Method to direct pattern metals on a substrate
    2.
    发明授权
    Method to direct pattern metals on a substrate 有权
    将图案金属引导到基底上的方法

    公开(公告)号:US08278220B2

    公开(公告)日:2012-10-02

    申请号:US12210781

    申请日:2008-09-15

    IPC分类号: H01L21/311

    摘要: A microscopic metallic structure is produced by creating or exposing a patterned region of increased conductivity and then forming a conductor on the region using electrodeposition. In some embodiments, a microscopic metallic structure is formed on a substrate, and then the substrate is etched to remove the structure from the substrate. In some embodiments, a focused beam of gallium ion without a deposition precursor gas scans a pattern on a silicon substrate, to produce a conductive pattern on which a copper structure is then formed by electrochemical deposition of one or more metals. The structure can be freed from the substrate by etching, or can used in place. A beam can be used to access an active layer of a transistor, and then a conductor can be electrodeposited to provide a lead for sensing or modifying the transistor operation while it is functioning.

    摘要翻译: 通过产生或暴露具有增加的导电性的图案化区域,然后使用电沉积在该区域上形成导体来产生微观金属结构。 在一些实施例中,在衬底上形成微观金属结构,然后蚀刻衬底以从衬底去除结构。 在一些实施例中,没有沉积前体气体的聚焦聚焦的镓离子束扫描硅衬底上的图案,以产生导电图案,然后通过电化学沉积一种或多种金属形成铜结构。 该结构可以通过蚀刻从衬底中脱离,或者可以在适当的位置使用。 可以使用光束来访问晶体管的有源层,然后可以将导体电沉积以提供用于在其工作时感测或修改晶体管操作的引线。