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12 条记录 (耗时 0.023 秒)

    Deposition of a thin film on a substrate using a multi-beam source
    1.
    发明授权
    Deposition of a thin film on a substrate using a multi-beam source 失效
    使用多光束源在基板上沉积薄膜

    公开(公告)号：US6152074A

    公开(公告)日：2000-11-28

    申请号：US905166

    申请日：1997-08-01

    申请人： Marc O. Schweitzer ,  Barry L. Chin ,  Ivo J. Raaijmakers

    发明人： Marc O. Schweitzer ,  Barry L. Chin ,  Ivo J. Raaijmakers

    IPC分类号： C30B23/08 ,  C23C14/24 ,  C30B23/02 ,  C30B23/06 ,  H01L21/203 ,  C23C14/00

    CPC分类号： C23C14/24 ,  C23C14/243 ,  C30B23/02 ,  C30B23/066

    摘要： A multi-beam source for deposition of a material on to a substrate with enhanced deposition rate, uniformity and beam directionality. A plurality of orifices are provided in a head unit having a cavity containing a vapor of the deposition material. The cavity and the vapor contained therein are maintained at a high temperature to increase the deposition rate. The orifices are maintained at the same high temperature and act as heated collimators to produce highly directional beams for deposition of materials into high aspect ratio features. When used in jet vapor deposition techniques, an inert gas flow is introduced into the cavity and forced out thereof through the orifices as jets to transport particles of the deposition material to the substrate.

    摘要翻译： 一种用于将材料沉积到衬底上的多光束源，具有增强的沉积速率，均匀性和光束方向性。 在具有包含沉积材料的蒸气的空腔的头单元中设置多个孔。 其中容纳的空腔和蒸汽保持在高温以增加沉积速率。 孔保持在相同的高温，并作为加热准直仪，以产生高度定向的光束，用于将材料沉积到高纵横比特征中。 当用于喷射气相沉积技术时，将惰性气体流引入空腔中并将其通过孔口作为喷射流出，以将沉积材料的颗粒输送到基底。

    End point detection for sputtering and resputtering
    2.
    发明授权
    End point detection for sputtering and resputtering 失效
    溅射和再溅射的终点检测

    公开(公告)号：US07048837B2

    公开(公告)日：2006-05-23

    申请号：US10659902

    申请日：2003-09-11

    申请人： Sasson R. Somekh ,  Marc O. Schweitzer ,  John C. Forster ,  Zheng Xu ,  Roderick C. Mosely ,  Barry L. Chin ,  Howard E. Grunes

    发明人： Sasson R. Somekh ,  Marc O. Schweitzer ,  John C. Forster ,  Zheng Xu ,  Roderick C. Mosely ,  Barry L. Chin ,  Howard E. Grunes

    IPC分类号： C23C14/35

    CPC分类号： C23C14/544 ,  C23C14/046 ,  C23C14/165 ,  C23C14/5833 ,  C23C14/5873 ,  G01N21/68 ,  H01J37/321 ,  H01J37/32477 ,  H01J37/32935 ,  H01J37/32963 ,  H01J37/3455 ,  H01L21/2855 ,  H01L21/76814 ,  H01L21/76844 ,  H01L21/76846 ,  H01L21/76862 ,  H01L21/76865 ,  H01L22/26 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Plasma etching or resputtering of a layer of sputtered materials including opaque metal conductor materials may be controlled in a sputter reactor system. In one embodiment, resputtering of a sputter deposited layer is performed after material has been sputtered deposited and while additional material is being sputter deposited onto a substrate. A path positioned within a chamber of the system directs light or other radiation emitted by the plasma to a chamber window or other optical view-port which is protected by a shield against deposition by the conductor material. In one embodiment, the radiation path is folded to reflect plasma light around the chamber shield and through the window to a detector positioned outside the chamber window. Although deposition material may be deposited onto portions of the folded radiation path, in many applications, the deposition material will be sufficiently reflective to permit the emission spectra to be detected by a spectrometer or other suitable detector without significant signal loss. The etching or resputtering may be terminated when the detector detects that an underlying layer has been reached or when some other suitable process point has been reached.

    摘要翻译： 可以在溅射反应器系统中控制包括不透明金属导体材料的溅射材料层的等离子体蚀刻或再溅射。 在一个实施例中，溅射沉积层的溅射在材料溅射沉积之后进行，并且另外的材料被溅射沉积到衬底上。 位于系统的腔室内的路径将等离子体发射的光或其他辐射引导到腔室窗口或其他光学视图端口，其被屏蔽物保护以防止被导体材料沉积。 在一个实施例中，辐射路径被折叠以将等离子体光围绕室屏蔽件并且通过窗口反射到位于室窗口外部的检测器。 虽然沉积材料可以沉积在折叠辐射路径的部分上，但是在许多应用中，沉积材料将被充分反射，以允许发射光谱由光谱仪或其它合适的检测器检测，而没有显着的信号损失。 当检测器检测到已经到达下层或者当达到某些其它合适的处理点时，蚀刻或再溅射可以被终止。

    Fabricating and cleaning chamber components having textured surfaces
    4.
    发明申请
    Fabricating and cleaning chamber components having textured surfaces 有权
    制造和清洁具有纹理表面的腔室部件

    公开(公告)号：US20090120462A1

    公开(公告)日：2009-05-14

    申请号：US12316834

    申请日：2008-12-16

    申请人： Brian T. West ,  Marc O. Schweitzer ,  Jennifer L. Watia

    发明人： Brian T. West ,  Marc O. Schweitzer ,  Jennifer L. Watia

    IPC分类号： B08B3/02

    CPC分类号： C23C14/564 ,  B08B3/02 ,  H01L21/67051 ,  Y10T428/24355

    摘要： A method of fabricating a substrate processing chamber component involves forming a component having a textured surface and sweeping a jet of pressurized fluid across the textured surface of the component. The jet of fluid is pressurized sufficiently high to dislodge substantially all the particles from the textured surface. The method can be applied to dislodge grit particles from textured exposed surfaces formed by electromagnetic energy beam scanning and grit blasting. The method can also be applied to remove loosely adhered coating particles from the textured surfaces of coated components.

    摘要翻译： 制造基板处理室部件的方法包括形成具有纹理表面的部件，并且跨过部件的纹理化表面扫掠加压流体的射流。 流体射流被加压得足够高，以从织纹表面去除基本上所有的颗粒。 该方法可应用于通过电磁能量束扫描和喷砂处理形成的纹理暴露表面去除砂粒。 该方法还可以用于从被涂覆部件的织构化表面去除松散粘附的涂层颗粒。

    Method of surface texturizing
    7.
    发明授权
    Method of surface texturizing 有权
    表面纹理化方法

    公开(公告)号：US06933508B2

    公开(公告)日：2005-08-23

    申请号：US10099307

    申请日：2002-03-13

    申请人： Alan R. Popiolkowski ,  Shannon M. Hart ,  Marc O. Schweitzer ,  Alan B. Liu ,  Jennifer L. Watia

    发明人： Alan R. Popiolkowski ,  Shannon M. Hart ,  Marc O. Schweitzer ,  Alan B. Liu ,  Jennifer L. Watia

    IPC分类号： C23C16/44 ,  H01J37/317 ,  B23K15/08

    CPC分类号： C23C16/4404 ,  H01J37/317

    摘要： A method and system for providing a texture to a surface of a workpiece is provided. The method comprises providing a workpiece to a texturizing chamber and scanning a beam of electromagnetic energy across the surface of the workpiece to form a plurality of features thereon. The features formed are generally depressions, protuberances, and combinations thereof. Also provided is a method of reducing contamination in a process chamber. The method comprises scanning a beam of electromagnetic energy across a surface of one or more process chamber components to form a plurality of features thereon, positioning the one or more chamber components into a process chamber, and initiating a process sequence within the process chamber.

    摘要翻译： 提供了一种用于向工件的表面提供纹理的方法和系统。 该方法包括将工件提供到纹理化室并扫过横跨工件的表面的电磁能束以在其上形成多个特征。 形成的特征通常是凹陷，突起和它们的组合。 还提供了减少处理室中污染的方法。 该方法包括在一个或多个处理室部件的表面上扫描电磁能束，以在其上形成多个特征，将一个或多个室部件定位到处理室中，以及启动处理室内的处理顺序。

    Shutter disk and blade alignment sensor
    9.
    发明授权
    Shutter disk and blade alignment sensor 有权
    快门盘和刀片对准传感器

    公开(公告)号：US06669829B2

    公开(公告)日：2003-12-30

    申请号：US10082480

    申请日：2002-02-20

    申请人： Michael Feltsman ,  Allen Lau ,  Michael Rosenstein ,  Marc O. Schweitzer

    发明人： Michael Feltsman ,  Allen Lau ,  Michael Rosenstein ,  Marc O. Schweitzer

    IPC分类号： C23C1400

    CPC分类号： C23C14/566

    摘要： The present invention generally provides a physical vapor deposition chamber and a method for detecting a position of a shutter disk within a physical vapor deposition chamber. In one embodiment, a physical vapor deposition chamber includes a chamber body having a shutter disk mechanism disposed therein. A housing is sealingly coupled to a sidewall of the chamber body and communicates therewith through a slot formed through the sidewall. At least a first sensor is disposed adjacent to the housing and orientated to detect the presence of a shutter disk mechanism within the housing. In one embodiment, a method for detecting the position of a shutter disk within a physical vapor deposition chamber having a substrate support generally includes moving the shutter disk away from a substrate support, and changing a state of a first sensor in response to a position of an edge the shutter disk.

    摘要翻译： 本发明通常提供物理气相沉积室和用于检测物理气相沉积室内的快门盘的位置的方法。 在一个实施例中，物理气相沉积室包括其中设置有快门盘机构的室主体。 壳体密封地联接到室主体的侧壁并且通过穿过侧壁形成的槽与其连通。 至少第一传感器被布置成与壳体相邻并且被定向以检测壳体内的快门盘机构的存在。 在一个实施例中，用于检测具有基板支撑件的物理气相沉积室内的快门盘的位置的方法通常包括将快门盘移离基板支撑件，并且响应于第一传感器的位置改变第一传感器的状态 边缘快门盘。

    APPARATUS, METHOD AND COMPUTER PROGRAM PRODUCT FOR MODIFYING A SURFACE OF A COMPONENT
    10.
    发明申请
    APPARATUS, METHOD AND COMPUTER PROGRAM PRODUCT FOR MODIFYING A SURFACE OF A COMPONENT 有权
    用于修改组件表面的装置，方法和计算机程序产品

    公开(公告)号：US20080248719A1

    公开(公告)日：2008-10-09

    申请号：US12061900

    申请日：2008-04-03

    申请人： Marc O. Schweitzer

    发明人： Marc O. Schweitzer

    IPC分类号： B24C3/00 ,  B24C1/00

    CPC分类号： B24C7/0046 ,  B24C1/00 ,  B24C1/04

    摘要： An apparatus, method and computer program product for modifying a surface of a component is provided. In use, a surface of a component is translated relative to at least one jet for a period of time to form a plurality of features thereon.

    摘要翻译： 提供了用于修改部件表面的装置，方法和计算机程序产品。 在使用中，组件的表面相对于至少一个射流平移一段时间以在其上形成多个特征。