公开(公告)号：US11670748B2

公开(公告)日：2023-06-06

申请号：US17195539

申请日：2021-03-08

Applicant: Lextar Electronics Corporation

Inventor： Chang-Han Chen ,  Chun-Peng Lin ,  Lung-Kuan Lai

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/58 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62

Abstract: A light emitting diode (LED) package structure includes a circuit board, a reflective cup, a LED chip and a lens structure. The reflective cup is mounted on the circuit board, wherein the reflective cup and the circuit board collectively form a concave cup with an opening. The reflective cup has a first metal ring in the concave cup. The LED chip is mounted on the circuit board and within the concave cup. The lens structure has a second metal ring configured to join the first metal ring to cover the opening.

公开(公告)号：US11362242B2

公开(公告)日：2022-06-14

申请号：US16736830

申请日：2020-01-08

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao Lin ,  Chang-Han Chen ,  Chun-Peng Lin

IPC: H01L33/58 ,  H01L33/56 ,  H01L33/54

Abstract: A light-emitting device includes a panel substrate, a light-emitting chip, and a light extracting layer. The light-emitting chip is disposed on the panel substrate. The light extracting layer covers the light-emitting chip and the panel substrate, and the light extracting layer has a side portion. Taking the position where the edge of the light-emitting chip is in contact with the panel substrate as the origin, the side portion and the origin define a circle tangential to the surface of the side portion. The circle has a radius c which satisfies the following formula (1): 1 40 ⁢ H ≤ c ≤ H ( 1 ) where H is a height of the light-emitting chip. The light-emitting device disclosed herein has a light extracting layer having a very small thickness, and provides excellent light-emitting efficiency and lifetime of the light-emitting device.

公开(公告)号：US10811578B1

公开(公告)日：2020-10-20

申请号：US16367232

申请日：2019-03-27

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao Lin ,  Chun-Peng Lin ,  Chang-Han Chen ,  Kuang-Neng Yang ,  Cheng-Ta Kuo

IPC: H01L33/00 ,  H01L33/60 ,  H01L33/62 ,  H01L33/58 ,  H01L33/48

Abstract: A LED carrier includes a substrate, a conductive layer, an adhesive layer, and a reflector. The conductive layer is disposed on the substrate, and has a bonding portion and an extending portion. The bonding portion has a top surface higher than a top surface of the extending portion. The adhesive layer covers the extending portion of the conductive layer and exposes the bonding portion of the conductive layer. The reflector is disposed over the adhesive layer. The adhesive layer has a hook portion in contact with a corner of the reflector.