公开(公告)号：US09466464B1

公开(公告)日：2016-10-11

申请号：US14694710

申请日：2015-04-23

Applicant: Multibeam Corporation

Inventor： David K. Lam ,  Kevin M. Monahan ,  Michael C. Smayling ,  Theodore A. Prescop

IPC: H01J37/30 ,  H01J37/305 ,  H01J37/22 ,  H01J37/05 ,  H01J37/304 ,  H01J37/317

CPC classification number: H01L21/3065 ,  B81C1/00373 ,  B81C2201/0143 ,  B81C2201/0188 ,  C23C14/48 ,  C23C16/047 ,  C23C16/48 ,  C23C16/486 ,  C23C16/487 ,  H01J37/05 ,  H01J37/06 ,  H01J37/08 ,  H01J37/228 ,  H01J37/244 ,  H01J37/30 ,  H01J37/304 ,  H01J37/305 ,  H01J37/3053 ,  H01J37/3056 ,  H01J37/3172 ,  H01J37/3174 ,  H01J37/3177 ,  H01J37/3178 ,  H01J2237/004 ,  H01J2237/0635 ,  H01J2237/1501 ,  H01J2237/24592 ,  H01J2237/30466 ,  H01J2237/30472 ,  H01J2237/31708 ,  H01J2237/31732 ,  H01J2237/31735 ,  H01J2237/31737 ,  H01J2237/3174 ,  H01J2237/31749 ,  H01L21/0228 ,  H01L21/0262 ,  H01L21/26 ,  H01L21/308 ,  H01L21/3085 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26

Abstract: Methods, devices and systems for patterning of substrates using charged particle beams without photomasks and without a resist layer. Material can be removed from a substrate, as directed by a design layout database, localized to positions targeted by multiple, matched charged particle beams. Reducing the number of process steps, and eliminating lithography steps, in localized material removal has the dual benefit of reducing manufacturing cycle time and increasing yield by lowering the probability of defect introduction. Furthermore, highly localized, precision material removal allows for controlled variation of removal rate and enables creation of 3D structures or profiles. Local gas injectors and detectors, and local photon injectors and detectors, are local to corresponding ones of the columns, and can be used to facilitate rapid, accurate, targeted substrate processing.

Abstract translation: 用于使用没有光掩模并且没有抗蚀剂层的带电粒子束来图案化衬底的方法，装置和系统。 材料可以从设计布局数据库指导的基板上移除，该设计布局数据库被定位到由多个匹配的带电粒子束瞄准的位置。 在局部材料去除中减少工艺步骤的数量和消除光刻步骤具有减少制造周期时间并通过降低缺陷引入概率来提高产量的双重优点。 此外，高度局部化的精密材料去除允许控制的去除速率的变化，并且能够创建3D结构或轮廓。 本地气体注入器和检测器以及本地光子注入器和检测器对应于相应的列是局部的，并且可以用于促进快速，准确的靶向基板处理。

公开(公告)号：US09453281B1

公开(公告)日：2016-09-27

申请号：US14745463

申请日：2015-06-21

Applicant: Multibeam Corporation

Inventor： Theodore A. Prescop ,  Kevin M. Monahan ,  David K. Lam ,  Michael C. Smayling

IPC: C23C16/48 ,  H01J37/08 ,  H01J37/30 ,  H01J37/244 ,  H01J37/06

CPC classification number: H01L21/3065 ,  B81C1/00373 ,  B81C2201/0143 ,  B81C2201/0188 ,  C23C14/48 ,  C23C16/047 ,  C23C16/48 ,  C23C16/486 ,  C23C16/487 ,  H01J37/05 ,  H01J37/06 ,  H01J37/08 ,  H01J37/228 ,  H01J37/244 ,  H01J37/30 ,  H01J37/304 ,  H01J37/305 ,  H01J37/3053 ,  H01J37/3056 ,  H01J37/3172 ,  H01J37/3174 ,  H01J37/3177 ,  H01J37/3178 ,  H01J2237/004 ,  H01J2237/0635 ,  H01J2237/1501 ,  H01J2237/24592 ,  H01J2237/30466 ,  H01J2237/30472 ,  H01J2237/31708 ,  H01J2237/31732 ,  H01J2237/31735 ,  H01J2237/31737 ,  H01J2237/3174 ,  H01J2237/31749 ,  H01L21/0228 ,  H01L21/0262 ,  H01L21/26 ,  H01L21/308 ,  H01L21/3085 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26

Abstract: Methods, devices and systems for patterning of substrates using charged particle beams without photomasks and without a resist layer. Material can be deposited onto a substrate, as directed by a design layout database, localized to positions targeted by multiple, matched charged particle beam columns. Reducing the number of process steps, and eliminating lithography steps, in localized material addition has the dual benefit of reducing manufacturing cycle time and increasing yield by lowering the probability of defect introduction. Furthermore, highly localized, precision material deposition allows for controlled variation of deposition rate and enables creation of 3D structures. Local gas injectors and detectors, and local photon injectors and detectors, are local to corresponding ones of the columns, and can be used to facilitate rapid, accurate, targeted, highly configurable substrate processing, advantageously using large arrays of said beam columns.

Abstract translation: 用于使用没有光掩模并且没有抗蚀剂层的带电粒子束来图案化衬底的方法，装置和系统。 材料可以沉积到衬底上，如设计布局数据库所指示的那样，被定位到由多个匹配的带电粒子束柱靶向的位置上。 减少工艺步骤的数量和消除光刻步骤在局部化材料添加中具有减少制造周期时间并通过降低缺陷引入概率来提高产量的双重优点。 此外，高度局部化的精密材料沉积允许沉积速率的受控变化并且能够创建3D结构。 局部气体注入器和检测器以及本地光子注入器和检测器对于相应的列是局部的，并且可以用于促进快速，准确，有针对性的高度可配置的衬底处理，有利地使用所述束柱的大阵列。

公开(公告)号：US20160244871A1

公开(公告)日：2016-08-25

申请号：US15052716

申请日：2016-02-24

Applicant: FEI Company

Inventor： Johannes Jacobus Lambertus Mulders ,  Petrus Hubertus Franciscus Trompenaars ,  Pleun Dona

IPC: C23C14/22 ,  B05B1/14 ,  B05B7/24 ,  B05B1/00

CPC classification number: C23C14/221 ,  B05B1/005 ,  B05B1/14 ,  B05B7/24 ,  H01J37/30 ,  H01J2237/006 ,  H01J2237/31732 ,  H01J2237/3174 ,  H01J2237/31749

Abstract: A Gas Injection System (GIS) applies at least two fluids in the vacuum chamber of a particle-optical apparatus, the gas injection system having two or more channels. Each channel is connected to an associated reservoir holding a fluid at a first side and having an associated exit opening at the other side, the exit sides individually exiting to the outside of the GIS via a nozzle with a nozzle opening. At least two exit openings separated by less than the diameter of the channels near the exit openings, preferably concentric to each other.

Abstract translation: 气体注入系统（GIS）在颗粒光学装置的真空室中应用至少两种流体，气体注入系统具有两个或更多个通道。 每个通道连接到在第一侧保持流体并且在另一侧具有相关联的出口的相关储存器，出口侧通过具有喷嘴开口的喷嘴单独地离开GIS的外部。 至少两个出口开口分开，小于靠近出口开口的通道的直径，优选彼此同心。

公开(公告)号：US09412560B2

公开(公告)日：2016-08-09

申请号：US14432730

申请日：2013-10-07

Applicant: FEI Company

Inventor： Stacey Stone ,  Sang Hoon Lee ,  Jeffrey Blackwood ,  Michael Schmidt

IPC: H01J37/31 ,  G01N1/32 ,  H01J37/30 ,  G01N23/225 ,  H01J37/305

CPC classification number: H01J37/3005 ,  G01N1/32 ,  G01N23/2255 ,  G01N2223/104 ,  G01N2223/611 ,  H01J37/3007 ,  H01J37/3053 ,  H01J37/3056 ,  H01J37/31 ,  H01J2237/063 ,  H01J2237/08 ,  H01J2237/2813 ,  H01J2237/31732 ,  H01J2237/31745 ,  H01J2237/31749

Abstract: To reduce artifacts in a surface exposed by a focused ion beam for viewing, a trench is milled next to the region of interest, and the trench is filled to create a bulkhead. The ion beam is directed through the bulkhead to expose a portion of the region of interest for viewing. The trench is filled, for example, by charged particle beam-induced deposition. The trench is typically milled and filled from the top down, and then the ion beam is angled with respect to the sample surface to expose the region of interest.

Abstract translation: 为了减少由聚焦离子束暴露的表面中的人造物进行观察，在感兴趣区域旁边研磨沟槽，并且填充沟槽以形成隔板。 离子束被引导通过隔板以暴露感兴趣区域的一部分以供观察。 例如，通过带电粒子束诱导沉积来填充沟槽。 沟槽通常从顶部向下铣削和填充，然后离子束相对于样品表面成角度以暴露感兴趣区域。

公开(公告)号：US09275866B2

公开(公告)日：2016-03-01

申请号：US14277857

申请日：2014-05-15

Applicant: International Business Machines Corporation

Inventor： Oleg Gluschenkov ,  Ahmet S. Ozcan

IPC: H01L21/44 ,  H01L21/285 ,  H01J37/305 ,  H01J37/30 ,  H01L21/02 ,  H01L21/3205 ,  C23C14/02

CPC classification number: H01L21/02057 ,  C23C14/02 ,  C23C16/0236 ,  C23C16/42 ,  C23C16/452 ,  C23C16/45523 ,  C23C16/4582 ,  C23C16/486 ,  C23C16/52 ,  H01J37/30 ,  H01J37/3002 ,  H01J37/305 ,  H01J37/3053 ,  H01J37/32449 ,  H01J2237/0812 ,  H01J2237/30472 ,  H01J2237/31732 ,  H01J2237/3174 ,  H01J2237/334 ,  H01L21/02068 ,  H01L21/28506 ,  H01L21/28518 ,  H01L21/2855 ,  H01L21/28575 ,  H01L21/3065 ,  H01L21/3205 ,  H01L21/67028

Abstract: A method of forming a low temperature silicide film on a substrate includes supplying a source gas to a cluster formation chamber to form a gas cluster that is subsequently moved to an ionization-acceleration chamber to form a gas cluster ion beam (GCIB). The GCIB is injected into a processing chamber containing the substrate. A precursor gas is injected through an injection device located on a top portion of the processing chamber to form a silicide film on the substrate by bombarding the substrate with the GCIB in the presence of the precursor gas.

Abstract translation: 在衬底上形成低温硅化物膜的方法包括将源气体供应到簇形成室以形成随后移动到电离加速室以形成气体簇离子束（GCIB）的气体团。 将GCIB注入含有基材的处理室中。 通过位于处理室顶部的注入装置注入前体气体，以在前体气体的存在下用GCIB轰击衬底，从而在衬底上形成硅化物膜。

公开(公告)号：US09206504B2

公开(公告)日：2015-12-08

申请号：US14243583

申请日：2014-04-02

Applicant: FEI Company

Inventor： Johannes Jacobus Lambertus Mulders ,  Remco Theodorus Johannes Petrus Geurts ,  Petrus Hubertus Franciscus Trompenaars ,  Eric Gerardus Theodoor Bosch

IPC: C23C14/28 ,  H05B6/00 ,  C23C14/48 ,  H01J37/305 ,  H01J37/317 ,  H01J37/02 ,  G01N1/28 ,  G01N1/32

CPC classification number: C23C14/48 ,  G01N1/286 ,  G01N1/32 ,  H01J37/02 ,  H01J37/3053 ,  H01J37/3171 ,  H01J37/3178 ,  H01J2237/004 ,  H01J2237/006 ,  H01J2237/31732 ,  H01J2237/3174 ,  H01J2237/31742 ,  H01J2237/31745 ,  H01J2237/31749

Abstract: Samples to be imaged in a Transmission Electron Microscope must be thinned to form a lamella with a thickness of, for example, 20 nm. This is commonly done by sputtering with ions in a charged particle apparatus equipped with a Scanning Electron Microscope (SEM) column, a Focused Ion Beam (FIB) column, and one or more Gas Injection Systems (GISses). A problem that occurs is that a large part of the lamella becomes amorphous due to bombardment by ions, and that ions get implanted in the sample. The invention provides a solution by applying a voltage difference between the capillary of the GIS and the sample, and directing a beam of ions or electrons to the jet of gas. The beam ionizes gas that is accelerated to the sample, where (when using a low voltage between sample and GIS) low energy milling occurs, and thus little sample thickness becomes amorphous.

Abstract translation: 在透射电子显微镜中成像的样品必须变薄以形成厚度为例如20nm的薄片。 这通常通过在装备有扫描电子显微镜（SEM）柱，聚焦离子束（FIB）柱和一个或多个气体注入系统（GISs））的带电粒子装置中用离子溅射来完成。 发生的一个问题是，由于离子的轰击，大部分薄片变成无定形，并且离子被植入样品中。 本发明通过在GIS的毛细管和样品之间施加电压差并且将一束离子或电子引导到气体射流来提供解决方案。 光束电离加速到样品的气体，其中（当在样品和GIS之间使用低电压时）发生低能量铣削，因此样品厚度变得非晶态。

公开(公告)号：US20140338076A1

公开(公告)日：2014-11-13

申请号：US14445392

申请日：2014-07-29

Applicant: Mehdi M. Yazdanpanah

Inventor： Mehdi M. Yazdanpanah ,  Romaneh Jalilian ,  Brian Miller ,  David A. Mudd

IPC: G01Q80/00 ,  G01N1/02

CPC classification number: G01N1/02 ,  B82Y30/00 ,  G01N1/32 ,  H01J37/00 ,  H01J2237/208 ,  H01J2237/31732 ,  H01J2237/31745 ,  H01J2237/31749 ,  H01L21/76838 ,  H05K3/222 ,  H05K2201/0248

Abstract: Embodiments of the present invention provide apparatus of restoring probes attached to the manipulator in a control environment (e.g. vacuum chamber of an focus ion beam) without a need to open the vacuum chamber. Another embodiment of the present invention teaches construction and application of various shapes of nanoforks from a nanoneedles array inside a FIB vacuum chamber. In another embodiment, the present invention teaches edition and correction of completed and oxide-coated circuit boards by re-nano-wiring using nanoneedles of a nanoneedles array (as nanowire supply), contained in the same controlled space. In this embodiment, individual nanoneedles in a nanoneedle array are manipulated by a manipulator and placed in such a way to make electrical contact between the desired points.

Abstract translation: 本发明的实施例提供了在控制环境（例如聚焦离子束的真空室）中恢复附接到操纵器的探针的装置，而不需要打开真空室。 本发明的另一个实施方案教导了在FIB真空室内的纳米针阵列中构造和应用各种形状的纳摩耳。 在另一个实施例中，本发明通过使用包含在相同受控空间中的纳米针阵列（作为纳米线供应）的纳米针通过再纳米布线来教导完成的和氧化物涂覆的电路板的编辑和校正。 在该实施例中，纳米针阵列中的单个纳米针由操纵器操纵并且以这样的方式放置以在期望的点之间进行电接触。

公开(公告)号：US08821682B2

公开(公告)日：2014-09-02

申请号：US12896549

申请日：2010-10-01

Applicant: Mark J. Williamson ,  Gurtej S. Sandhu ,  Justin R. Arrington

Inventor： Mark J. Williamson ,  Gurtej S. Sandhu ,  Justin R. Arrington

IPC: C23F1/00 ,  C23C16/00

CPC classification number: H01L21/76892 ,  H01J2237/30466 ,  H01J2237/31732 ,  H01J2237/3174 ,  H01L21/02079 ,  H01L21/31116 ,  H01L21/31604 ,  H01L21/32136

Abstract: Systems and methods of imaging and repairing defects on and below the surface of an integrated circuit (IC) are described. The method may be used in areas as small as one micron in diameter, and may remove the topmost material in the small spot, repeating with various layers, until a desired depth is obtained. An energetic beam, such as an electron beam, is directed at a selected surface location. The surface has an added layer of a solid, fluid or gaseous reactive material, such as a directed stream of a fluorocarbon, and the energetic beam disassociates the reactive material in the region of the beam into radicals that chemically attack the surface. After the defect location is exposed, the method uses the energetic beam to etch undesired materials, and deposit various appropriate materials to fill gaps, and restore the IC to an operational condition.

Abstract translation: 描述了在集成电路（IC）的表面上和下方成像和修复缺陷的系统和方法。 该方法可以用于直径小至一微米的区域，并且可以去除小点中的最上面的材料，以各种层重复，直到获得所需的深度。 诸如电子束的能量束被引导到选定的表面位置。 该表面具有固体，流体或气态反应性材料（例如碳氟化合物的定向流）的添加层，并且能量束将光束区域中的反应性材料分解成化学侵蚀表面的自由基。 在暴露缺陷位置之后，该方法使用能量束来蚀刻不需要的材料，并且沉积各种适当的材料以填充间隙，并将IC恢复到操作状态。

公开(公告)号：US20130202809A1

公开(公告)日：2013-08-08

申请号：US13756672

申请日：2013-02-01

Applicant: SEAGATE TECHNOLOGY LLC

Inventor： Philip George Pitcher

IPC: C23C14/48

CPC classification number: C23C14/48 ,  C23C14/0605 ,  C23C14/221 ,  H01J37/3171 ,  H01J37/3178 ,  H01J2237/31732

Abstract: A method of forming a layer, the method including providing a substrate having at least one surface adapted for deposition thereon; providing a precursor ion beam, the precursor ion beam including ions; neutralizing at least a portion of the ions of the precursor ion beam to form a neutral particle beam, the neutral particle beam including neutral particles; and directing the neutral particle beam towards the surface of the substrate, wherein both the ions and the neutral particles have implant energies of not greater than 100 eV, and the neutral particles of the particle beam form a layer on the substrate.

公开(公告)号：US20120308740A1

公开(公告)日：2012-12-06

申请号：US13351088

申请日：2012-01-16

Applicant: Steven Randolph ,  Clive D. Chandler

Inventor： Steven Randolph ,  Clive D. Chandler

IPC: C23C16/50

CPC classification number: C23C16/486 ,  C23C16/047 ,  C23C16/18 ,  C23C16/34 ,  C23C16/407 ,  H01J2237/31732 ,  H01L21/28556 ,  H01L21/76877 ,  H01L21/76892

Abstract: An improved method of beam deposition to deposit a low-resistivity metal. Preferred embodiments of the present invention use a novel focused ion beam induced deposition precursor to deposit low-resistivity metallic material such as tin. Applicants have discovered that by using a methylated or ethylated metal such as hexamethylditin as a precursor, material can be deposited having a resistivity as low as 40 μΩ·cm.

Abstract translation: 一种改进的光束沉积方法来沉积低电阻率金属。 本发明的优选实施方案使用新颖的聚焦离子束诱导沉积前体来沉积诸如锡的低电阻率金属材料。 申请人已经发现，通过使用甲基化或乙基化金属如六甲基锡作为前体，可以沉积具有低至40μΩ·cm·cm的电阻率的材料。