-
公开(公告)号:US20230282626A1
公开(公告)日:2023-09-07
申请号:US18163417
申请日:2023-02-02
Applicant: MEDIATEK INC.
Inventor: Tai-Yu CHEN , Bo-Jiun YANG , Tsung-Yu PAN , Yin-Fa CHEN , Ta-Jen YU , Bo-Hao MA , Wen-Sung HSU , Yao-Pang HSU
IPC: H01L25/10 , H01L23/498 , H01L23/00 , H01L23/14
CPC classification number: H01L25/105 , H01L23/49816 , H01L23/49833 , H01L23/49838 , H01L24/16 , H01L23/147 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2224/16227 , H01L2924/15311 , H01L2924/182 , H01L2924/157 , H01L2924/15787 , H01L2924/1511 , H01L2924/152
Abstract: A high-bandwidth package-on-package (HBPoP) structure includes a first package structure and a second package structure disposed over the first package structure. The first package structure includes a first package substrate, a semiconductor die, an interposer, and a molding material. The first package substrate is formed of a silicon and/or ceramic material. The semiconductor die is disposed over the first package substrate. The interposer is disposed over the semiconductor die and is formed of a silicon and/or ceramic material. The molding material is disposed between the first package substrate and the interposer and surrounds the semiconductor die.