example, the platform includes multiple stacked platform layers. A conductive pathway of the platform is supported by at least one of the stacked platform layers, and the conductive pathway is configured and arranged so as to be at least partly coextensive with the platform.
摘要翻译： 本公开涉及适用于与光电子部件和装置结合使用的平台。 在一个示例中，平台包括多个堆叠的平台层。 平台的导电路径由堆叠的平台层中的至少一个支撑，并且导电路径被配置和布置成与平台至少部分共延伸。
-
公开(公告)号：US06586678B1
公开(公告)日：2003-07-01
申请号：US10077067
申请日：2002-02-14
IPC分类号： H01L2302
CPC分类号： H01S5/02212 , H01L23/055 , H01L23/10 , H01L2924/0002 , H01S5/02415 , H01S5/02469 , H01L2924/00
摘要： An improved transistor header assembly incorporating a rectangular platform perpendicularly bisecting the base of the transistor header. The ceramic platform provides the ability to house multiple electrical components and/or devices on either side of the base. The platform has a higher thermal conductivity than the base of a standard header. In addition, the platform increases the electrical input/output density of the header by increasing the number of potential electrical connections between the two sides of the base.
摘要翻译： 一种改进的晶体管集管组件，其包括垂直地平分晶体管集管的基极的矩形平台。 陶瓷平台提供在基座的两侧容纳多个电气部件和/或设备的能力。 该平台具有比标准头部的基座更高的热导率。 此外，该平台通过增加基座两侧之间的潜在电气连接的数量来增加集管的电输入/输出密度。
-
公开(公告)号：US20050089280A1
公开(公告)日：2005-04-28
申请号：US10979466
申请日：2004-11-02
申请人： Dev Kumar , Stefano Schiaffino , Giorgio Giaretta
发明人： Dev Kumar , Stefano Schiaffino , Giorgio Giaretta
IPC分类号： H01L23/055 , H01L23/10 , H01S5/022 , H01S5/024 , G02B6/36
CPC分类号： H01S5/02212 , H01L23/055 , H01L23/10 , H01L2924/0002 , H01S5/02248 , H01S5/02268 , H01S5/02292 , H01S5/02415 , H01S5/06804 , H01S5/0683 , H01S5/06837 , H01S5/183 , H01L2924/00
摘要： This disclosure concerns a platform suitable for use in connection with optoelectronic components and devices. In one example, the platform includes multiple stacked platform layers. A conductive pathway of the platform is supported by at least one of the stacked platform layers, and the conductive pathway is configured and arranged so as to be at least partly coextensive with the platform.
摘要翻译： 本公开涉及适用于与光电子部件和装置结合使用的平台。 在一个示例中，平台包括多个堆叠的平台层。 平台的导电路径由堆叠的平台层中的至少一个支撑，并且导电路径被配置和布置成与平台至少部分共延伸。
-
-
-
-
-
-
-
-
-
搜索结果
53 条记录 (耗时 0.039 秒)
