公开(公告)号：US20230282626A1

公开(公告)日：2023-09-07

申请号：US18163417

申请日：2023-02-02

Applicant: MEDIATEK INC.

Inventor： Tai-Yu CHEN ,  Bo-Jiun YANG ,  Tsung-Yu PAN ,  Yin-Fa CHEN ,  Ta-Jen YU ,  Bo-Hao MA ,  Wen-Sung HSU ,  Yao-Pang HSU

IPC: H01L25/10 ,  H01L23/498 ,  H01L23/00 ,  H01L23/14

CPC classification number: H01L25/105 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/16 ,  H01L23/147 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/182 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1511 ,  H01L2924/152

Abstract: A high-bandwidth package-on-package (HBPoP) structure includes a first package structure and a second package structure disposed over the first package structure. The first package structure includes a first package substrate, a semiconductor die, an interposer, and a molding material. The first package substrate is formed of a silicon and/or ceramic material. The semiconductor die is disposed over the first package substrate. The interposer is disposed over the semiconductor die and is formed of a silicon and/or ceramic material. The molding material is disposed between the first package substrate and the interposer and surrounds the semiconductor die.

公开(公告)号：US20240014143A1

公开(公告)日：2024-01-11

申请号：US18331394

申请日：2023-06-08

Applicant: MEDIATEK INC.

Inventor： Yi-Lin TSAI ,  Kun-Ting HUNG ,  Yin-Fa CHEN ,  Chi-Yuan CHEN ,  Wen-Sung HSU

IPC: H01L23/538 ,  H01L23/31 ,  H01L25/065 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L23/5389 ,  H01L23/3128 ,  H01L25/0657 ,  H01L24/32 ,  H01L24/16 ,  H01L23/49811 ,  H01L24/73 ,  H01L25/105 ,  H01L2225/06568 ,  H01L2224/32145 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2225/1058

Abstract: A semiconductor package structure includes a first redistribution layer, a second redistribution layer, a first semiconductor die, a second semiconductor die, an adhesive layer, and a molding material. The second redistribution layer is disposed over the first redistribution layer. The first semiconductor die and the second semiconductor die are stacked vertically between the first redistribution layer and the second redistribution layer. The first semiconductor die is electrically coupled to the first redistribution layer, and the second semiconductor die is electrically coupled to the second redistribution layer. The adhesive layer extends between the first semiconductor die and the second semiconductor die. The molding material surrounds the first semiconductor die, the adhesive layer, and the second semiconductor die.

公开(公告)号：US20230260866A1

公开(公告)日：2023-08-17

申请号：US18157159

申请日：2023-01-20

Applicant: MEDIATEK INC.

Inventor： Yin-Fa CHEN ,  Bo-Jiun YANG ,  Ta-Jen YU ,  Bo-Hao MA ,  Chih-Wei CHANG ,  Tsung-Yu PAN ,  Tai-Yu CHEN ,  Shih-Chin LIN ,  Wen-Sung HSU

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/498 ,  H01L23/13

CPC classification number: H01L23/3675 ,  H01L24/73 ,  H01L24/16 ,  H01L24/32 ,  H01L24/17 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/13 ,  H01L2924/1511 ,  H01L2924/15151 ,  H01L2924/152 ,  H01L2924/15331 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/32059 ,  H01L2224/32225 ,  H01L2224/17051 ,  H01L2924/1011

Abstract: A semiconductor package structure includes a package substrate, a semiconductor die, an interposer, an adhesive layer, and a molding material. The semiconductor die is disposed over the package substrate. The interposer is disposed over the semiconductor die. The adhesive layer connects the semiconductor die and the interposer. The molding material surrounds the semiconductor die and the adhesive layer.