Platinum-cobalt alloy sputtering target and method for manufacturing same
    1.
    发明授权
    Platinum-cobalt alloy sputtering target and method for manufacturing same 失效
    铂 - 钴合金溅射靶及其制造方法

    公开(公告)号:US5282946A

    公开(公告)日:1994-02-01

    申请号:US903748

    申请日:1992-06-25

    IPC分类号: C22C5/04 C22C19/07 C23C14/34

    摘要: A sputtering target of platinum-cobalt alloy is disclosed which contains 10 to 55% by weight of platinum; 1 to 15% by weight of a first additional element selected from the group consisting of nickel and tantalum; no more than 1.5% by weight of a second additional element selected from the group consisting of boron, titanium, lanthanum, cerium, neodymium, beryllium, calcium, zirconium, and silicon; no more than 20% by weight of chromium; and balance cobalt. A method for manufacturing the sputtering target is also disclosed. In the method, a platinum-cobalt alloy containing specific ingredients in predetermined amounts is first prepared. Then, the platinum-cobalt alloy is subjected to hot plastic working with a thickness reduction of no less than 30%. Subsequently, the alloy thus hot worked is subjected to a cold plastic working with a thickness reduction of no less than 5% at a temperature less than the recrystallization temperature of the alloy.

    摘要翻译: 公开了一种铂 - 钴合金的溅射靶,其包含10至55重量%的铂; 1至15重量%的选自镍和钽的第一附加元素; 不超过1.5重量%的选自硼,钛,镧,铈,钕,铍,钙,锆和硅的第二附加元素; 不超过20%的铬; 并平衡钴。 还公开了溅射靶的制造方法。 在该方法中,首先制备含有预定量的特定成分的铂 - 钴合金。 然后,铂 - 钴合金经受热塑性加工,其厚度减小不小于30%。 随后,将这样热加工的合金在小于合金的再结晶温度的温度下进行厚度降低不小于5%的冷塑性加工。

    Method of purifying copper electrolytic solution
    4.
    发明授权
    Method of purifying copper electrolytic solution 失效
    铜电解液净化方法

    公开(公告)号:US5783057A

    公开(公告)日:1998-07-21

    申请号:US804558

    申请日:1997-02-24

    IPC分类号: C25C1/12 C25C7/06 C25D21/18

    CPC分类号: C25C7/06 C25C1/12 Y02P10/212

    摘要: A method of purifying a copper electrolytic solution circulated in a copper electrorefining system, wherein a portion of the solution is withdrawn and recycled to the system after purification treatment. The purification treatment includes the addition of a hydrosulfide to the withdrawn solution to generate only the necessary quantity of hydrogen sulfide gas required in the reaction. The hydrogen sulfide gas generated is utilized for purification treatment. One process comprises dividing the solution withdrawn into two portions. Sodium hydrosulfide is added to the first portion to precipitate and separate metals as sulfides. Excess sodium hydrosulfide is further added to the first portion for reaction with residual sulfuric acid in the solution to generate hydrogen sulfide gas, then contacting the second divided portion with the hydrogen sulfide gas thus produced to precipitate and separate metals in the form of sulfides. The filtrate is then recycled to an electrorefining system. There is also provided a process comprising contacting the solution with hydrogen sulfide gas to separate and remove Cu, As, Sb and Bi in the form of sulfides from the solution, then dividing the solution into two portions; The first portion is recycled to the electrorefining system, whereas excess sodium hydrosulfide is added to the second portion to separate and recover Ni as nickel sulfide from the solution. Resultant hydrogen sulfide gas is used for contact with solution to be treated.

    摘要翻译: 一种纯化在铜电解精炼系统中循环的铜电解液的方法,其中一部分溶液在净化处理后被抽出并再循环至系统。 净化处理包括向所提取的溶液中加入氢硫化物以仅产生反应所需的必需量的硫化氢气体。 产生的硫化氢气体用于净化处理。 一个方法包括将溶液分离成两部分。 将氢硫化钠加入到第一部分以沉淀并分离作为硫化物的金属。 进一步向第一部分加入过量的氢硫化钠以与溶液中的残余硫酸反应以产生硫化氢气体,然后使第二分开部分与由此产生的硫化氢气体接触以沉淀并分离硫化物形式的金属。 然后将滤液再循环至电解精炼系统。 还提供了一种方法,其包括使溶液与硫化氢气体接触,从溶液中分离并除去硫化物形式的Cu,As,Sb和Bi,然后将溶液分成两部分; 将第一部分再循环至电解精炼系统,而将过量的氢硫化钠加入到第二部分中以从溶液中分离和回收作为硫化镍的Ni。 所得硫化氢气体用于与待处理溶液接触。