摘要:
A method is described for programming a semiconductor array of EEPROM cells. A selected cell is connected, by definition, to a selected source-column line, a selected drain-column line and a selected wordline. Each deselected memory cell in the array is connected to a deselected source-column line, a deselected drain-column line and/or a deselected wordline. The method includes preselecting first, second, third, fourth and fifth programming voltages such that the second programming voltage is more positive than the first programming voltage and such that the third, fourth and fifth programming voltages are intermediate between the first and second programming voltages. The first programming voltage is applied at least to a selected column line and to each of the same-type deselected column lines. The third programming voltage is applied to the selected wordline and the fourth programming voltage is applied to each deselected wordline. After a pre-charge time interval, the fifth programming voltage is applied to each same-type deselected column line and, after an optional additional pre-charge time interval, the second programming voltage is applied to the selected wordline. After a program time interval, the third programming voltage is applied to the selected wordline and, after an optional discharge time interval, the first programming voltage is applied to each same-type deselected column line. Each deselected wordline is maintained at the fourth programming voltage for an additional discharge time interval. The third, fourth and fifth programming voltages may have the same value.
摘要:
A pair of electrically erasable, electrically programmable memory cells are formed at a face of a semiconductor layer (10) and include respective source regions (30a, 30b), a shared drain region (28) and respective channel regions (38a, 38b). Each cell has a floating gate conductor (46a, 46b) that controls the conductance of a respective subchannel region (74a, 74b) and may be programmed through Fowler-Nordheim electron tunneling through a respective tunnel oxide window (40a, 40b) from a respective source region (30a, 30b). A field plate conductor (40a) controls the conductance of respective subchannel regions (70a, 70b) within each channel region (38a, 38b). A word line or control gate conductor (62) is insulatively disposed adjacent respective third, remaining channel subregions (53a, 53b) and further is disposed insulatively adjacent the floating gates (46a, 46b) to program or erase them.
摘要:
An electrically-erasable, programmable ROM cell, or an EEPROM cell, is constructed using an enhancement transistor merged with a floating-gate transistor, where the floating-gate transistor has a small tunnel window, in a contact-free cell layout, enhancing the ease of manufacture and reducing cell size. The bitlines and source/drain regions are buried beneath relatively thick silicon oxide, which allows a favorable ratio of control gate to floating gate capacitance. Programming and erasing are provided by the tunnel window are near or above the channel side of the source. The window has a thinner dielectric than the remainder of the floating gate, to allow Fowler-Nordheim tunneling. By using dedicated drain or ground lines, rather than a virtual-ground layout, and by using thick oxide for isolation between bitlines, the floating gate can extend onto adjacent bitlines and isolation area, resulting in a favorable coupling ratio. Isolation between wordlines is also by thick thermal oxide in a preferred embodiment, further improving the coupling ratio. Bitline and wordline spacing may be selected for optimum pitch or aspect ratio. Bitline to substrate capacitance is minimized.
摘要:
An electrically-erasable, electrically-programmable read-only memory cell 10 is formed at a face of a layer of semiconductor 30 of a first conductivity type. A first source/drain region 16 and a second source/drain region 20 are formed in the face of layer of semiconductor 30 of a second conductivity type opposite the first conductivity type and spaced by a first channel area 50. A third source/drain region 18 is formed in the face of semiconductor layer 30 of the second conductivity type spaced from second source/drain region 20 by a second channel area 52. A thick insulator region 44 is formed adjacent at least a portion of second source/drain region 20 and includes a lateral margin of sloped thickness overlying a corresponding lateral margin of second source/drain region 20. The corresponding lateral margin of second source/drain region 20 has a graded dopant concentration directly proportionate with the sloped thickness of the overlying lateral margin of thick insulator region 44. A differentially grown insulator region 54 overlies second source/drain region 20 and includes a lateral margin of sloped thickness. A thin insulator tunneling window 62 overlies an area 60 of second source/drain region 20, tunneling window 62 formed between and spacing the lateral margin of the thick insulator region 44 and the lateral margin of differentially grown insulator region 54. A floating gate conductor 26 is disposed adjacent tunneling window 62 and insulatively adjacent second channel area 52. A control gate conductor 28 is disposed insulatively adjacent floating gate conductor 28. A gate conductor 24 is disposed insulatively adjacent first channel area 50.
摘要:
An electrically-erasable, electrically-programmable ROM or an EEPROM is constructed using an enhancement transistor merged with a floating-gate transistor, where the floating-gate transistor has a small self-aligned tunnel window positioned on the opposite side of the source from the channel and drain, in a contact-free cell layout, enhancing the ease of manufacture and reducing cell size. In this cell, the bitlines and source/drain regions are buried beneath relatively thick silicon oxide, which allows a favorable ratio of control gate to floating gate capacitance. Programming and erasing are provided by the tunnel window area on the outside of the source (spaced from the channel). The tunnel window has a thinner dielectric than the remainder of the floating gate to allow Fowler-Nordheim tunneling.
摘要:
An electrically-erasable, electrically-programmable ROM or an EEPROM is constructed using an enhancement transistor merged with a floating-gate transistor, where the floating-gate transistor has a small self-aligned tunnel window positioned on the opposite side of the source from the channel and drain, in a contact-free cell layout, enhancing the ease of manufacture and reducing cell size. In this cell, the bitlines and source/drain regions are buried beneath relatively thick silicon oxide, which allows a favorable ratio of control gate to floating gate capacitance. Programming and erasing are provided by the tunnel window area on the outside of the source (spaced from the channel). The tunnel window has a thinner dielectric than the remainder of the floating gate to allow Fowler-Nordheim tunneling.
摘要:
An electrically-erasable, electrically-programmable, read-only-memory cell array is formed in pairs at a face of a semiconductor substrate (22). Each memory cell includes a source region (11) and a drain region (12), with a corresponding channel region between. A Fowler-Nordheim tunnel-window (13a) is located over the source line (17) connected to source (11). A floating gate (13) includes a tunnel-window section. A control gate (14) is disposed over the floating gate (13), insulated by an intervening inter-level dielectric (27). The floating gate (13) and the control gate (14) include a channel section (Ch). The channel section (Ch) is used as a self-alignment implant mask for the source (11) and drain (12) regions, such that the channel-junction edges are aligned with the corresponding edges of the channel section (Ch). The memory cell is programmed by hot-carrier injection from the channel to the floating gate (13), and erased by Fowler-Nordheim tunneling from the floating gate (13) through the tunnel window (13a) to the source-line (17 ). The program and erase regions of the cells are physically separate from each other, and the characteristics, including the oxides, of each of those regions may be made optimum independently from each other.
摘要:
An electrically-erasable, programmable ROM cell, or an EEPROM cell, is constructed using an enhancement transistor merged with a floating-gate transistor, where the floating-gate transistor has a small tunnel window, in a contact-free cell layout, enhancing the ease of manufacture and reducing cell size. The bitlines and source/drain regions are buried beneath relatively thick silicon oxide, which allows a favorable ratio of control gate to floating gate capacitance. Programming and erasure are provided by the tunnel window area, which is located near or above the channel side of the source. The window has a thinner dielectric than the remainder of the floating gate, to allow Fowler-Nordheim tunneling. By using dedicated drain or ground lines, rather than a virtual-ground layout, and by using thick oxide for isolation between bitlines, the floating gate can extend onto adjacent bitlines and isolation area, resulting in a favorable coupling ratio. Isolation between cells in the wordline direction is by a self-aligned implanted region, in this embodiment.
摘要:
A method is described for programming an array of EEPROM cells. Programming occurs through a Fowler-Nordheim tunnel window (34) between a source bitline (24) and a floating gate conductor (42) of a selected cell. The voltages applied to the control gate and to the source are selected to differ sufficiently to cause electrons to be drawn through the tunnel window (34) from the source region (24) to the floating gate conductor (42). The non-selected bitlines have a voltage impressed thereon that is of sufficient value to prevent inadvertent programming of cells in the selected row. The non-selected wordlines (48) have a voltage impressed thereon that is of sufficient value to prevent erasing of programmed non-selected cells.
摘要:
An electrically-erasable, electrically-programmable, read-only memory cell array is formed in pairs at a face of a semiconductor substrate (11). Each memory cell includes a source region (14a) and a shaped drain region (16), with at corresponding channel region (18a) in between. A Fowler-Nordheim tunnel window subregion (15a) of the source region (14a) is located opposite the channel (18a). A floating gate conductor (FG) includes a channel section (32a) and a tunnel window section (34a). The floating gate conductor is formed in two stages, the first stage forming the channel section (32a) from a first-level polysilicon (P1A). This floating gate channel section (32a/P1A) is used as a self-alignment implant mask for the source (14a) and drain (16) regions, such that the channel junction edges are aligned with the coresponding edges of the channel section. A control gate conductor (CG) is disposed over the floating gate conductor (FG), insulated by an intervening interlevel dielectric (ILD). The memory cell is programmed by hot carrier injection from the channel (18a) to the floating-gate channel section (32a), and erased by Fowler-Nordheim tunneling from the floating-gate tunnel window section (34a) to the tunnel window subregion (15a).