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    SEMI-AROMATIC POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE CONTAINING SAME
    1.
    发明申请
    SEMI-AROMATIC POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE CONTAINING SAME 有权
    半芳族聚酰胺树脂组合物和含有其的成型品

    公开(公告)号：US20160168381A1

    公开(公告)日：2016-06-16

    申请号：US14906990

    申请日：2014-07-25

    Applicant: MITSUI CHEMICALS, INC.

    Inventor： Isao WASHIO ,  Hiroki EBATA ,  Hideto OGASAWARA ,  Nobuhiro TAKIZAWA ,  Fumio KAGEYAMA ,  Akinori AMANO

    IPC: C08L77/06 ,  H01B1/24

    CPC classification number: C08L77/06 ,  C08G69/265 ,  C08K7/06 ,  C08K7/14 ,  C08L23/26 ,  C08L51/06 ,  H01B1/24

    Abstract: The present invention provides a semi-aromatic polyamide resin composition having exceptional impact resistance, fuel barrier properties, and injection moldability, as well as a molded article containing the same, through a semi-aromatic polyamide resin composition containing specific proportions of (A) a semi-aromatic polyamide comprising a dicarboxylic acid component comprising terephthalic acid and adipic acid and a diamine component having a linear aliphatic diamine having 4-10 carbon atoms, (B) a semi-aromatic polyamide comprising a dicarboxylic acid component having isophthalic acid and a diamine component having an aliphatic diamine having 4-15 carbon atoms, (C) an olefin polymer containing a specific amount of functional group structural units, and (D) a fibrous filler.

    Abstract translation: 本发明提供了具有优异的耐冲击性，燃料阻隔性和注模成型性的半芳族聚酰胺树脂组合物，以及含有该半芳香族聚酰胺树脂组合物的成型品，通过含有特定比例的（A） 包含包含对苯二甲酸和己二酸的二羧酸组分的半芳族聚酰胺和具有4-10个碳原子的直链脂族二胺的二胺组分，（B）包含具有间苯二甲酸的二羧酸组分和二胺的半芳族聚酰胺 具有4-15个碳原子的脂族二胺的组分，（C）含有特定官能团结构单元的烯烃聚合物，和（D）纤维填料。

    SEMIAROMATIC POLYAMIDE, SEMIAROMATIC POLYAMIDE RESIN COMPOSITION, AND MOLDED ARTICLE
    2.
    发明申请
    SEMIAROMATIC POLYAMIDE, SEMIAROMATIC POLYAMIDE RESIN COMPOSITION, AND MOLDED ARTICLE 有权
    半自聚酰胺，半乳聚酰胺树脂组合物和成型品

    公开(公告)号：US20150329670A1

    公开(公告)日：2015-11-19

    申请号：US14441954

    申请日：2013-11-12

    Applicant: MITSUI CHEMICALS, INC.

    Inventor： Isao WASHIO ,  Hiroki EBATA ,  Fumio KAGEYAMA ,  Toshitaka KOSAKA ,  Hideto OGASAWARA ,  Akinori AMANO ,  Nobuhiro TAKIZAWA

    IPC: C08G69/26 ,  C08L23/08 ,  C08L77/06 ,  C08L33/14 ,  C08K7/14

    CPC classification number: C08G69/26 ,  C08F255/00 ,  C08G69/265 ,  C08G69/28 ,  C08K3/16 ,  C08K5/005 ,  C08K7/14 ,  C08L23/0815 ,  C08L33/14 ,  C08L51/06 ,  C08L77/06 ,  C08F222/06

    Abstract: To provide: a semiaromatic polyamide which has excellent moldability, heat resistance, chemical resistance and mechanical characteristics; and a molded article of this semiaromatic polyamide. A semiaromatic polyamide (I) of the present invention contains 35-50% by mole of a structural unit derived from terephthalic acid [A], 25-40% by mole of a structural unit derived from isophthalic acid [B], 15-35% by mole of a structural unit derived from an aliphatic dicarboxylic acid [C] (provided that the total of [A], [B] and [C] is 100% by mole), and a structural unit derived from an aliphatic diamine [D] having 4-12 carbon atoms. The molar ratio ([A]/[B]) is from 65/35 to 50/50, and the molar ratio ([C]/[B]) is from 30/70 to 50/50. The melting enthalpy ([increment]H) of the semiaromatic polyamide (I) as determined by differential scanning calorimetry (DSC) is 20-40 mJ/mg, and the intrinsic viscosity of the semiaromatic polyamide (I) is 0.7-1.6 dl/g.

    Abstract translation: 提供：具有优异的成型性，耐热性，耐化学性和机械特性的半芳族聚酰胺; 和该半芳族聚酰胺的模塑制品。 本发明的半芳族聚酰胺（I）含有35-50摩尔％的由对苯二甲酸[A]衍生的结构单元，25-40摩尔％来自间苯二甲酸[B]的结构单元，15-35摩尔％ 衍生自脂族二羧酸[C]的结构单元的摩尔％（[A]，[B]和[C]的总和为100摩尔％），衍生自脂肪族二胺的结构单元[ D]具有4-12个碳原子。 摩尔比（[A] / [B]）为65/35〜50/50，摩尔比（[C] / [B]）为30/70〜50/50。 通过差示扫描量热法（DSC）测定的半芳族聚酰胺（I）的熔融焓（[增量] H）为20-40mJ / mg，半芳族聚酰胺（I）的特性粘度为0.7-1.6dl / G。

    POLYESTER RESIN COMPOSITION FOR REFLECTIVE MATERIAL AND REFLECTOR INCLUDING SAME
    4.
    发明申请
    POLYESTER RESIN COMPOSITION FOR REFLECTIVE MATERIAL AND REFLECTOR INCLUDING SAME 审中-公开
    用于反射材料的聚酯树脂组合物和包括其的反射剂

    公开(公告)号：US20160090482A1

    公开(公告)日：2016-03-31

    申请号：US14889224

    申请日：2014-05-09

    Applicant: MITSUI CHEMICALS, INC.

    Inventor： Hiroki EBATA ,  Hideto OGASAWARA ,  Isao WASHIO ,  Fumio KAGEYAMA ,  Nobuhiro TAKIZAWA ,  Akinori AMANO ,  Takashi HAMA

    IPC: C08L67/02

    CPC classification number: C08L67/02 ,  C08K3/013 ,  C08K7/14 ,  C08L23/02 ,  H01L33/60

    Abstract: The present invention is directed to a polyester resin composition for providing a reflector having excellent mechanical strength and heat resistance, maintaining high reflectance even in a heated environment such as an LED manufacturing process or a reflow soldering process, and having small change in shrinkage rate. The polyester resin composition for a reflective material is a composition comprising 30 to 80% by mass of a polyester resin (A) with a melting point or a glass transition temperature of 250° C. or more, 10 to 35% by mass of a glass fiber (B) with a minor axis of 3 to 8 μm, 5 to 50% by mass of a white pigment (C), and 0.3 to 1.5% by mass of an olefin polymer (D) containing 0.2 to 1.8% of a functional group structural unit (all based on a total of (A), (B), (C) and (D) which is 100% by mass).

    Abstract translation: 本发明涉及一种用于提供具有优异的机械强度和耐热性的反射器的聚酯树脂组合物，即使在诸如LED制造工艺或回流焊接工艺的加热环境中也保持高反射率，并且收缩率变化小。 用于反射材料的聚酯树脂组合物是包含30至80质量％的熔点或玻璃化转变温度为250℃以上的聚酯树脂（A），10〜35质量％的 短轴为3〜8μm的玻璃纤维（B），白色颜料（C）5〜50质量％，含有0.2〜1.8质量％的C的烯烃聚合物（D）的0.3〜1.5质量％ 官能团结构单元（全部以（A），（B），（C）和（D）为100质量％）。

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