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1.
公开(公告)号:US12163228B2
公开(公告)日:2024-12-10
申请号:US17305206
申请日:2021-07-01
Applicant: MELLANOX TECHNOLOGIES, LTD. , BAR-ILAN UNIVERSITY , RAMOT AT TEL-AVIV UNIVERSITY LTD. , SIMTAL NANO-COATINGS LTD
Inventor: Elad Mentovich , Yaniv Rotem , Yaakov Gridish , Doron Naveh , Chen Stern , Yosi Ben-Naim , Ariel Ismach , Eran Bar-Rabi , Tal Kaufman
IPC: C23C16/458
Abstract: A substrate carrier and a mechanism for moving the substrate carrier through a chemical vapor deposition system are provided. The substrate carrier includes a cylindrical housing having an interior surface. A plurality of plurality of shelves fixed to the interior surface, each shelf configured to support at least one substrate. The substrate carrier may include a connector configured to engage the substrate carrier with the mechanism. The mechanism may include a moveable arm and a motor configured to actuate the moveable arm. The moveable arm may include an actuating member connected to the motor and configured to move the moveable arm between a retracted state and an extended state. The moveable arm may be configured to operate in a chamber having a first pressure and a first temperature and the motor may be configured to operate in an environment having a second pressure.
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2.
公开(公告)号:US12289839B2
公开(公告)日:2025-04-29
申请号:US17305233
申请日:2021-07-01
Applicant: Mellanox Technologies, Ltd. , Bar-Ilan University
Inventor: Elad Mentovich , Boaz Atias , Doron Naveh , Eilam Zigi Ben Smolinsky , Adi Levi
IPC: H05K3/22 , C01B32/188 , H05K1/02
Abstract: Processes for localized lasering of a lamination stack and graphene-coated printed circuit board (PCB) are disclosed. An example PCB may include a lamination stack, post-lamination, that may further include a core, an adhesive layer, and at least one graphene-metal structure. A top layer of graphene of the graphene-metal structure may have never been grown before the lamination process or may have been removed post-lamination such that a portion of the top layer of graphene is missing. The localized lasering process described herein may grow (for the first time) or re-grow the graphene layer of the exposed portion of the metal layer without adverse effects to the rest of the lamination stack or PCB and while promoting a uniform layer of graphene on the top surface. A process of growing graphene through application of molecular layer and a self-assembled monolayer (SAM), are also described herein.
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公开(公告)号:US12255439B2
公开(公告)日:2025-03-18
申请号:US17540440
申请日:2021-12-02
Applicant: MELLANOX TECHNOLOGIES, LTD. , BAR-ILAN UNIVERSITY
Inventor: Dimitrios Kalavrouziotis , Paraskevas Bakopoulos , Elad Mentovich , Anna Sandomirsky , Boaz Atias , Doron Naveh , Eilam Zigi Ben Smolinsky , Adi Levi , Rana Darweesh
Abstract: A light emitting device, a transmitter, and a silicon photonics chip, among other things, are disclosed. An illustrative light emitting device is disclosed to include a silicon substrate, a waveguide disposed on or integrated in the silicon substrate, where the waveguide includes a wide waveguide section at a first end and a narrow waveguide section at a second end, a first metal pad disposed over the wide waveguide section and at least partially across the first end of the waveguide, and a second metal pad disposed over the wide waveguide section, distanced away from the first metal pad. Electrical current passing between the first metal pad and the second metal pad may cause light to be produced in the wide waveguide section and the light produced in the wide waveguide section is at least partially reflected by the first metal pad and directed to the narrow waveguide section for transmission.
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公开(公告)号:US11963309B2
公开(公告)日:2024-04-16
申请号:US17305223
申请日:2021-07-01
Applicant: Mellanox Technologies, Ltd. , Bar-Ilan University , PCB Technologies Ltd
Inventor: Boaz Atias , Elad Mentovich , Yaniv Rotem , Doron Naveh , Adi Levi , Yosi Ben-Naim , Yaad Eliya , Shlomo Danino , Eran Lipp , Alon Rubinstein , Ran Hasson Ruso
CPC classification number: H05K3/4644 , H05K1/0298 , H05K3/06 , H05K2203/06
Abstract: Processes for laminating a conductive-lubricant coated Printed Circuit Board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may further include a core, an adhesive layer, and at least one graphene-metal structure or at least one hexagonal Boron Nitride metal (h-BN-metal) structure. The materials of the PCB may change in accordance with the invention described herein, including the materials of the core, the materials of the conductive-lubricant coatings, or the metal layers of the conductive-lubricant-metal structures. Doping processes for each change in materials used are also described herein. The conductive-lubricant of the conductive-lubricant-metal structure will promote high frequency performance and heat management within the PCB. Furthermore, a removal process of those materials post-lamination is described herein to promote protection of materials and subsequent removal of protective layers without breakage or tearing.
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5.
公开(公告)号:US11949463B1
公开(公告)日:2024-04-02
申请号:US18220990
申请日:2023-07-12
Applicant: Mellanox Technologies, Ltd. , Bar-Ilan University
Inventor: Tali Septon , Elad Mentovich , Moshe B Oron , Yonatan Piasetzky , Yuval Idan , Eliahu Cohen , Avshalom C Elitzur , Taylor Lee Patti
IPC: H04B10/70
CPC classification number: H04B10/70
Abstract: Various embodiments of the present disclosure are directed to accessing a quantum communication channel undetected and/or characterizing this communication channel based upon attempted access. An example method includes accessing a quantum communication channel transmitting one or more qubits. The method includes the introduction of a noise signal to the quantum communication channel and then applying in its absence one or more weak or variable-strength measurements to the quantum communication channel. A strength of at least one measurement of the one or more measurements is based at least in part upon the current noise signal. The method further includes obtaining information associated with the one or more qubits based on the one or more measurements.
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公开(公告)号:US20190074040A1
公开(公告)日:2019-03-07
申请号:US16121672
申请日:2018-09-05
Applicant: Mellanox Technologies, Ltd. , Bar-Ilan University
Inventor: Elad Mentovich , Narkis Geuli , Robert Giterman , Alexander Fish , Adam Teman
IPC: G11C7/10 , G11C11/403 , G11C11/4097 , G11C11/412
Abstract: A high-density memory includes: a data write interface, a data read interface, an array of memory cells and level-shifting write drivers. The data write interface inputs data written to the memory. The data read interface outputs data read from the memory. The array of memory cells stores data input at the data write interface and outputs stored data to the data read interface. Each of the memory cells includes at least one low threshold voltage (LVT) read transistor and at least one respective regular threshold voltage (RVT) transistor, so as to obtain high-speed read operations. The level-shifting write drivers supply shifted write wordline voltages to the array, so as to obtain high-speed write operations.
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公开(公告)号:US12004308B2
公开(公告)日:2024-06-04
申请号:US17305205
申请日:2021-07-01
Applicant: Mellanox Technologies, Ltd. , BAR-ILAN UNIVERSITY , PCB Technologies Ltd
Inventor: Boaz Atias , Elad Mentovich , Yaniv Rotem , Doron Naveh , Adi Levi , Yosi Ben-Naim , Yaad Eliya , Shlomo Danino , Eran Lipp
IPC: H05K1/02 , B32B15/14 , C01B32/182 , C01B32/184 , C08J7/043 , C08J7/044 , C08J7/046 , C08J7/06 , H01L21/683 , H05K1/09 , H05K3/38 , H05K3/46
CPC classification number: H05K3/4652 , C01B32/184 , H05K3/388 , H05K2203/085 , H05K2203/1338
Abstract: Processes for laminating a graphene-coated printed circuit board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may include an inner core, an adhesive layer, and at least one graphene-metal structure. Pressure and heat—which may be applied under vacuum or controlled gas atmosphere—may be applied to the lamination stack, after all materials have been placed. The graphene of the graphene-metal structure is designed to promote high frequency performance and heat management within the PCB.
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公开(公告)号:US20230170670A1
公开(公告)日:2023-06-01
申请号:US17540440
申请日:2021-12-02
Applicant: MELLANOX TECHNOLOGIES, LTD. , BAR-ILAN UNIVERSITY
Inventor: Dimitrios Kalavrouziotis , Paraskevas Bakopoulos , Elad Mentovich , Anna Sandomirsky , Boaz Atias , Doron Naveh , Eilam Zigi Ben Smolinsky , Adi Levi , Rana Darweesh
CPC classification number: H01S5/1014 , H01S5/026 , H01S5/068
Abstract: A light emitting device, a transmitter, and a silicon photonics chip, among other things, are disclosed. An illustrative light emitting device is disclosed to include a silicon substrate, a waveguide disposed on or integrated in the silicon substrate, where the waveguide includes a wide waveguide section at a first end and a narrow waveguide section at a second end, a first metal pad disposed over the wide waveguide section and at least partially across the first end of the waveguide, and a second metal pad disposed over the wide waveguide section, distanced away from the first metal pad. Electrical current passing between the first metal pad and the second metal pad may cause light to be produced in the wide waveguide section and the light produced in the wide waveguide section is at least partially reflected by the first metal pad and directed to the narrow waveguide section for transmission.
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公开(公告)号:US20230007788A1
公开(公告)日:2023-01-05
申请号:US17305223
申请日:2021-07-01
Applicant: Mellanox Technologies, Ltd. , Bar-Ilan University , PCB Technologies Ltd
Inventor: Boaz ATIAS , Elad Mentovich , Yaniv Rotem , Doron Naveh , Adi Levi , Yosi Ben-Naim , Yaad Eliya , Shlomo Danino , Eran Lipp , Alon Rubinsten
Abstract: Processes for laminating a conductive-lubricant coated Printed Circuit Board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may further include a core, an adhesive layer, and at least one graphene-metal structure or at least one hexagonal Boron Nitride metal (h-BN-metal) structure. The materials of the PCB may change in accordance with the invention described herein, including the materials of the core, the materials of the conductive-lubricant coatings, or the metal layers of the conductive-lubricant-metal structures. Doping processes for each change in materials used are also described herein. The conductive-lubricant of the conductive-lubricant-metal structure will promote high frequency performance and heat management within the PCB. Furthermore, a removal process of those materials post-lamination is described herein to promote protection of materials and subsequent removal of protective layers without breakage or tearing.
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公开(公告)号:US20220372622A1
公开(公告)日:2022-11-24
申请号:US17305209
申请日:2021-07-01
Applicant: MELLANOX TECHNOLOGIES, LTD. , BAR-ILAN UNIVERSITY , RAMOT AT TEL-AVIV UNIVERSITY LTD. , SIMTAL NANO-COATINGS LTD
Inventor: Elad Mentovich , Yaniv ROTEM , Yaakov GRIDISH , Doron NAVEH , Chen STERN , Yosi BEN-NAIM , Ariel ISMACH , Eran BAR-RABI , Tal KAUFMAN
IPC: C23C16/455 , F15D1/06 , C23C16/46
Abstract: A first and a second flange assembly configured for facilitating uniform and laminar flow in a system are provided. The first flange assembly includes a first flange body configured to introduce a gas into a chamber. The first flange assembly includes a plurality of outlet tubes disposed on an interior surface of the first flange body and a plurality of inlet tubes disposed on an exterior surface of the first flange body and in fluid communication with the plurality of outlet tubes. The second flange assembly includes a second flange body configured to remove the gas from the chamber. The second flange assembly includes a plurality of through holes extending from an interior surface to an exterior surface of the second flange body and a plurality of exit tubes extending from the exterior surface of the second flange body and in fluid communication with the plurality of through holes.
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