-
公开(公告)号：US5531017A
公开(公告)日：1996-07-02
申请号：US579466
申请日：1995-12-27
CPC分类号： G11B5/3163 , G11B5/3103 , G11B5/3166 , Y10T29/49041 , Y10T29/4905
摘要： A novel thin film magnetic head fabrication process is provided for fabricating a plurality of thin film magnetic head elements. The process begins with the selection of an appropriate wafer substrate of suitable size and quality. At least two primary sub-areas of the wafer substrate are designated as work areas for the deposition of magnetic recording transducer elements. The work areas have first and second end portions and are arranged in mutually adjacent relation along a shared boundary zone that extends in a first direction through the wafer substrate between the first and second end portions. The wafer substrate is populated with plural rows of magnetic recording transducer elements in the designated work areas such that the plural rows extend in a second direction that is substantially perpendicular to the first direction. The work areas are separated from the wafer substrate and magnetic transducer slider elements are fabricated from the plural rows of magnetic recording transducer elements. The process steps are such that they reduce the number of fabrication steps to a minimum while increasing the consistency of throat and stripe heights.
摘要翻译： 提供了用于制造多个薄膜磁头元件的新型薄膜磁头制造工艺。 该过程开始于选择适当尺寸和质量的合适的晶片衬底。 晶片衬底的至少两个主要子区域被指定为用于沉积磁记录换能器元件的工作区域。 工作区具有第一和第二端部，并且沿着沿第一方向延伸穿过第一和第二端部之间的晶片衬底的共享边界区布置成相互相邻的关系。 晶片基板在指定的工作区域中填充有多行磁记录换能器元件，使得多行在基本上垂直于第一方向的第二方向上延伸。 工作区域与晶片基板分离，并且磁性换能器滑块元件由多行磁记录换能器元件制成。 工艺步骤使得它们将制造步骤的数量减少到最小，同时增加了喉部和条纹高度的一致性。
-
公开(公告)号：US4914868A
公开(公告)日：1990-04-10
申请号：US250685
申请日：1988-09-28
申请人： Mark A. Church , Annayya P. Deshpande , Alain M. Desouches , George S. Pal , Michael P. Salo , Muhammad I. Ullah
发明人： Mark A. Church , Annayya P. Deshpande , Alain M. Desouches , George S. Pal , Michael P. Salo , Muhammad I. Ullah
CPC分类号： G11B5/3903 , B23Q17/22 , Y10T29/49036 , Y10T29/49048
摘要： A lapping control system for a row of thin film magnetic transducers formed on a substrate. Each of the magnetic transducers comprises a magnetoresistive (MR) element, and the row is supported on a holder which has an elongated H-shaped slot near one edge to form a beam member upon which the row is mounted. The beam member is capable of being deflected in a substantially quadratic curvature when subjected to pressure from a pressure transducer at the middle of the beam member. The resistance of each of the MR elements is measured during lapping, and a control signal is generated to control the pressure transducers to control lapping with proper BALANCE and BOW and to terminate lapping when the desired MR element height is reached.
-
公开(公告)号：US07492552B2
公开(公告)日：2009-02-17
申请号：US11833973
申请日：2007-08-04
申请人： Annayya P. Deshpande , Hoodin Hamidi , Icko E. Iben , Kevin Thuy Luong , Sassan K. Shahidi , Abel J. Taina
发明人： Annayya P. Deshpande , Hoodin Hamidi , Icko E. Iben , Kevin Thuy Luong , Sassan K. Shahidi , Abel J. Taina
IPC分类号： G11B5/127
CPC分类号： G11B5/105 , G11B5/00821 , G11B5/60 , G11B15/62
摘要： A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.
摘要翻译： 具有复合空气轴承表面的磁头读/写模块，以及用于将芯片嵌入基板以形成复合空气轴承表面的方法和装置。 模块的示例包括具有空气轴承表面，前部，后部和芯片接收槽的基板。 衬底的空气轴承表面具有邻接芯片接收槽的第一侧的第一部分和与芯片接收槽的第二侧相邻的第二部分。 该模块还包括具有空气轴承表面，底面，前部，后部和有源元件的芯片。 有源元件靠近芯片的前部。 芯片位于基板中的芯片接收槽中，芯片的空气轴承表面基本上与基板的空气轴承表面对准。
-
4.发明授权
公开(公告)号：US5266769A
公开(公告)日：1993-11-30
申请号：US841934
申请日：1992-02-25
CPC分类号： G11B5/6005
摘要： A method for making a magnetic head slider comprising the steps of lapping the slider to form an air bearing surface, producing a chosen pattern of rails on the air bearing surface, and producing a chosen pattern of stress on the back side of the slider to remove the distortion produced in the slider by the lapping and rail formation steps. The stress pattern can be chosen to produce any desired range of crown and camber for the slider.
-
公开(公告)号：US20080218904A1
公开(公告)日：2008-09-11
申请号：US12106983
申请日：2008-04-21
IPC分类号： G11B15/60
CPC分类号： B28D5/022
摘要： An electronic component, comprising: a portion of a row cut from a wafer; and a closure coupled to the portion of the row of the wafer towards a first edge of the portion of the row of the wafer; the portion of the row of the wafer having a bonding area positioned adjacent a second edge of the portion of the row of the wafer, the second edge of the portion of the row of the wafer being positioned opposite the first edge of the portion of the row of the wafer and along a same side thereof, wherein the bonding area includes a layer of adhesive thereon.
摘要翻译： 一种电子部件，包括：从晶片切割的一部分行; 以及封闭件，其与所述晶片的所述行的所述部分朝向所述晶片行的所述部分的第一边缘耦合; 晶片行的部分具有邻近晶片的行的该部分的第二边缘定位的结合区域，该晶片的行的该部分的第二边缘与该部分的该部分的第一边缘相对定位 并且沿其同一侧，其中结合区域包括其上的粘合剂层。
-
6.发明授权Thin-film tape head having single groove formed in head body and corresponding process 失效薄膜磁带头在头体中形成单槽，并具有相应的工艺公开(公告)号：US07161764B2
公开(公告)日：2007-01-09
申请号：US09938458
申请日：2001-08-23
申请人： Robert G. Biskeborn , Annayya P. Deshpande , Calvin S. Lo , Kevin T. Luong , Abel J. Taina , Artemio-Juan Torres
发明人： Robert G. Biskeborn , Annayya P. Deshpande , Calvin S. Lo , Kevin T. Luong , Abel J. Taina , Artemio-Juan Torres
CPC分类号： G11B5/3173 , G11B5/1871 , G11B5/3103 , G11B5/3116 , G11B5/3163 , G11B5/584 , G11B5/588 , Y10T29/49021 , Y10T29/49032 , Y10T29/49044 , Y10T29/53165
摘要： A magnetic head according to another embodiment includes a head body including a top face, a bottom face, a pair of elongated side faces, and a pair of short end faces; at least one transducer formed in communication with the top face of the head body; and a single groove formed in the top face of the head body and extending between the transducers and one of the side faces of the head body. A method for manufacturing a magnetic head is also presented.
摘要翻译： 根据另一实施例的磁头包括：头本体，包括顶面，底面，一对细长侧面和一对短端面; 至少一个与所述头体的顶面连通的换能器; 以及形成在头本体的顶面中并在换能器与头本体的一个侧面之间延伸的单个槽。 还提出了一种用于制造磁头的方法。
-
公开(公告)号：US07446974B2
公开(公告)日：2008-11-04
申请号：US11036148
申请日：2005-01-14
IPC分类号： G11B5/147
CPC分类号： B28D5/022
摘要： An electronic component according to one embodiment comprises a portion of a row cut from a wafer; and a closure coupled to the portion of the row of the wafer towards a first edge of the portion of the row of the wafer; the portion of the row of the wafer having a bonding area positioned adjacent a second edge of the portion of the row of the wafer, the second edge of the portion of the row of the wafer being positioned opposite the first edge of the portion of the row of the wafer and along a same side thereof, wherein the bonding area includes a layer of adhesive thereon, wherein the adhesive coupled to the bonding area is spaced from the closure. Additional systems and methods are also presented.
摘要翻译： 根据一个实施例的电子部件包括从晶片切割的行的一部分; 以及封闭件，其与所述晶片的所述行的所述部分朝向所述晶片行的所述部分的第一边缘耦合; 晶片行的部分具有邻近晶片的行的该部分的第二边缘定位的结合区域，该晶片的行的该部分的第二边缘与该部分的该部分的第一边缘相对定位 并且沿其同一侧，其中结合区域包括其上的粘合剂层，其中耦合到接合区域的粘合剂与封闭件间隔开。 还介绍了其他系统和方法。
-
公开(公告)号：US07274536B2
公开(公告)日：2007-09-25
申请号：US11449443
申请日：2006-06-07
申请人： Annayya P. Deshpande , Hoodin Hamidi , Icko E. Iben , Kevin Thuy Luong , Sassan K. Shahidi , Abel J. Taina
发明人： Annayya P. Deshpande , Hoodin Hamidi , Icko E. Iben , Kevin Thuy Luong , Sassan K. Shahidi , Abel J. Taina
IPC分类号： G11B5/127
CPC分类号： G11B5/105 , G11B5/00821 , G11B5/60 , G11B15/62
摘要： A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.
摘要翻译： 具有复合空气轴承表面的磁头读/写模块，以及用于将芯片嵌入基板以形成复合空气轴承表面的方法和装置。 模块的示例包括具有空气轴承表面，前部，后部和芯片接收槽的基板。 衬底的空气轴承表面具有邻接芯片接收槽的第一侧的第一部分和与芯片接收槽的第二侧相邻的第二部分。 该模块还包括具有空气轴承表面，底面，前部，后部和有源元件的芯片。 有源元件靠近芯片的前部。 芯片位于基板中的芯片接收槽中，芯片的空气轴承表面基本上与基板的空气轴承表面对准。
-
公开(公告)号：US08111480B2
公开(公告)日：2012-02-07
申请号：US12106983
申请日：2008-04-21
IPC分类号： G11B15/60
CPC分类号： B28D5/022
摘要： An electronic component, comprising: a portion of a row cut from a wafer; and a closure coupled to the portion of the row of the wafer towards a first edge of the portion of the row of the wafer; the portion of the row of the wafer having a bonding area positioned adjacent a second edge of the portion of the row of the wafer, the second edge of the portion of the row of the wafer being positioned opposite the first edge of the portion of the row of the wafer and along a same side thereof, wherein the bonding area includes a layer of adhesive thereon.
摘要翻译： 一种电子部件，包括：从晶片切割的一部分行; 以及封闭件，其与所述晶片的所述行的所述部分朝向所述晶片行的所述部分的第一边缘相耦合; 晶片行的部分具有邻近晶片的行的该部分的第二边缘定位的结合区域，该晶片的行的该部分的第二边缘与该部分的该部分的第一边缘相对定位 并且沿其同一侧，其中结合区域包括其上的粘合剂层。
-
公开(公告)号：US06863061B2
公开(公告)日：2005-03-08
申请号：US10346033
申请日：2003-01-15
CPC分类号： B28D5/022
摘要： A method and mechanism for slicing a thin film wafer. A closure is bonded to a section of a thin film wafer. A blade is used to slice a row from the section of the wafer by cutting through the closure and thin film wafer such that opposite sides of the blade engage an equal surface area of the closure.
摘要翻译： 一种用于切片薄膜晶片的方法和机构。 封闭件结合到薄膜晶片的一部分。 刀片用于通过切割封盖和薄膜晶片从晶片的部分切片一排，使得叶片的相对侧面接合封闭件的相等表面积。
-
-
-
-
-
-
-
-
-
搜索结果
12 条记录 (耗时 0.017 秒)