公开(公告)号：US20210180200A1

公开(公告)日：2021-06-17

申请号：US16713871

申请日：2019-12-13

Applicant: MacDermid Enthone Inc.

Inventor： Shaopeng Sun ,  Kyle Whitten ,  Stephan Braye ,  Elie Najjar

IPC: C25D3/16 ,  C25D5/18 ,  C25D5/02

Abstract: An electroplated cobalt deposit and a method of electrodepositing cobalt on a surface to produce a level deposit across the surface of the substrate. The cobalt electrolyte contains (1) a source of cobalt ions; (2) boric acid; (3) a pH adjuster; and (4) an organic additive, which contains a suppressor. The electroplated cobalt deposit exhibits a level surface such that the thickness difference across substantially the entire surface of the substrate of less than about 200 nm.

公开(公告)号：US20220136123A1

公开(公告)日：2022-05-05

申请号：US17524450

申请日：2021-11-11

Applicant: MacDermid Enthone Inc.

Inventor： Shaopeng Sun ,  Kyle Whitten ,  Stephan Braye ,  Elie Najjar

IPC: C25D3/16 ,  C25D5/02 ,  C25D5/18 ,  C25D7/12

Abstract: An electroplated cobalt deposit and a method of electrodepositing cobalt on a surface to produce a level deposit across the surface of the substrate. The cobalt electrolyte contains (1) a source of cobalt ions; (2) boric acid; (3) a pH adjuster; and (4) an organic additive, which contains a suppressor. The electroplated cobalt deposit exhibits a level surface such that the thickness difference across substantially the entire surface of the substrate of less than about 200 nm.

公开(公告)号：US11807951B2

公开(公告)日：2023-11-07

申请号：US17524450

申请日：2021-11-11

Applicant: MacDermid Enthone Inc.

Inventor： Shaopeng Sun ,  Kyle Whitten ,  Stephan Braye ,  Elie Najjar

IPC: C25D3/16 ,  C25D5/02 ,  C25D5/18 ,  C25D7/12 ,  B32B15/04 ,  B32B3/26 ,  C25D5/00 ,  C25D7/00

CPC classification number: C25D3/16 ,  B32B3/26 ,  B32B15/04 ,  B32B15/043 ,  C25D5/02 ,  C25D5/18 ,  C25D5/611 ,  C25D7/00 ,  C25D7/123 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/12937 ,  Y10T428/12993 ,  Y10T428/2495 ,  Y10T428/24942 ,  Y10T428/265

Abstract: An electroplated cobalt deposit and a method of electrodepositing cobalt on a surface to produce a level deposit across the surface of the substrate. The cobalt electrolyte contains (1) a source of cobalt ions; (2) boric acid; (3) a pH adjuster; and (4) an organic additive, which contains a suppressor. The electroplated cobalt deposit exhibits a level surface such that the thickness difference across substantially the entire surface of the substrate of less than about 200 nm.

公开(公告)号：US11230778B2

公开(公告)日：2022-01-25

申请号：US16713871

申请日：2019-12-13

Applicant: MacDermid Enthone Inc.

Inventor： Shaopeng Sun ,  Kyle Whitten ,  Stephan Braye ,  Elie Najjar

IPC: C25D3/16 ,  C25D5/02 ,  C25D7/12 ,  C25D5/18

Abstract: An electroplated cobalt deposit and a method of electrodepositing cobalt on a surface to produce a level deposit across the surface of the substrate. The cobalt electrolyte contains (1) a source of cobalt ions; (2) boric acid; (3) a pH adjuster; and (4) an organic additive, which contains a suppressor. The electroplated cobalt deposit exhibits a level surface such that the thickness difference across substantially the entire surface of the substrate of less than about 200 nm.