公开(公告)号：US09643271B2

公开(公告)日：2017-05-09

申请号：US14600934

申请日：2015-01-20

Applicant: MPI CORPORATION

Inventor： Kun-Han Hsieh ,  Huo-Kang Hsu ,  Kuan-Chun Chou ,  Tsung-Yi Chen ,  Chung-Tse Lee

IPC: B23K1/00 ,  H01L23/00

CPC classification number: B23K1/0016 ,  H01L24/12 ,  H01L24/81

Abstract: A method for making a support structure for a probing device includes a step of providing a substrate having first internal conductive lines, a carrier having second internal conductive lines and a thickness less than 2 mm for packaging an integrated circuit chip, solder balls, and photoresist support blocks made by lithography in a way that the solder balls and the photoresist support blocks are disposed between the substrate and the carrier, the photoresist support blocks separately arranged from each other, and at least one of the photoresist support blocks is disposed between two adjacent solder balls. The method further includes a step of electrically connecting the first internal conductive lines with the second internal conductive lines respectively by soldering the carrier and the substrate with the solder balls by reflow soldering.

公开(公告)号：US20230065896A1

公开(公告)日：2023-03-02

申请号：US17856678

申请日：2022-07-01

Applicant: MPI Corporation

Inventor： Yi-Chien Tsai ,  Huo-Kang Hsu ,  Yu-Wen Chou ,  Yu-Shan Hu

IPC: G01R1/073

Abstract: A probe card and a wafer testing assembly thereof are provided. The wafer testing assembly includes a printed circuit board, a space transformer, a plurality of copper pillars and a plurality of strengthening structure units. The printed circuit board includes a bottom surface and a plurality of first contacts arranged on the bottom surface. The space transformer includes a top surface and a plurality of second contacts. The second contacts are arranged on the top surface and corresponding to the first contacts. The copper pillars are respectively arranged between the first contacts and the second contacts. Two ends of each of the copper pillars are respectively electrically connected to the first contacts and the second contacts. The strengthening structure units are arranged on the bottom surface of the printed circuit board and respectively surrounding the copper pillars.

公开(公告)号：US12099078B2

公开(公告)日：2024-09-24

申请号：US17856678

申请日：2022-07-01

Applicant: MPI Corporation

Inventor： Yi-Chien Tsai ,  Huo-Kang Hsu ,  Yu-Wen Chou ,  Yu-Shan Hu

IPC: G01R1/073

CPC classification number: G01R1/07378 ,  G01R1/07342

Abstract: A probe card and a wafer testing assembly thereof are provided. The wafer testing assembly includes a printed circuit board, a space transformer, a plurality of copper pillars and a plurality of strengthening structure units. The printed circuit board includes a bottom surface and a plurality of first contacts arranged on the bottom surface. The space transformer includes a top surface and a plurality of second contacts. The second contacts are arranged on the top surface and corresponding to the first contacts. The copper pillars are respectively arranged between the first contacts and the second contacts. Two ends of each of the copper pillars are respectively electrically connected to the first contacts and the second contacts. The strengthening structure units are arranged on the bottom surface of the printed circuit board and respectively surrounding the copper pillars.

公开(公告)号：US11150269B2

公开(公告)日：2021-10-19

申请号：US16990283

申请日：2020-08-11

Applicant: MPI CORPORATION

Inventor： Hui-Pin Yang ,  Shang-Jung Hsieh ,  Yu-Wen Chou ,  Ching-Fang Yu ,  Huo-Kang Hsu ,  Chin-Tien Yang

IPC: G01R1/073 ,  G01R1/067

Abstract: A probe head includes a probe seat, a first spring probe penetrating through upper, middle and lower dies of the probe seat for transmitting a first test signal, and at least two shorter second spring probes penetrating through the lower die for transmitting a second test signal with higher frequency. Two second spring probes are electrically connected in a way that top ends thereof are abutted against two electrically conductive contacts on a bottom surface of the middle die electrically connected by a connecting circuit therein. The lower die has a communicating space and at least two lower installation holes communicating therewith and each accommodating a second spring probe partially located in the communicating space. The probe head is adapted for concurrent high and medium or low frequency signal tests, meets fine pitch and high frequency testing requirements and prevents probe cards from too complicated circuit design.

公开(公告)号：US09442135B2

公开(公告)日：2016-09-13

申请号：US14224727

申请日：2014-03-25

Applicant: MPI CORPORATION

Inventor： Kuan-Chun Chou ,  Huo-Kang Hsu ,  Hui-Pin Yang ,  Chien-Kuei Wang

IPC: H05K3/20 ,  G01R3/00 ,  G01R1/073

CPC classification number: G01R3/00 ,  G01R1/07378 ,  Y10T29/49128

Abstract: A method of manufacturing a space transformer for a probe card includes the steps of mounting and electrically connecting second substrates on a first substrate, forming an insulated layer with through holes on each of the second substrates, and forming electrically conductive blocks in the through holes, respectively. Because the electrically conductive blocks are formed after the second substrates are mounted to the first substrate, any unexpected relative displacement of the first and second substrates during mounting is uninfluential to positions of the electrically conductive blocks. Besides, a step of planarizing the electrically conductive blocks can be further carried out. Therefore, the positions and flatness of probe needles may not need to be adjusted after the probe needles are connected with the electrically conductive blocks of the space transformer thus obtained.

Abstract translation: 一种制造用于探针卡的空间变压器的方法包括以下步骤：在第一基板上安装和电连接第二基板，在每个第二基板上形成具有通孔的绝缘层，并在通孔中形成导电块， 分别。 由于在第二基板安装到第一基板之后形成导电块，因此在安装期间第一和第二基板的任何意外的相对位移对于导电块的位置是不利的。 此外，可以进一步执行导电块的平坦化步骤。 因此，在探针与这样获得的空间变换器的导电块连接之后，探针的位置和平面度可能不需要调整。