POSITIONER OF PROBE CARD AND PROBE HEAD OF PROBE CARD
    1.
    发明申请
    POSITIONER OF PROBE CARD AND PROBE HEAD OF PROBE CARD 有权
    探索卡的位置和探针头的探头

    公开(公告)号:US20150377926A1

    公开(公告)日:2015-12-31

    申请号:US14558735

    申请日:2014-12-03

    CPC classification number: G01R1/07364 G01R1/07357 G01R31/2891

    Abstract: A positioner and a probe head of a probe card are provided. The positioner has a main opening, a first sub-opening, a second sub-opening, a third sub-opening, a fourth sub-opening, a first positioning portion, a second positioning portion, a first elastic portion and a second elastic portion. The first sub-opening, the second sub-opening, the third sub-opening, and the fourth sub-opening are sequentially arranged at the periphery of the main opening and are communicated to the main opening. A stiffness of the first positioning portion and a stiffness of the second positioning portion are higher than a stiffness of the first elastic portion and a stiffness of the second elastic portion.

    Abstract translation: 提供探针卡的定位器和探针头。 定位器具有主开口,第一子开口,第二子开口,第三子开口,第四子开口,第一定位部分,第二定位部分,第一弹性部分和第二弹性部分 。 第一子开口,第二子开口,第三子开口和第四子开口依次布置在主开口的周边并且连通到主开口。 第一定位部的刚度和第二定位部的刚度高于第一弹性部的刚度和第二弹性部的刚度。

    Apparatus for probing die electricity and method for forming the same
    2.
    发明授权
    Apparatus for probing die electricity and method for forming the same 有权
    用于探测电弧的装置及其形成方法

    公开(公告)号:US09506978B2

    公开(公告)日:2016-11-29

    申请号:US14847957

    申请日:2015-09-08

    CPC classification number: G01R31/2889 G01R1/0408 G01R1/0416

    Abstract: An apparatus for probing die electricity includes a substrate, a converting plate, a needle module and a reinforcement structure. The converting plate includes two opposite surfaces respectively having a plurality of first and second conductive elements. The needle module has a plurality of needles respectively and electrically connected to the plurality second conductive elements. The reinforcement structure is made from a polymer gel and disposed between the converting plate and the substrate.

    Abstract translation: 用于探测电力的装置包括基板,转换板,针模块和加强结构。 转换板包括分别具有多个第一和第二导电元件的两个相对表面。 针模组分别具有多个针并与多个第二导电元件电连接。 加强结构由聚合物凝胶制成并且设置在转换板和基底之间。

    Assembling method and maintaining method for vertical probe device
    4.
    发明授权
    Assembling method and maintaining method for vertical probe device 有权
    垂直探针装置的组装方法和维护方法

    公开(公告)号:US09465050B2

    公开(公告)日:2016-10-11

    申请号:US14643780

    申请日:2015-03-10

    Abstract: An assembling method for a vertical probe device includes steps of disposing a lower die on a jig by inserting supporting columns through jig holes of the lower die, fastening a positioning film on the supporting columns, installing probe needles and an upper die in a way that the positioning film is located between the upper and lower dies without contacting the upper die, unfastening the positioning film, and removing the jig so that the upper and lower dies, positioning film and probe needles constitute the device. A maintaining method for the device includes steps of inserting the supporting columns through the jig holes, fastening the positioning film to the jig, and removing the upper die. The probe needles and upper die are easily removed and installed and the probe needles are reliable. The vertical probe device is applicable for accommodating electronic components on the top thereof.

    Abstract translation: 垂直探针装置的组装方法包括以下步骤:通过将支撑柱插入下模的夹具孔,将下模设置在夹具上,将定位膜紧固在支撑柱上,安装探针和上模, 定位膜位于上模和下模之间,不接触上模,松开定位膜,并移除夹具,使上,下模,定位膜和探针构成装置。 该装置的保持方法包括以下步骤:将支撑柱插入夹具孔中,将定位膜紧固到夹具上,并移除上模。 探头针和上模容易拆卸和安装,探针可靠。 垂直探针装置适用于在其顶部容纳电子部件。

    Method for making support structure for probing device

    公开(公告)号:US09643271B2

    公开(公告)日:2017-05-09

    申请号:US14600934

    申请日:2015-01-20

    CPC classification number: B23K1/0016 H01L24/12 H01L24/81

    Abstract: A method for making a support structure for a probing device includes a step of providing a substrate having first internal conductive lines, a carrier having second internal conductive lines and a thickness less than 2 mm for packaging an integrated circuit chip, solder balls, and photoresist support blocks made by lithography in a way that the solder balls and the photoresist support blocks are disposed between the substrate and the carrier, the photoresist support blocks separately arranged from each other, and at least one of the photoresist support blocks is disposed between two adjacent solder balls. The method further includes a step of electrically connecting the first internal conductive lines with the second internal conductive lines respectively by soldering the carrier and the substrate with the solder balls by reflow soldering.

    Position adjustable probing device and probe card assembly using the same
    6.
    发明授权
    Position adjustable probing device and probe card assembly using the same 有权
    位置可调探测装置和探针卡组件使用相同

    公开(公告)号:US09435856B2

    公开(公告)日:2016-09-06

    申请号:US14253336

    申请日:2014-04-15

    CPC classification number: G01R31/2889 G01R1/07378

    Abstract: A position adjustable probing device adapted for being mounted to a circuit board includes a frame, a probe head, a space transformer module and an elevation adjusting structure. The frame has a first surface, a second surface opposite to the first surface, and a first opening penetrating through the first and second surfaces. The probe head is coupled to the frame. The space transformer module is disposed in the first opening. The elevation adjusting structure is provided at the frame and has a plurality of spacers for adjusting a position of the frame relative to a reference surface in a vertical direction.

    Abstract translation: 适于安装到电路板的位置可调探测装置包括框架,探针头,空间变换器模块和仰角调节结构。 框架具有第一表面,与第一表面相对的第二表面和穿过第一表面和第二表面的第一开口。 探头连接到框架。 空间变压器模块设置在第一开口中。 高度调节结构设置在框架处,并且具有多个间隔件,用于调节框架相对于参考表面在垂直方向上的位置。

    Alignment adjusting mechanism for probe card, position adjusting module using the same and modularized probing device
    9.
    发明授权
    Alignment adjusting mechanism for probe card, position adjusting module using the same and modularized probing device 有权
    探针卡对准调整机构,使用相同的位置调整模块和模块化探测装置

    公开(公告)号:US09470750B2

    公开(公告)日:2016-10-18

    申请号:US14253675

    申请日:2014-04-15

    CPC classification number: G01R31/2889 G01R1/07378

    Abstract: An alignment adjusting mechanism for a probe card includes a frame, a substrate and positioning screws. The frame has an opening, an inner periphery wall surrounding around the opening, and an outer periphery wall corresponding to the inner periphery wall. The substrate is disposed in the opening and supported by a support flange extending from the inner periphery wall toward a center of the opening. The frame is provided with a plurality of positioning threaded holes each extending from the outer periphery wall to the inner periphery wall in communication with the opening. Each positioning screw is threaded into one of the positioning threaded holes and has an end stopped at a lateral side of the substrate. By turning the positioning screws, the planimetric position of the substrate on an imaginary plane is adjustable.

    Abstract translation: 用于探针卡的对准调节机构包括框架,基板和定位螺钉。 框架具有开口,围绕开口的内周壁和与内周壁对应的外周壁。 基板设置在开口中并由从内周壁向开口中心延伸的支撑凸缘支撑。 框架设置有多个定位螺纹孔,每个定位螺纹孔从外周壁延伸到与开口连通的内周壁。 每个定位螺钉被拧入一个定位螺纹孔中,并且一端停在基片的侧面。 通过转动定位螺钉,基板在虚拟平面上的平面位置可调。

    Probe card and manufacturing method thereof
    10.
    发明授权
    Probe card and manufacturing method thereof 有权
    探针卡及其制造方法

    公开(公告)号:US09341648B2

    公开(公告)日:2016-05-17

    申请号:US13972930

    申请日:2013-08-22

    CPC classification number: G01R1/0491 G01R1/07378 G01R3/00 Y10T29/49126

    Abstract: The probe card includes a substrate, at least two IC boards, and a plurality of probe pads. The IC boards are located on the substrate, and a predetermined distance is formed between the IC boards. Each of the IC boards has a plurality of lead connection points. The probe pads are plated on the IC boards, and are respectively connected to the lead connection points to cover the lead connection points. A probe area is surrounded by the probe pads on each of the IC boards. The probe pads are used to abut against plural probes.

    Abstract translation: 探针卡包括基板,至少两个IC板和多个探针垫。 IC板位于基板上,并且在IC板之间形成预定距离。 每个IC板具有多个引线连接点。 探针焊盘电镀在IC板上,并分别连接到引线连接点以覆盖引线连接点。 探针区域被每个IC板上的探针焊盘包围。 探针垫用于抵靠多个探针。

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