摘要:
An apparatus for monitoring the curing of a fiber reinforced composite plastic which is cured at temperatures of the order of 350.degree. C. and an ultrasonic transducer assembly useful in the apparatus. The transducer assembly comprises a lithium niobate piezoelectric element having anisotropic coefficients of thermal expansion which is mounted on a metal base of the transducer assembly by means of a layer of structured copper. The structured copper is thermo-compression diffusion bonded to the lithium niobate element and to the metal base, and is compliant in a transverse direction to compensate for differential thermal expansions while affording good electrical and thermal conductivity and good acoustic coupling between the lithium niobate element and metal base.
摘要:
An apparatus for monitoring the curing of a fiber reinforced composite plastic which is cured at temperatures of the order of 350.degree. C. and an ultrasonic transducer assembly useful in the apparatus. The transducer assembly comprises a lithium niobate piezoelectric element having anisotropic coefficients of thermal expansion which is mounted on a metal base of the transducer assembly by means of a layer of structured copper. The structured copper is thermo-compression diffusion bonded to the lithium niobate element and to the metal base, and is compliant in a transverse direction to compensate for differential thermal expansions while affording good electrical and thermal conductivity and good acoustic coupling between the lithium niobate element and metal base.
摘要:
The bond between a structured copper heat sink member and a semiconductor wafer is inspected for voids and unbonds by a focused ultrasonic pulse transmission method. The small focused spot of ultrasound is transmitted along the structured copper strands and is attenuated in the lateral direction. The absence of a received pulse or a significantly reduced amplitude signal, as the assembled device is scanned with acoustic pulses, indicate flaws in the bond.
摘要:
Concentrated sunlight impinges on a large area photovoltaic device which is bonded to a highly pliable and thermally and electrically conductive structured copper strain relieving member; the lower face of the structured copper is sealed to a fluid cooled metal heat sink. Large power densities of sunlight are absorbed without appreciable temperature rise. The structured copper accommodates to the difference in expansion between the metal heat sink and the semiconductor wafer. Three embodiments utilize a single planar junction diode, an interdigitated diode, and series connected isolated junction diodes.
摘要:
Wafers which are direct bonded to each other in accordance with prior art processes suffer from voids at their bonded interface. Annealing such composite structures at high temperature and high pressure (for silicon wafers preferably about 1,100.degree. C. and 15,000 psi) eliminates all voids which are not a result of the presence of a particle on one of the wafers at the time of mating.
摘要:
A broadband 25 to 50 MHz spherically focused ultrasonic transducer is placed on the tip of a catheter such that ultrasonic images of arteries and plaque are produced by introducing the catheter into arteries of patients. The high frequency transducer has thin piezoelectric polymer film as the transducing element and is adhered to a depression in the reduced cross section catheter tip. A coaxial cable in the catheter connects the transducer to an external signal source and a display for the received signals. The diagnosis and characterization of arterial disease is most often coupled with a therapeutic technique such as balloon angioplasty.
摘要:
A nondestructive evaluation method is described for ultrasonic evaluation and detection of features in polycrystalline materials, such as grain orientation (e.g. texturing) or grain boundary orientation. The method may, for example, be employed to detect diffusion bonds that contain undesirable planar grain boundary arrays. The method utilizes time of flight statistics gathered from reflections associated with incident ultrasonic signals directed into a plurality of locations within the material.
摘要:
A method and circuit for improved digitization of waveforms having a large dynamic range, including selecting a signal threshold value which partitions the dynamic range of the waveform into a small signal region and a large signal region; sampling the waveform to obtain a sampled signal therefrom at a given sampling frequency; for each sampled signal, comparing the sampled signal with the signal threshold value to determine whether the sampled signal is within the small signal region or the large signal region; and directly digitizing the sampled signal if the sampled signal is within the small signal region or differentially digitizing the sampled signal if the sampled signal is within the large signal region, wherein differentially digitizing the sampled signal includes digitizing a value representing the difference between the sampled signal at a present sampling instant and a previous sampling instant. One bit of each word of the digitized signal is reallocated to indicate whether it represents a directly or differentially digitized signal to enable the waveform to be digitally reconstructed in a data processing device.
摘要:
A system and method for using the detector to differentiate neutron attenuating material from high x-ray attenuating material in an object. The inspection system is used to detect the presence of nitride in titanium sponge nuggets or residual core material in a hollow-cast turbine engine blades. The inspection system uses a dual radiation source to alternately emit neutrons and x-rays or gamma rays at the object under inspection. A dual modality gas ionization detector detects the radiation passing through the object and sends the detected radiation to a processing means for image generation. The generated image is displayed on a display, enabling objects formed with low and high attenuating material to be distinguished.
摘要:
An eddy current surface inspection array probe and method for detecting cracks and flaws in aircraft skin metal immediately surrounding rivets, without requiring rivet removal or manual scanning. The array probe includes a circular array of small sense coils positioned beneath a much larger drive coil encased in ferrite. The sense coils are differentially connected in pairs such that the signals from two sense coils located on opposite sides of the rivet (180.degree. apart) subtract to produce a resultant output signal. During operation, the probe is positioned concentrically over the rivet and data acquired from all sense coil pairs. If no cracks or other defects are present, all sense coil pairs produce a null (zero) signal. If a crack exists, some sense coil pairs (the exact number depending on the crack length, number of sense coils, and sense coil spacing) produce a non-zero signal. The probe and method can be employed to inspect a variety of other structural features which are nominally circularly symmetrical.