公开(公告)号：US11764185B2

公开(公告)日：2023-09-19

申请号：US17462573

申请日：2021-08-31

申请人： Infineon Technologies Austria AG

发明人： Kirill Trunov ,  Thomas Hendrix

IPC分类号： H01L23/00

CPC分类号： H01L24/81 ,  H01L24/13 ,  H01L2224/13201 ,  H01L2224/13205 ,  H01L2224/13209 ,  H01L2224/13211 ,  H01L2224/13213 ,  H01L2224/13218 ,  H01L2224/81825 ,  H01L2924/0103 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/01031 ,  H01L2924/01048 ,  H01L2924/01049 ,  H01L2924/01083

摘要： A method of soldering includes providing a substrate having a first metal joining surface, providing a semiconductor die having a second metal joining surface, providing a solder preform having a first interface surface and a second interface surface, arranging the solder preform between the substrate and the semiconductor die such that the first interface surface faces the first metal joining surface and such that the second interface surface faces the second metal joining surface, and performing a mechanical pressure-free diffusion soldering process that forms a soldered joint between the substrate and the semiconductor die by melting the solder preform and forming intermetallic phases in the solder. One or both of the first interface surface and the second interface surface has a varying surface profile that creates voids between the solder preform and one or both of the substrate and the semiconductor die before the melting of the solder preform.

公开(公告)号：US11894295B2

公开(公告)日：2024-02-06

申请号：US17452131

申请日：2021-10-25

申请人： Linxens Holding

发明人： Christophe Mathieu ,  Guillaume Gimbert

IPC分类号： H01L23/498 ,  G06K19/077 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  B23K101/40 ,  B23K35/26 ,  C22C13/00

CPC分类号： H01L23/49855 ,  G06K19/07722 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  B23K35/262 ,  B23K2101/40 ,  C22C13/00 ,  H01L2224/13211 ,  H01L2224/13213 ,  H01L2224/13239 ,  H01L2224/13247 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/81815 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01083

摘要： Process for manufacturing a chip-card module. It includes one or more operations in which a meltable solder is deposited on connection pads formed in a layer of electrically conductive material located on the back side of a dielectric substrate, and at least one electronic component is connected to these connection pads by reflowing the solder. Chip-card module obtained using this process. Chip card including such a module.

公开(公告)号：US08592299B1

公开(公告)日：2013-11-26

申请号：US13358716

申请日：2012-01-26

申请人： Voya R. Markovich ,  Rabindra N. Das ,  Rajinder S. Rai ,  Michael Vincent

发明人： Voya R. Markovich ,  Rabindra N. Das ,  Rajinder S. Rai ,  Michael Vincent

IPC分类号： H01L21/44

CPC分类号： H01L21/441 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L27/14676 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/1132 ,  H01L2224/11424 ,  H01L2224/13209 ,  H01L2224/13211 ,  H01L2224/13213 ,  H01L2224/13216 ,  H01L2224/13218 ,  H01L2224/1322 ,  H01L2224/13239 ,  H01L2224/13244 ,  H01L2224/13247 ,  H01L2224/1329 ,  H01L2224/13294 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13439 ,  H01L2224/13444 ,  H01L2224/16225 ,  H01L2224/81193 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2224/8184 ,  H01L2924/12037 ,  H01L2924/00

摘要： A structure for minimizing resistance between a semi-insulating x-ray detector crystal and an electrically conducting substrate. Electrical contact pads are disposed on the detector crystal and on the substrate with an electrical interconnect between the contact pads formed from a conductive adhesive and washed solder in electrical and mechanical communication with the pads.

摘要翻译： 用于最小化半绝缘x射线检测器晶体和导电基底之间的电阻的结构。 电接触焊盘设置在检测器晶体和基板上，在由导电粘合剂形成的接触焊盘和与焊盘电气和机械连通的冲洗焊料之间具有电互连。