Thin film magnetic head fabrication method
    1.
    发明授权
    Thin film magnetic head fabrication method 失效
    薄膜磁头制造方法

    公开(公告)号:US5531017A

    公开(公告)日:1996-07-02

    申请号:US579466

    申请日:1995-12-27

    IPC分类号: G11B5/31 G11B5/127

    摘要: A novel thin film magnetic head fabrication process is provided for fabricating a plurality of thin film magnetic head elements. The process begins with the selection of an appropriate wafer substrate of suitable size and quality. At least two primary sub-areas of the wafer substrate are designated as work areas for the deposition of magnetic recording transducer elements. The work areas have first and second end portions and are arranged in mutually adjacent relation along a shared boundary zone that extends in a first direction through the wafer substrate between the first and second end portions. The wafer substrate is populated with plural rows of magnetic recording transducer elements in the designated work areas such that the plural rows extend in a second direction that is substantially perpendicular to the first direction. The work areas are separated from the wafer substrate and magnetic transducer slider elements are fabricated from the plural rows of magnetic recording transducer elements. The process steps are such that they reduce the number of fabrication steps to a minimum while increasing the consistency of throat and stripe heights.

    摘要翻译: 提供了用于制造多个薄膜磁头元件的新型薄膜磁头制造工艺。 该过程开始于选择适当尺寸和质量的合适的晶片衬底。 晶片衬底的至少两个主要子区域被指定为用于沉积磁记录换能器元件的工作区域。 工作区具有第一和第二端部,并且沿着沿第一方向延伸穿过第一和第二端部之间的晶片衬底的共享边界区布置成相互相邻的关系。 晶片基板在指定的工作区域中填充有多行磁记录换能器元件,使得多行在基本上垂直于第一方向的第二方向上延伸。 工作区域与晶片基板分离,并且磁性换能器滑块元件由多行磁记录换能器元件制成。 工艺步骤使得它们将制造步骤的数量减少到最小,同时增加了喉部和条纹高度的一致性。

    Ultimate inductive head integrated lapping system
    3.
    发明授权
    Ultimate inductive head integrated lapping system 失效
    极致感应头集成研磨系统

    公开(公告)号:US5361547A

    公开(公告)日:1994-11-08

    申请号:US936823

    申请日:1992-08-28

    摘要: A lapping control system for accurately obtaining a desired throat height of each of a plurality of batch fabricated thin film magnetic transducers, comprises a row of thin film transducers formed on a substrate, the row comprising a height defining edge and at least four spaced sensing devices, a first two of the sensing devices comprising switch devices each offset a predetermined amount from the height defining edge, and a second two of the sensing devices comprising resistive devices each offset a predetermined amount from the height defining edge, a support of mounting the row of thin film magnetic transducers in a position to lap the height defining edge of each of the thin film magnetic transducers and the sensing devices, a measuring device for measuring the resistance of the resistive devices during lapping of the height defining edge, apparatus responsive to the measured resistance and To a selected sate of at least one of the two switch devices for calibrating resistance versus throat height characteristics for each of the thin film magnetic transducers in the row, and for terminating the lapping process when a predetermined throat height is reached for each of the thin film magnetic transducers.

    摘要翻译: 一种用于准确地获得多个批量制造的薄膜磁换能器中每一个的所需喉部高度的研磨控制系统包括形成在基底上的一排薄膜换能器,该行包括高度限定边缘和至少四个间隔开的感测装置 传感装置的前两个包括开关装置,每个开关装置各自从高度限定边缘偏移预定量,并且第二传感装置包括每个偏移距高度限定边缘预定量的电阻装置,安装该行的支撑件 的薄膜磁性换能器,以便搭载每个薄膜磁性换能器和感测装置的高度限定边缘的位置;测量装置,用于在高度限定边缘的研磨期间测量电阻装置的电阻,该装置响应于 测量电阻和至少两个用于校准电阻的开关装置中的一个的选定端子 针对每列薄膜磁性换能器的连续高度特性,以及当每个薄膜磁性换能器达到预定的喉部高度时终止研磨过程。

    Ultimate inductive head integrated lapping system
    4.
    发明授权
    Ultimate inductive head integrated lapping system 失效
    极致感应头集成研磨系统

    公开(公告)号:US5597340A

    公开(公告)日:1997-01-28

    申请号:US300820

    申请日:1994-09-02

    摘要: A lapping control system for accurately obtaining a desired throat height of each of a plurality of batch fabricated thin film magnetic transducers, comprises a row of thin film transducers formed on a substrate, the row comprising a height defining edge and at least four spaced sensing devices, a first two of the sensing devices comprising switch devices each offset a predetermined amount from the height defining edge, and a second two of the sensing devices comprising resistive devices each offset a predetermined amount from the height defining edge, a support of mounting the row of thin film magnetic transducers in a position to lap the height defining edge of each of the thin film magnetic transducers and the sensing devices, a measuring device for measuring the resistance of the resistive devices during lapping of the height defining edge, apparatus responsive to the measured resistance and to a selected state of at least one of the two switch devices for calibrating resistance versus throat height characteristics for each of the thin film magnetic transducers in the row, and for terminating the lapping process when a predetermined throat height is reached for each of the thin film magnetic transducers.

    摘要翻译: 一种用于准确地获得多个批量制造的薄膜磁换能器中每一个的所需喉部高度的研磨控制系统包括形成在基底上的一排薄膜换能器,该行包括高度限定边缘和至少四个间隔开的感测装置 传感装置的前两个包括开关装置,每个开关装置各自从高度限定边缘偏移预定量,并且第二传感装置包括每个偏移距高度限定边缘预定量的电阻装置,安装该行的支撑件 的薄膜磁性换能器,以便搭载每个薄膜磁性换能器和感测装置的高度限定边缘的位置;测量装置,用于在高度限定边缘的研磨期间测量电阻装置的电阻,该装置响应于 测量电阻以及用于校准电阻ve的两个开关装置中的至少一个的选定状态 针对行中的每个薄膜磁换能器,并且为每个薄膜磁性换能器达到预定的喉部高度时终止研磨过程。

    Bow compensated lapping
    5.
    发明授权
    Bow compensated lapping 失效
    弓补偿研磨

    公开(公告)号:US06174218B1

    公开(公告)日:2001-01-16

    申请号:US09295696

    申请日:1999-04-21

    IPC分类号: B24B4900

    摘要: A method and apparatus for controlling the amount of row distortion before and dynamically during the lapping process used to manufacture sliders for magnetic storage devices. A wafer quadrant of slider rows is bonded to an extender tool held in a carrier assembly and an actuator is used to laterally apply force to the extender tool such that it changes the profile of the wafer quadrant, and thus the foremost slider row. Multiple arms may be defined in the extender tool, permitting independent engagement with and application of the lateral force by the actuator. Bending moments in each arm are then efficiently and controllably transferred into a beam in the extender tool which is proximate to the point where the wafer quadrant is bonded.

    摘要翻译: 一种用于在用于制造磁存储装置的滑块的研磨过程之前和动态地控制行失真量的方法和装置。 滑块列的晶片象限被结合到保持在载体组件中的延伸器工具上,并且致动器用于向延伸器工具横向施加力,使得其改变晶片象限的轮廓,并因此改变最前面的滑块排。 可以在扩展器工具中限定多个臂,从而允许与致动器的侧向力的独立接合和施加。 然后将每个臂中的弯曲力矩有效地和可控制地转移到靠近晶片象限结合的点的扩展器工具中的梁中。

    Bow compensated lapping
    7.
    发明授权
    Bow compensated lapping 失效
    弓补偿研磨

    公开(公告)号:US06346029B1

    公开(公告)日:2002-02-12

    申请号:US09712024

    申请日:2000-11-13

    IPC分类号: B24B100

    摘要: A method and apparatus for controlling the amount of row distortion before and dynamically during the lapping process used to manufacture sliders for magnetic storage devices. A wafer quadrant of slider rows is bonded to an extender tool held in a carrier assembly and an actuator is used to laterally apply force to the extender tool such that it changes the profile of the wafer quadrant, and thus the foremost slider row. Multiple arms may be defined in the extender tool, permitting independent engagement with and application of the lateral force by the actuator. Bending moments in each arm are then efficiently and controllably transferred into a beam in the extender tool which is proximate to the point where the wafer quadrant is bonded.

    摘要翻译: 一种用于在用于制造磁存储装置的滑块的研磨过程之前和动态地控制行失真量的方法和装置。 滑块列的晶片象限被结合到保持在载体组件中的延伸器工具上,并且致动器用于向延伸器工具横向施加力,使得其改变晶片象限的轮廓,并因此改变最前面的滑块排。 可以在扩展器工具中限定多个臂,从而允许与致动器的侧向力的独立接合和施加。 然后将每个臂中的弯曲力矩有效地和可控制地转移到靠近晶片象限结合的点的扩展器工具中的梁中。