公开(公告)号：US10810477B2

公开(公告)日：2020-10-20

申请号：US16519579

申请日：2019-07-23

申请人： Linxens Holding

发明人： Christophe Mathieu ,  Bertrand Hoveman

IPC分类号： G06K19/077

摘要： The invention concerns a method for producing a flexible circuit for a chip card module. The invention consists of using conductive pads located on the same face of the module as the contacts intended to establish a connection with a card reader, in order to produce an electrical connection between an antenna and an electronic chip. The connections with conductive pads are located partly inside an encapsulation area and partly outside said encapsulation area and respectively to either side of same. The invention also relates to a flexible circuit for implementing this method.

公开(公告)号：US20190362213A1

公开(公告)日：2019-11-28

申请号：US16519579

申请日：2019-07-23

申请人： Linxens Holding

发明人： Christophe Mathieu ,  Bertrand Hoveman

IPC分类号： G06K19/077

摘要： The invention concerns a method for producing a flexible circuit for a chip card module. The invention consists of using conductive pads located on the same face of the module as the contacts intended to establish a connection with a card reader, in order to produce an electrical connection between an antenna and an electronic chip. The connections with conductive pads are located partly inside an encapsulation area and partly outside said encapsulation area and respectively to either side of same. The invention also relates to a flexible circuit for implementing this method.

公开(公告)号：US10417548B2

公开(公告)日：2019-09-17

申请号：US15309904

申请日：2015-05-13

申请人： Linxens Holding

发明人： Christophe Mathieu ,  Bertrand Hoveman

IPC分类号： G06K19/077

摘要： The invention concerns a method for producing a flexible circuit for a chip card module. The invention consists of using conductive pads located on the same face of the module as the contacts intended to establish a connection with a card reader, in order to produce an electrical connection between an antenna and an electronic chip. The connections with conductive pads are located partly inside an encapsulation area and partly outside said encapsulation area and respectively to either side of same. The invention also relates to a flexible circuit for implementing this method.

公开(公告)号：US20220253664A1

公开(公告)日：2022-08-11

申请号：US17624698

申请日：2020-06-06

申请人： LINXENS HOLDING

发明人： Simon Vassal ,  Christophe Mathieu

IPC分类号： G06K19/077

摘要： Disclosed is an electronic card, in the form of a flexible smart card provided with a flexible circuit, that includes a bottom face receiving electronic components and a top face provided with contact tabs intended to be connected to conductive tracks of a garment textile. The flexible circuit being covered on its bottom face with at least one bottom layer of bonding adhesive, first polymer layers provided with cutouts for receiving components and second polymer layers for encapsulating the components, and covered on its top face with a top layer of bonding adhesive and at least one top layer forming an outer face of the card made from polymer material provided with cutouts for accessing the contact tabs, in which at least some of the contact tabs are produced on the rim of the card and provided with an end part on the edge of the card.

公开(公告)号：US11894295B2

公开(公告)日：2024-02-06

申请号：US17452131

申请日：2021-10-25

申请人： Linxens Holding

发明人： Christophe Mathieu ,  Guillaume Gimbert

IPC分类号： H01L23/498 ,  G06K19/077 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  B23K101/40 ,  B23K35/26 ,  C22C13/00

CPC分类号： H01L23/49855 ,  G06K19/07722 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  B23K35/262 ,  B23K2101/40 ,  C22C13/00 ,  H01L2224/13211 ,  H01L2224/13213 ,  H01L2224/13239 ,  H01L2224/13247 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/81815 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01083

摘要： Process for manufacturing a chip-card module. It includes one or more operations in which a meltable solder is deposited on connection pads formed in a layer of electrically conductive material located on the back side of a dielectric substrate, and at least one electronic component is connected to these connection pads by reflowing the solder. Chip-card module obtained using this process. Chip card including such a module.

公开(公告)号：US20220139818A1

公开(公告)日：2022-05-05

申请号：US17452131

申请日：2021-10-25

申请人： Linxens Holding

发明人： Christophe Mathieu ,  Guillaume Gimbert

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  G06K19/077

摘要： Process for manufacturing a chip-card module. It includes one or more operations in which a meltable solder is deposited on connection pads formed in a layer of electrically conductive material located on the back side of a dielectric substrate, and at least one electronic component is connected to these connection pads by reflowing the solder. Chip-card module obtained using this process. Chip card including such a module.

公开(公告)号：US12131987B2

公开(公告)日：2024-10-29

申请号：US17603829

申请日：2020-04-16

申请人： Linxens Holding

发明人： Christophe Mathieu ,  Carsten Nieland

IPC分类号： G06K7/08 ,  G06K19/073 ,  H01L21/48 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L23/49838 ,  G06K19/07354 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/4985 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/73265 ,  H01L2224/8385

摘要： Biometric sensor module for a chip card, and method for producing such a module. Method for producing a biometric sensor module for a chip card, including steps of providing a dielectric carrier including a front face and a back face, both forming main faces of the carrier, attaching a biometric sensor for detecting fingerprints to the back face, a detection area covered by the sensor on the back face being placed opposite a detection area on the front face, producing electrically conductive connection pads on the back face of the carrier which are electrically connected to the biometric sensor, at least one connection pad includes a region that is wettable with a solder material, extending over an area of between 0.2 and 5 square millimetres.

公开(公告)号：US11775794B2

公开(公告)日：2023-10-03

申请号：US17603799

申请日：2020-04-16

申请人： Linxens Holding

发明人： Christophe Mathieu ,  Claire Laurens De Lopez

IPC分类号： G06K19/073

CPC分类号： G06K19/07354

摘要： Biometric sensor module for a chip card, and method for producing such a module Method for producing a biometric sensor module for a chip card, including steps of providing a dielectric carrier including a front face and a back face, the front face being coated with an electrically conductive layer in which a bezel is formed, at least one conductive via being made in the thickness of the carrier to electrically connect the bezel to the back face, producing a protective layer on the front face, covering a protection area located inside the bezel, and attaching a biometric sensor for detecting fingerprints to the back face, a detection area covered by the sensor on the back face being placed opposite the protection area.

公开(公告)号：US11681893B2

公开(公告)日：2023-06-20

申请号：US17624698

申请日：2020-06-12

申请人： LINXENS HOLDING

发明人： Simon Vassal ,  Christophe Mathieu

IPC分类号： G06K19/077

CPC分类号： G06K19/07762

摘要： Disclosed is an electronic card, in the form of a flexible smart card provided with a flexible circuit, that includes a bottom face receiving electronic components and a top face provided with contact tabs intended to be connected to conductive tracks of a garment textile. The flexible circuit being covered on its bottom face with at least one bottom layer of bonding adhesive, first polymer layers provided with cutouts for receiving components and second polymer layers for encapsulating the components, and covered on its top face with a top layer of bonding adhesive and at least one top layer forming an outer face of the card made from polymer material provided with cutouts for accessing the contact tabs, in which at least some of the contact tabs are produced on the rim of the card and provided with an end part on the edge of the card.

公开(公告)号：US11412620B2

公开(公告)日：2022-08-09

申请号：US16973529

申请日：2019-06-12

申请人： Linxens Holding

发明人： Christophe Mathieu

IPC分类号： H05K3/32

摘要： The invention relates to a process for manufacturing a roll of flexible carrier bearing electronic components. This process includes a step consisting in adding, to this flexible carrier, electronic components, themselves manufactured from a roll of flexible initial substrate. For example, the electronic components may be manufactured on an initial substrate having a width allowing advantage to be taken of densification of the manufacture of the components on this initial substrate. Subsequently, the singulated electronic components are added to the flexible carrier, allowing, for example, packaging that is more suitable, than possible with the initial substrate, to a use of the electronic components, notably when the latter must be integrated into a chip-card. Thus, for example, the flexible carrier may be, or include, an adhesive, which may or may not be conductive, and which is used to fasten, and optionally connect, each electronic component to a chip-card.