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公开(公告)号：US20150377926A1
公开(公告)日：2015-12-31
申请号：US14558735
申请日：2014-12-03
Applicant: MPI Corporation
Inventor： Tzu-Yang Chen , Shang-Jung Hsieh , Chung-Tse Lee , Tsung-Yi Chen , Tien-Chia Li , Chia-Yuan Kuo , Che-Wei Lin
CPC classification number: G01R1/07364 , G01R1/07357 , G01R31/2891
Abstract: A positioner and a probe head of a probe card are provided. The positioner has a main opening, a first sub-opening, a second sub-opening, a third sub-opening, a fourth sub-opening, a first positioning portion, a second positioning portion, a first elastic portion and a second elastic portion. The first sub-opening, the second sub-opening, the third sub-opening, and the fourth sub-opening are sequentially arranged at the periphery of the main opening and are communicated to the main opening. A stiffness of the first positioning portion and a stiffness of the second positioning portion are higher than a stiffness of the first elastic portion and a stiffness of the second elastic portion.
Abstract translation: 提供探针卡的定位器和探针头。 定位器具有主开口，第一子开口，第二子开口，第三子开口，第四子开口，第一定位部分，第二定位部分，第一弹性部分和第二弹性部分 。 第一子开口，第二子开口，第三子开口和第四子开口依次布置在主开口的周边并且连通到主开口。 第一定位部的刚度和第二定位部的刚度高于第一弹性部的刚度和第二弹性部的刚度。
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公开(公告)号：US09648757B2
公开(公告)日：2017-05-09
申请号：US14520772
申请日：2014-10-22
Applicant: MPI CORPORATION
Inventor： Chung-Tse Lee , Chien-Chou Wu , Tsung-Yi Chen
IPC: H05K3/40 , G01R3/00 , H05K3/14 , H05K3/10 , H05K3/32 , G01R1/067 , G01R1/20 , H01R43/20 , G01R1/073
CPC classification number: H05K3/4007 , G01R1/067 , G01R1/07378 , G01R1/20 , G01R3/00 , H01R43/20 , H05K3/10 , H05K3/143 , H05K3/32 , H05K3/403 , H05K3/4038 , H05K2201/09409 , H05K2203/0574 , H05K2203/1476 , Y10T29/49147 , Y10T29/49162 , Y10T29/49165
Abstract: A method of manufacturing a space transformer includes providing a carrier substrate made for a chip package, forming an insulated layer disposed on the carrier substrate, and forming a conductive block. The carrier substrate is formed with elongated first and second wires. The first wire has an elongated contact which is longer than the width of the first wire. The insulated layer is formed with a hole corresponding in position to the elongated contact. The conductive block is formed with an elongated connecting column located in the hole and connected with the elongated contact, and a cylindrical contact pad exposed at the outside of the insulated layer, larger-sized than the elongated connecting column is connected with the elongated connecting column. As a result, the cylindrical contact pad has sufficient area and structural strength for contact with a probe needle.
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公开(公告)号：US09618536B2
公开(公告)日：2017-04-11
申请号：US14294958
申请日：2014-06-03
Applicant: MPI CORPORATION
Inventor： Chia-Yuan Kuo , Tien-Chia Li , Ming-Chi Chen , Chien-Chou Wu , Tsung-Yi Chen
CPC classification number: G01R1/07357 , G01R1/0675
Abstract: A probe needle includes a head, a tail and a body connected between the head and the tail and provided with a first flat section curvedly extending from the head towards the tail for providing sufficient deformation when the tail is pressed on a device under test, and a second flat section neighbored to the first flat section for supporting the probe needle in between upper and lower dies. When the probe needles are used in a probe module, the probe needles can be arranged with a pitch same as that of the conventional probe needles even though the probe needles are formed from posts having a relatively greater diameter than that of the posts for making the conventional probe needles, such that the probe needles may have enhanced current withstanding capacity and prolonged lifespan.
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公开(公告)号：US09465050B2
公开(公告)日：2016-10-11
申请号：US14643780
申请日：2015-03-10
Applicant: MPI CORPORATION
Inventor： Tsung-Yi Chen , Horng-Kuang Fan , Ching-Hung Yang , Chung-Tse Lee , Chia-Yuan Kuo , Tien-Chia Li , Ting-Ju Wu
CPC classification number: G01R3/00 , G01R1/073 , G01R1/07307 , G01R1/07314 , G01R1/0735 , G01R31/2601 , Y10T29/49117 , Y10T29/49718 , Y10T29/49895
Abstract: An assembling method for a vertical probe device includes steps of disposing a lower die on a jig by inserting supporting columns through jig holes of the lower die, fastening a positioning film on the supporting columns, installing probe needles and an upper die in a way that the positioning film is located between the upper and lower dies without contacting the upper die, unfastening the positioning film, and removing the jig so that the upper and lower dies, positioning film and probe needles constitute the device. A maintaining method for the device includes steps of inserting the supporting columns through the jig holes, fastening the positioning film to the jig, and removing the upper die. The probe needles and upper die are easily removed and installed and the probe needles are reliable. The vertical probe device is applicable for accommodating electronic components on the top thereof.
Abstract translation: 垂直探针装置的组装方法包括以下步骤：通过将支撑柱插入下模的夹具孔，将下模设置在夹具上，将定位膜紧固在支撑柱上，安装探针和上模， 定位膜位于上模和下模之间，不接触上模，松开定位膜，并移除夹具，使上，下模，定位膜和探针构成装置。 该装置的保持方法包括以下步骤：将支撑柱插入夹具孔中，将定位膜紧固到夹具上，并移除上模。 探头针和上模容易拆卸和安装，探针可靠。 垂直探针装置适用于在其顶部容纳电子部件。
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公开(公告)号：US20150033553A1
公开(公告)日：2015-02-05
申请号：US14515537
申请日：2014-10-16
Applicant: MPI CORPORATION
Inventor： Chien-Chou Wu , Ming-Chi Chen , Tsung-Yi Chen , Chung-Che Li
CPC classification number: G01R3/00 , B23K2103/42 , G01R31/2853 , G01R31/2887 , G01R31/2889 , Y10T29/49004 , Y10T29/49128 , Y10T29/49155 , Y10T29/49204 , Y10T29/49208 , Y10T29/49222
Abstract: An assembly method of direct-docking probing device is provided. First, a space transforming plate made by back-end-of-line semiconductor manufacturing process is provided, so the thickness of the space transforming plate is predetermined by the client of probe card manufacturer. Then a reinforcing plate in which a plurality of circuits disposed is provided, which has larger mechanical strength than the space transforming plate. After that the reinforcing plate and the space transforming plate are joined and electrically connected by a plurality of solders so as to form a space transformer. Then, a conductive elastic member and a probe interface board are provided. Thereafter, the space transformer and the conductive elastic member are mounted on the probe interface board. After that, at least one vertical probe assembly having a plurality of vertical probes is mounted on the space transforming plate, and the vertical probes is electrically connected with the space transforming plate.
Abstract translation: 提供了直接对接探测装置的装配方法。 首先，提供由后端半导体制造工艺制成的空间变换板，因此空间变换板的厚度由探针卡制造商的客户预先确定。 然后，设置有设置多个电路的加强板，其具有比空间转换板更大的机械强度。 之后，加强板和空间变换板通过多个焊料接合并电连接，形成空间变换器。 然后，提供导电弹性构件和探针接口板。 此后，空间变压器和导电弹性构件安装在探针接口板上。 之后，具有多个垂直探针的至少一个垂直探针组件安装在空间变换板上，垂直探针与空间转换板电连接。
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Patent Agency Ranking
6.发明授权公开(公告)号：US11346860B2
公开(公告)日：2022-05-31
申请号：US16990612
申请日：2020-08-11
Applicant: MPI CORPORATION
Inventor： Chin-Tien Yang , Hui-Pin Yang , Shang-Jung Hsieh , Tsung-Yi Chen , Yu-Hao Chen , Jhin-Ying Lyu
Abstract: A probe head includes a probe seat having upper, middle and lower dies, an electrically conductive layer inside the probe seat, a first spring probe penetrating through the probe seat, and at least two shorter second spring probes penetrating through the lower die in a way that top ends of the second spring probes are located inside the probe seat and abutted against the electrically conductive layer. Another probe head includes the aforesaid probe seat, an electrically conductive layer partially inside the probe seat and partially outside the probe seat, a first spring probe penetrating through the probe seat, and a shorter second spring probe penetrating through the lower die in a way that a top end of the second spring probe is located inside the probe seat and abutted against the electrically conductive layer. As such, fine pitch requirement and different high frequency testing requirements are fulfilled.
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公开(公告)号：US10557866B2
公开(公告)日：2020-02-11
申请号：US15363659
申请日：2016-11-29
Applicant: MPI CORPORATION
Inventor： Tsung-Yi Chen , Shih-Shin Chen
Abstract: A probe seat of a vertical probe device includes a lower die, a middle die fixed on the lower die, at least one upper die fixed on the middle die, and at least one reinforcing die fixedly disposed in at least one through trough of the middle die. The lower die has lower probe holes located below the through trough, such that probes are be inserted through the lower probe holes respectively and inserted through the through trough. The at least one upper die has upper probe holes located above the through trough for the probes to be inserted therethrough. The at least one reinforcing die has middle probe holes for the probes to be inserted therethrough. As a result, the probe seat has improved rigidity to avoid bending.
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公开(公告)号：US09643271B2
公开(公告)日：2017-05-09
申请号：US14600934
申请日：2015-01-20
Applicant: MPI CORPORATION
Inventor： Kun-Han Hsieh , Huo-Kang Hsu , Kuan-Chun Chou , Tsung-Yi Chen , Chung-Tse Lee
CPC classification number: B23K1/0016 , H01L24/12 , H01L24/81
Abstract: A method for making a support structure for a probing device includes a step of providing a substrate having first internal conductive lines, a carrier having second internal conductive lines and a thickness less than 2 mm for packaging an integrated circuit chip, solder balls, and photoresist support blocks made by lithography in a way that the solder balls and the photoresist support blocks are disposed between the substrate and the carrier, the photoresist support blocks separately arranged from each other, and at least one of the photoresist support blocks is disposed between two adjacent solder balls. The method further includes a step of electrically connecting the first internal conductive lines with the second internal conductive lines respectively by soldering the carrier and the substrate with the solder balls by reflow soldering.
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9.发明授权公开(公告)号：US09435856B2
公开(公告)日：2016-09-06
申请号：US14253336
申请日：2014-04-15
Applicant: MPI CORPORATION
Inventor： Tsung-Yi Chen , Chung-Tse Lee , Shih-Shin Chen
CPC classification number: G01R31/2889 , G01R1/07378
Abstract: A position adjustable probing device adapted for being mounted to a circuit board includes a frame, a probe head, a space transformer module and an elevation adjusting structure. The frame has a first surface, a second surface opposite to the first surface, and a first opening penetrating through the first and second surfaces. The probe head is coupled to the frame. The space transformer module is disposed in the first opening. The elevation adjusting structure is provided at the frame and has a plurality of spacers for adjusting a position of the frame relative to a reference surface in a vertical direction.
Abstract translation: 适于安装到电路板的位置可调探测装置包括框架，探针头，空间变换器模块和仰角调节结构。 框架具有第一表面，与第一表面相对的第二表面和穿过第一表面和第二表面的第一开口。 探头连接到框架。 空间变压器模块设置在第一开口中。 高度调节结构设置在框架处，并且具有多个间隔件，用于调节框架相对于参考表面在垂直方向上的位置。
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公开(公告)号：US10393773B2
公开(公告)日：2019-08-27
申请号：US15274409
申请日：2016-09-23
Applicant: MPI CORPORATION
Inventor： Tsung-Yi Chen , Ting-Hsin Kuo , Yi-Lung Lee , Shih-Shin Chen , Horng-Chuan Sun , Horng-Kuang Fan
Abstract: A probe card includes a probe seat having upper and lower dies and a probe accommodating hole, a spring probe inserted through the probe accommodating hole and including a spring sleeve having upper and lower non-spring sections, and a circuit board disposed on the upper die and having a contact pad against which the spring probe is abutted. At least one of the upper and lower dies has a stopping surface partially facing the probe accommodating hole and an extended portion inserting hole in alignment with the probe accommodating hole. At least one of the upper and lower non-spring sections has a cylinder portion abutted on the stopping surface and an extended portion inserted through the extended portion inserting hole.
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